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Content tagged with Analog ICs
posted in November 2000
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Modular DSP covers comm needs
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11/6/2000   Post a comment
ACM augments DSPs for MPEG-4
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11/6/2000   Post a comment
Lucent spin-out SynChip shrinks GPS receiver with chip-scale technology
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11/6/2000   Post a comment
WARREN, N.J. ( ChipWire) -- A company spun off from Lucent New Ventures is using chip-scale integration technology developed at Bell Labs to deliver what it claims is the smallest complete receiver for the global positioning system (GPS) standard to date. SyChip here said it has packed the SiRFstarII GPS receiver IC from SiRF Technology of San Jose into an 11 x 14 x 3.5-mm module that includes a 12-channel RF section, baseband and memory.
Sumitomo plans U.S. wafer-making plant for GaAs, InP substrates
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11/2/2000   Post a comment
HILLSBORO, Ore.-- Japan's Sumitomo Electric Industries Ltd. today announced plans to produce compound-material semiconductor wafers, starting with 150-mm gallium-arsenide (GaAs) substrates, at a facility here. A second-phase expansion to the new facility will add large-diameter indium phosphide (InP) wafers to the output, said Sumitomo.
Executives say SIA is right in forecasting no downturn in next three years
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11/2/2000   Post a comment
SAN JOSE -- Top semiconductor executives here at press conference on Wednesday evening said they were completely comfortable and satisfied with a new industry consensus forecast that shows no real downturn in chip sales during the next three years and only a modest slowdown in revenue growth in the 2002 timeframe.
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What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.

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