Lucent spin-out SynChip shrinks GPS receiver with chip-scale technology News & Analysis 11/6/2000 Post a comment WARREN, N.J. ( ChipWire) -- A company spun off from Lucent New Ventures is using chip-scale integration technology developed at Bell Labs to deliver what it claims is the smallest complete receiver for the global positioning system (GPS) standard to date. SyChip here said it has packed the SiRFstarII GPS receiver IC from SiRF Technology of San Jose into an 11 x 14 x 3.5-mm module that includes a 12-channel RF section, baseband and memory.
Sumitomo plans U.S. wafer-making plant for GaAs, InP substrates News & Analysis 11/2/2000 Post a comment HILLSBORO, Ore.-- Japan's Sumitomo Electric Industries Ltd. today announced plans to produce compound-material semiconductor wafers, starting with 150-mm gallium-arsenide (GaAs) substrates, at a facility here. A second-phase expansion to the new facility will add large-diameter indium phosphide (InP) wafers to the output, said Sumitomo.
In conjunction with unveiling of EE Times’ Silicon 60 list, journalist & Silicon 60 researcher Peter Clarke hosts a conversation on startups in the electronics industry. One of Silicon Valley's great contributions to the world has been the demonstration of how the application of entrepreneurship and venture capital to electronics and semiconductor hardware can create wealth with developments in semiconductors, displays, design automation, MEMS and across the breadth of hardware developments. But in recent years concerns have been raised that traditional venture capital has turned its back on hardware-related startups in favor of software and Internet applications and services. Panelists from incubators join Peter Clarke in debate.