IEDM Set to Stage FinFET vs. FDSOI News & Analysis 9/27/2013 28 comments The leading-edge of semiconductor technology becomes more complex, and IEDM is there to bear witness -- and stage FinFET versus FDSOI, the battle for sub-20nm semiconductors.
Freescale, Micron Extend Memory Research News & Analysis 9/24/2013 2 comments Freescale Semiconductor and Micron Technology have extended separate memory research partnerships in attempts to add to their capabilities at the leading-edge of chip production and find technology that can scale beyond the limits of NAND flash memory.
Superconducting Quantum Computer Beckons News & Analysis 9/20/2013 11 comments Lawrence Berkeley National Laboratory (Berkeley Lab) has reported the first demonstration of high-temperature superconductivity in the surface of a topological insulator--a promising material for quantum computers whose bulk properties are that of an insulator, but whose surface is a conductor.
True White LEDs on the Horizon News & Analysis 9/17/2013 12 comments Physicist Z. Valy Vardeny and his colleagues at the University of Utah inserted platinum atoms into an organic semiconductor to tune its light emission to different colors in the quest for emitting truly white light to replace future light bulbs.
Plastic Memory Firm Plans Pilot Line News & Analysis 9/17/2013 5 comments Thin Film, a developer of organic ferroelectric nonvolatile memory technology, has ordered equipment for a pilot production line in Linkoping, Sweden, and announced a plan to raise about US$23 million via the sale of shares.
Chinese Memory Firm Pursues NVM Research News & Analysis 9/10/2013 7 comments A memory-chip company based in Beijing, China, has formed a consortium with the Institute of Microelectronics of Tsinghua University (IMETU) to undertake research into non-volatile memory.
TSMC's Sales Stay Strong in August News & Analysis 9/10/2013 2 comments August did not dampen sales progress at leading foundry TSMC, where the year-to-date sales figure is running 19 percent ahead of the equivalent figure in 2012.
Quantum MIIM Diodes Beat Silicon News & Analysis 9/6/2013 14 comments Oregon State University (OSU) claims to have boosted the performance of metal-insulator-metal (MIM) diodes by adding a second insulator layer to yield MIIM diodes with superior quantum tunnel for faster speeds than silicon.
Fab Fire Causes DRAM Price Surge News & Analysis 9/6/2013 16 comments A fire at a wafer fab belonging to SK Hynix in Wuxi, China, is likely to push up the price of DRAMs used in personal computers and smartphones in the second half of 2013.
AMS Builds 3D Chip-Stacking Line News & Analysis 9/5/2013 2 comments Analog and sensor IC company AMS has invested more than about $33 million to create production capacity for analog 3D ICs at its wafer fab in Austria.
Chip Market Growth Strengthens in July News & Analysis 9/4/2013 8 comments Global chip sales for July were up 5 percent on the same period in 2012, with a US boom more than compensating for a declining Japanese market. However, Japan showed strong growth compared with the previous quarter.
Indian Startup Uses Imagination for Wearable SoC News & Analysis 9/2/2013 14 comments An Indian startup chaired by Sanjay Jha, previously CEO and chairman of Motorola Mobility, has announced it has licensed graphics and MIPS processor cores from Imagination for use in its upcoming wearable processing unit (WPU) chip.
Battle-hardened veterans of the electronics industry have heard of the “connected car” so often that they assume it’s a done deal. But do we really know what it takes to get a car connected and what its future entails? Join EE Times editor Junko Yoshida as she moderates a panel of movers and shakers in the connected car business. Executives from Cisco, Siemens and NXP will share ideas, plans and hopes for connected cars and their future. After the first 30 minutes of the radio show, our listeners will have the opportunity to ask questions via live online chat.