Chipmakers 2011 capabilities ranked News & Analysis 1/24/2011 4 comments There will be three foundry sources of leading-edge semiconductor technology by the end of 2011: Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC), GlobalFoundries Inc. and Samsung Electronics Co. Ltd., with possible addition of Intel, according to new research from IHS iSuppli.
Top ten OEMs buy 34% of chips, says Gartner News & Analysis 1/21/2011 7 comments The top ten OEMs, led by Hewlett Packard, were responsible for $104.3 billion of semiconductor chip purchases in 2010, or 34.7 percent of the market, according to market research company Gartner Inc.
Plastic Logic to get $700 million in Russian deal News & Analysis 1/18/2011 8 comments Plastic Logic, a struggling venture capital backed company, which specializes in organic electronics, is set to receive $700 million in deal backed by Rusnano, the technology investment arm of the Russian state.
Software defined radio: defining the challenges Design How-To 1/18/2011 10 comments Software defined radio (SDR) has become a hot topic in the industry and is seen as a solution for many of the development problems for new radio platforms. But what is really meant by software defined radio?
Introduction to adaptive arrays, Part 2 of 2 Design How-To 1/16/2011 Post a comment SciTech publishing has recently released a new book, Introduction to Adaptive Arrays, 2nd Edition, by Robert A. Monzingo, Randy Haupt, Thomas W. Miller, which addresses the subject of adaptive array sensor systems.
NXP offers $25,000 prize for RF design News & Analysis 1/10/2011 5 comments NXP Semiconductors NV is inviting RF engineers and students worldwide to submit creative application ideas for RF power components. It has opened registration for a competition with prizes worth $25,000.
BCD aims IPO to raise $86 million News & Analysis 1/6/2011 1 comment Chinese analog IC provider BCD Semiconductor Manufacturing Ltd. has filed for an initial public offering of American Depository Share (ADSs) on Nasdaq to raise $86.25 million.
Wolfson licenses TinyCore DSP from Oxford News & Analysis 1/5/2011 2 comments Mixed-signal fabless chip company Wolfson Microelectronics plc has announced a licensing agreement with audio processing specialist Oxford Digital Ltd. whereby it can use the TinyCore digital signal processor core in a selection of audio hub products.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.