Analysis: Why Renesas is creating mobile IC spinoff News & Analysis 10/31/2010 5 comments Renesas Electronics' decision to spin out its mobile semiconductor products into a separate subsidiary is motivated not only by the differences between the markets for microcontrollers and baseband chips, but also to help protect Renesas' power amplifier business.
USB - the car-consumer connection Design How-To 10/29/2010 3 comments In automotive environments, USB interface technology is about to conquer the pole position among competitive technologies. At chip level, the supporting infrastructure is already available.
Analog chip vendors post profits News & Analysis 10/28/2010 5 comments Analog chip vendors Maxim Integrated Products, Alpha and Omega Semiconductor and MaxLinear reported profits for their most recently concluded quarters
Design implications of Energy Efficient Ethernet (EEE) Design How-To 10/28/2010 Post a comment
On September 30th, the IEEE ratified IEEE Std. 802.3az-2010, specifying the technology and requirements for the development of Energy Efficient Ethernet (EEE) components and systems. This paper outlines the basic premise and features of the amendment and how it can impact your next design.
ARM TechCon Teardown Smackdown: Dell Streak vs. The Archos 7 Blog 10/26/2010 11 comments The promo for this ARM TechCon event is actually a bit misleading: “Which tablet PC will come out on top? Watch as EE Times Editors Brian Fuller and Patrick Mannion dissect the inner workings of the devices and explore which is the strongest contender, based on speed, power consumption, display, features and functionality.”
Xtrinsic sensors trigger satellite airbags News & Analysis 10/19/2010 2 comments Claiming to shrink the size, increase the reliability and lower the cost of satellite airbag sensors, Freescale Semiconductor unveiled smart Xtrinsic airbag accelerometers at the Convergence 2010 automotive tradeshow in Detroit.
Diodes’ ZXLD1374 LED driver Product News 10/19/2010 Post a comment Diodes Inc.’s new multi-topology LED driver, the ZXLD1374, is designed to increase the performance of high brightness automotive, industrial and commercial lighting systems.
AMI models: What, why and how? Design How-To 10/18/2010 Post a comment IBIS AMI specifications are released by the IBIS committee. The specifications define the interface between EDA tools and an AMI model but the IBIS AMI model generation remains a challenge to many IC vendors. This paper discusses IBIS AMI generation flow by taking a simple example of a PCI Express transmitter.
Renesas execs singing from the same song book Semi Conscious 10/15/2010 5 comments Renesas Electronics executives mostly stick to the script when talking about the merger with NEC. But behind the corporate speak there appears to be genuine enthusiasm for the new No.3 chip vendor.
Lfoundry to help build Malaysian wafer fab News & Analysis 10/15/2010 16 comments Landshut Silicon Foundry GmbH has signed an agreement with QT Hightech Malaysia Sdn Bhd to help build a 200-mm wafer fab in the Kulim High-tech Park in Malaysia, according to local reports.
TI buys former SMIC fab in Chengdu News & Analysis 10/15/2010 17 comments Texas Instruments acquired a 200-mm wafer fab in China which was previously operated by Chinese foundry SMIC. Financial terms of the deal were not disclosed.
Fairchild profits on steady sales in Q3 News & Analysis 10/14/2010 3 comments Analog and power IC vendor Fairchild Semiconductor International Inc. saw profits slide sequentially on sales revenue up 1 percent in the third quarter but its net profit beat analysts' expectations while its quarterly revenue was slightly lower than the consensus.
Renesas readies mixed-signal MCUs News & Analysis 10/14/2010 15 comments Renesas Electronics is likely to introduce its first mixed-signal microcontrollers within the next two years, according to top executive Yasushi Akao.
VC, M&A activity dipped in Q3, says GSA News & Analysis 10/13/2010 Post a comment The value venture capital deals and number of mergers and acquisitions involving semiconductor companies all dipped in the third quarter of 2010, according to the Global Semiconductor Alliance.
Silicon Labs buys Irish sensor startup News & Analysis 10/12/2010 20 comments Silicon Laboratories Inc. has acquired ChipSensors Ltd., a developer of a dielectric-as-sensor technology designed to detect temperature, humidity and gases. The amount paid was not disclosed.
Exec: Microsemi to support all Actel products News & Analysis 10/6/2010 27 comments Microsemi has no intention of killing off any Actel product lines following the anticipated close of the $430 million tender offer the company made for Actel earlier this week, according to a Microsemi executive.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.