New LED driver reduces size and cost of lighting products Product News 1/19/2010 Post a comment Diodes Incorporated has introduced a 1 Amp rated linear mode constant current LED driver specifically designed to reduce the size and cost of a range of general illumination products, including flashlights and lighting in emergency, garden, and poolside applications.
AMD jumps into fabless chip company ranking News & Analysis 1/19/2010 Post a comment Only seven fabless chip companies out of the top 25 managed to grow their revenue in 2009, according to market research company IC Insights Inc. (Scottsdale, Ariz.). However, Advanced Micro Devices Inc. (Sunnyvale, Calif.) jumped into the rankings at number two, courtesy of its divestment of its manufacturing to GlobalFoundries.
Memory to boost market growth, says analyst News & Analysis 1/19/2010 Post a comment The flash memory, DRAM and optoelectronics (LEDs) sectors will fare best in 2010 as worldwide semiconductor revenue advances 15 percent to $257 billion, according to market research firm Databeans Inc. (Reno, Nevada).
Inphi claims first ever OIF-compliant 100G coherent TIA News & Analysis 1/16/2010 Post a comment High-speed analog semiconductor company, Inphi Corporation, (West Lake Village, California, USA) plans to unveil what the company claims is the industry's first OIF-compliant 100G coherent transimpedance amplifier (TIA) and highest sensitivity 40G linear TIA at the upcoming Fiber Optics Expo (FOE).
Challenges in automotive radio design Design How-To 1/15/2010 2 comments In terms of in-car features, customer expectations are driving the integration of more electronic devices. In addition, new technologies and automotive operational requirements create severe design challenges for suppliers.
Nokia leads Greenpeace electronics ranking News & Analysis 1/14/2010 1 comment Environmental lobby organization Greenpeace International (Amsterdam, The Netherlands) has kept Nokia at the top of its Greener Electronics Guide as it moved into its fourteenth edition.
TSMC to recruit 3,000 engineers, says report News & Analysis 1/14/2010 Post a comment Foundry chipmaker Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan) said Thursday (Jan. 14) that it planned to recruit more than 3,000 employees to help it expand manufacturing capacity, according to a Reuters report.
Vinyl vs. CD myths refuse to die Audio DesignLine Blog 1/13/2010 58 comments I still get emails from non-technical vinyl LP fans who insist that the legacy format is technically superior to CD/digital, and one Web site in particular is partly to blame.
Sidense gains design win in Audium audio amp News & Analysis 1/13/2010 Post a comment Sidense Corp. (Ottawa, Canada), a develop of antifuse-based non-volatile memory, has announced that its one-time programmable (OTP) technology was included in Audium's recently announced high efficiency AS1001 audio power amplifier chip.
Automotive IC market expected to grow 16% in 2010 News & Analysis 1/12/2010 Post a comment The global market for automotive semiconductor chips will rise 16 percent in 2010 to reach $18.4 billion, according to market research company Semicast Research Ltd. (Waterlooville, England), recovering almost all of the ground lost in 2009.
Analog ASICs show flattish CAGR, says Gartner News & Analysis 1/11/2010 Post a comment Revenue for application-specific analog integrated circuits (ICs) totaled $28.1 billion in 2008 and will reach $32.2 billion in 2013, according to a new report from Gartner. This corresponds to a CAGR of about 2.75 percent.
Plus Semi relaunches as Plessey Semiconductors News & Analysis 1/11/2010 Post a comment Management teams from Plus Semi in Swindon, England, and the former X-Fab facility in Plymouth, England, have relaunched as Plessey Semiconductors. The company intends to launch its own range of analog and mixed-signal semiconductor products although it is offering foundry services initially.
UMC set to increase capacity, says report News & Analysis 1/11/2010 Post a comment Foundry chipmaker United Microelectronics Corp. (UMC) is expected to install equipment in Fab 12b, a 300-mm wafer fab at the Southern Taiwan Science Park soon, and take over a similar factory from ProMOS Technologies Corp., according to a local report.