TI claims its chips are in 45% of ADSL equipment News & Analysis 10/31/2000 Post a comment DALLAS -- Texas Instruments Inc. today predicted that its analog line driver shipments this year enable eight million asymmetrical digital subscriber line (ADSL) ports to deployed in the field in 2000. That total is 25 times greater than TI's shipments in 1999, according to the Dallas company.
TI invests in U.K.-based RadioScape, plans DSPs for digital radio News & Analysis 10/27/2000 Post a comment LONDON -- Texas Instruments Inc. today announced plans to develop digital baseband chip solutions using its digital signal processor (DSP) technology and software from RadioScape Ltd., a London startup. TI also said it has invested an undisclosed amount of money in four-year-old RadioScape, which is focused on software for the Eureka-147 digital radio standard for consumer products.
Microchip to acquire TelCom for $300 million in stock News & Analysis 10/27/2000 Post a comment CHANDLER, Ariz.-- In a move to quickly expand its analog portfolio for microcontroller customers, Microchip Technology Inc. here today announced plans to acquire TelCom Semiconductor Inc. of Mountain View, Calif., for $300 million in stock.
Integrated A/D converters increase the resolution of 8-bit microcontrollers News & Analysis 10/26/2000 Post a comment Many of today's typical analog signal-processing systems are built around a microcontroller with integrated A/D converter. However, the maximum amplitude of the analog signals to be processed is often not large enough to utilize the full dynamic range of the integrated converter, so designers typically use external operational amplifiers to amplify those signals.
NEC reverses last year's loss with $190 million profit News & Analysis 10/26/2000 Post a comment TOKYO -- NEC Corp. today reported net income of $190 million (20.5 billion yen) for the six months ended Sept. 30, compared to a $457 million loss for the same period a year ago. Sales for the first fiscal half totaled $22.9 billion (2.48 trillion yen), compared to $21.2 billion for the similar 1999 period.
The Japanese electronics giant said it was on target to reach its projected net income of $1.85 billion by March 31, 2003. The sales goal for the fiscal year ending March 31, 2003 is $62 bil
LSI Logic's Q3 sales up 35%; bullish about Q4 News & Analysis 10/24/2000 Post a comment MILPITAS, Calif. -- Citing strong demand for its communication chip products, LSI Logic Corp. here today beat the street by reporting sales of $728 million for its third quarter ended Sept. 30, a 35% jump over the $540 million posted in the like period a year ago.
Net income before amortization of goodwill and other special items was $114 million, or $0.33 per diluted share, compared to $55 million, or $0.17 per diluted share, a year ago. Analysts estimated that the company would report earnin
Linear's 1Q sales grows 57% News & Analysis 10/17/2000 Post a comment MILPITAS, Calif. - Analog-chip maker Linear Technology Corp. here today reported sales of $232.1 million in its first fiscal quarter ended Oct. 1, an increase of 57% over the $147.5 million figure posted in the like period a year ago.
The company also reported a net of $102.2 million, or $0.31 a share, in the quarter, an increase of 75% over $58.5 million, or $0.18 a share, posted in the year ago period.
Tality, Sirius collaborate on 3G handset designs News & Analysis 10/17/2000 Post a comment SAN JOSE, Calif.-- Tality Corp., a design subsidiary of Cadence Design Systems Inc., here today announced plans to co-develop third-generation (3G) handsets and other products with intellectual-property (IP) core supplier Sirius Communications NV.
Under the agreement, Tality will incorporate Sirius' line of baseband chip cores into its 3G design services. The two companies aim to accelerate the design cycle for 3G wireless multimedia information devices, such as smart phones, PDAs, and other pr
National adds 'virtual prototyping' to Web-based tools News & Analysis 10/17/2000 Post a comment SANTA CLARA, Calif. -- National Semiconductor Corp. this week is expanding its online engineering workbench to include a phase-locked loop (PLL) simulator, an enhanced power simulation tool, and a one-of-a-kind thermal analysis system for evaluating board designs with "virtual prototyping" capabilities. National said the enhanced Webench 2.0 system will not only speed development of products by chip customers, but it w
Vigilance applied early verifies chips News & Analysis 10/16/2000 Post a comment Deep-submicron processes mean that more gates and therefore more functionality can reside on a single die. But verifying those functions and ensuring that silicon is adequately tested is no trivial matter.
Deep signal integrity can be assured News & Analysis 10/16/2000 Post a comment These days, there is a lot of noise about signal integrity and design integrity in deep-submicron system-on-chip designs. And there is a good reason: Shrinking processes and higher frequencies mean even second-order physical effects can create problems.
Physics dictates priority: design-for-test News & Analysis 10/16/2000 Post a comment The bedrock problem of testing and verifying complex systems-on-chip-the subject of this week's Focus section on deep-submicron design-is colliding with the basic physical limits long predicted for CMOS technology.
UMC, Virtual Silicon ink IP deal in 0.13-micron space News & Analysis 10/16/2000 Post a comment SUNNYVALE, Calif. - In a move to beef up its new 0.13-micron process technology offerings for foundry customers, Taiwan's United Microelectronics Corp. here today announced a deal with Virtual Silicon Technology Inc., a supplier of intellectual-property (IP) cores for the semiconductor industry.
Under the terms, Virtual Silicon will make available its eSilicon family of embedded-component libraries in UMC's 0.13-micron process technology. Dubbed WorldLogic, UMC's 0.13-micron process technology
TI's Burr-Brown A-to-D converter handles 500-kHz sampling News & Analysis 10/13/2000 Post a comment TUCSON, Ariz.--Texas Instruments Inc.'s Burr-Brown operation today said it was introducing the industry's fastest six-channel, simultaneous-sampling analog-to-digital converter. The new ADC chip operates at a 500-kilohertz sampling rate and is designed for motor control and power monitoring applications.
TI, Troy develop cell-phone wireless printing with Bluetooth chips News & Analysis 10/13/2000 Post a comment DALLAS -- Texas Instruments Inc. here said it is collaborating with a subsidiary of Troy Group Inc. to enable wireless printing from cellular phones using Bluetooth technology. The capability will use TI's recently introduced Bluetooth chip set, which is fabricated in 0.18-micron process technology and claimed to be the first semiconductor solution to fully integrate software for the wireless standard in ROM (see Sept. 19 story).
Pixelworks, Analog Devices target single-chip LCD solution News & Analysis 10/12/2000 Post a comment TUALATIN, Ore.--Pixelworks Inc. here and Analog Devices Inc. today announced they will work together to combine ADI's analog and digital receiver technology with Pixelworks' ImageProcessor ICs for a single-chip solution serving high-performance dual-interface displays. The partnership aims to create a one-chip solution for all of the functions needed to operate a liquid-crystal display (LCD) monitor.
Demand for power engineers shows no signs of slowing News & Analysis 10/12/2000 Post a comment The demand for power engineers is showing no signs of running out of juice. "Business is tremendous. We can't supply good-quality power electrical engineers fast enough," said Richard Cardarella, president of Power Technology Associates, a recruiting firm in Sharon, Mass.
Microtune enters BiCMOS foundry pact with Germany's X-Fab News & Analysis 10/12/2000 Post a comment PLANO, Tex. --Dallas area startup Microtune Inc. here today announced a manufacturing agreement with Germany's X-FAB Semiconductor Foundries Group, which will provide BiCMOS processes for advanced radio-frequency ICs beginning in early 2001. Under the pact, Microtune will use X-Fab's new 0.6-micron double-poly, double-metal BiCMOS technology for analog and mixed-signal chips, which are being aimed at RF broadband communications. Terms of the new foundry agreement were not released.
Infineon applies new SiGe BiCMOS process to 10-GHz PLL News & Analysis 10/11/2000 Post a comment MUNICH -- Infineon Technologies AG today introduced its silicon-germanium BiCMOS technology to support high-speed, low-power IC designs for next-generation mobile communications. The Munich-based chipmaker also said it has implemented a 10-GHz phase-locked-loop (PLL) circuit using the B7HFc process.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.