Lucent spin-out SynChip shrinks GPS receiver with chip-scale technology
News & Analysis 11/6/2000 Post a comment
WARREN, N.J. ( ChipWire) -- A company spun off from Lucent New Ventures is using chip-scale integration technology developed at Bell Labs to deliver what it claims is the smallest complete receiver for the global positioning system (GPS) standard to date. SyChip here said it has packed the SiRFstarII GPS receiver IC from SiRF Technology of San Jose into an 11 x 14 x 3.5-mm module that includes a 12-channel RF section, baseband and memory.
Sumitomo plans U.S. wafer-making plant for GaAs, InP substrates
News & Analysis 11/2/2000 Post a comment
HILLSBORO, Ore.-- Japan's Sumitomo Electric Industries Ltd. today announced plans to produce compound-material semiconductor wafers, starting with 150-mm gallium-arsenide (GaAs) substrates, at a facility here. A second-phase expansion to the new facility will add large-diameter indium phosphide (InP) wafers to the output, said Sumitomo.