Lucent spin-out SynChip shrinks GPS receiver with chip-scale technology News & Analysis 11/6/2000 Post a comment WARREN, N.J. ( ChipWire) -- A company spun off from Lucent New Ventures is using chip-scale integration technology developed at Bell Labs to deliver what it claims is the smallest complete receiver for the global positioning system (GPS) standard to date. SyChip here said it has packed the SiRFstarII GPS receiver IC from SiRF Technology of San Jose into an 11 x 14 x 3.5-mm module that includes a 12-channel RF section, baseband and memory.
Sumitomo plans U.S. wafer-making plant for GaAs, InP substrates News & Analysis 11/2/2000 Post a comment HILLSBORO, Ore.-- Japan's Sumitomo Electric Industries Ltd. today announced plans to produce compound-material semiconductor wafers, starting with 150-mm gallium-arsenide (GaAs) substrates, at a facility here. A second-phase expansion to the new facility will add large-diameter indium phosphide (InP) wafers to the output, said Sumitomo.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.