TSMC returns fire over 28-nm process issues News & Analysis 1/26/2012 5 comments Maria Marced, a senior executive with foundry Taiwan Semiconductor Manufacturing Co. Ltd., has hit back at analysts who have said it has yield problems with its 28-nm CMOS manufacturing processes.
MOST150 points to technology tipping point Design How-To 1/24/2012 Post a comment Carefully balancing technological possibilities, real market requirements, and economic considerations, it is important to show a clear cost-down technological roadmap. But several aspects need to be addressed, including data transport capacity (bitrate), physical media, and topology options.
Semtech to buy Gennum for $494 million News & Analysis 1/24/2012 1 comment Analog and mixed-signal semiconductor vendor Semtech said it entered into a definitive agreement to acquire fellow analog and mixed-signal chip supplier Gennum in a cash deal worth about $494 million.
Texas Instruments shows off Pico HD projector News & Analysis 1/21/2012 11 comments At CES, Texas Instruments was keeping its eye on the big picture, through its littlest chipsets. The firm was literally beaming as it showed off its latest generation of DLP projector chipset, the Pico HD, capable of HD WXGA resolution projections from up to 100 inches away.
Allegro Microsystems A1357 sensor IC Product News 1/19/2012 1 comment Allegro MicroSystems has introduced a customer programmable linear hall-effect sensor IC that features a pulse width modulated two-wire output and supports a temp range from 40°C to 150°C.
Leverage Ethernet to improve passenger safety, comfort, and convenience Design How-To 1/19/2012 4 comments As homes become more digitally sophisticated, consumers are developing higher expectations for connectivity and greater levels of safety and comfort in their home away from home—their vehicle. As a result, in-vehicle electronics are growing in number and complexity. Collision warning, comfort controls, infotainment, and advanced driver assistance are just some of today’s sophisticated and diverse applications generating an increasing need for bandwidth and connectivity within and between in-vehi
MIPI Alliance offers new specs for RF control Blog 1/17/2012 5 comments Today, the MIPI Alliance announced new DigRF and RFFE specifications, and yesterday, I had the opportunity to speak with Jim Ross, of Skyworks, and Dr. Dietmar Wenzel, of Infineon about the changes. Both men are part of the MIPI Alliance.
The Fast Track to 3D-IC Testing Design How-To 1/16/2012 2 comments Despite substantial progress toward realizing 3D-IC systems, a variety of design, manufacturing, packaging, and testing issues still need to be addressed...
TI researcher gets innovation award News & Analysis 1/14/2012 3 comments Ted Moise, manager of Texas Instruments' non-volatile memory roadmap, received the 2012 Edith and Peter O’Donnell Award from The Academy of Medicine, Engineering and Science of Texas during the organization's annual conference.
RF Micro warns of sales shortfall News & Analysis 1/5/2012 Post a comment Radio frequency IC vendor RF Micro Devices warned that its sales for the quarter ended Dec. 31 fell short of expectations due lower-than-expected sales of 2G components to China-based customers for entry-level handsets.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.