Breaking News
Content tagged with Analog ICs
posted in November 2011
Page 1 / 2   >   >>
Cray to provide supercomputer to Kyoto University
News & Analysis  
11/30/2011   1 comment
Supercomputer maker Cray has been contracted to build a new supercomputer for the Academic Center for Computing and Media Studies at Kyoto University in Kyoto, Japan.
Toshiba to close wafer fabs, slow IC production
News & Analysis  
11/30/2011   5 comments
Toshiba Corp. has announced it plans to close three manufacturing facilities and consolidate much of its discrete, analog and imaging IC production into three others, as part of a response to a fall off in demand for consumer products from the western hemisphere.
Hi-fi digital audio streaming comes of age
Design How-To  
11/29/2011   3 comments
This article examines some of the technology trends supporting high-end digital audio streaming.
Ratiometricity, digital signal correction enable high-res, low-noise smart sensors
Design How-To  
11/29/2011   3 comments
Use of specific analog and digital sensor signal processing concepts enables interference-immune, highly accurate sensor signal measurements. Proper application of concepts, such as ratiometricity or signal conditioning, is paving the way for energy-efficient, high-performance standard solutions.
Magma lets analog get physical
11/29/2011   Post a comment
Magma integrates analog electrical and physical design into a single unified methodology…
Audio converter subsystem design in the 21st century – Part 1: Overview
Design How-To  
11/28/2011   2 comments
Most audio converter subsystems perform below the potential of their chosen data converter. Here, Ian Dennis of Prism Sound examines why that might be, and offers tips on how to achieve optimum audio converter performance.
Making sounds with analogue electronics - Part 3: Envelopes
Design How-To  
11/28/2011   Post a comment
Part 3 of an excerpt from the book "Sound Synthesis and Sampling" discusses envelopes - the overall 'shape' of the volume of a sound, plotted against time.
AES 2011 videos: Audio analyzers, USB audio, DSPs & more
Audio DesignLine Blog  
11/28/2011   1 comment
Here are some short videos from the recent AES show floor, highlighting demos of some audio analyzers, a low-cost USB DSP kit, a TV/radio dialogue enhancement technology, and a "Pro Audio in a Box" platform.
USB audio decoder IC offers versatile audio playback benefits
Product News  
11/26/2011   2 comments
ROHM has developed a USB audio decoder IC that enables audio playback of MP3 files from CD-ROM and USB memory using a single chip, making it ideal for a variety of equipment, including AV receivers, radio players, and stereo component systems.
NXP claims breakthrough Class-AB and Class-D audio amplifiers for start-stop systems
Product News  
11/26/2011   1 comment
NXP Semiconductors N.V. has introduced two new automotive audio amplifiers supporting energy-saving start-stop systems.
New HD audio PC solution offers 5x better audio quality
Product News  
11/26/2011   Post a comment
The new devices claim to offer up to 5x better audio quality than other solutions available in the market today, with a DAC signal-to-noise ratio of 105 dB and true 2 Vrms capless output capability.
Advanced car radio tuner IC family reduces cost and complexity
Product News  
11/26/2011   Post a comment
Silicon Laboratories has introduced the Si476x automotive tuner IC family designed to deliver high RF performance coupled with advanced signal processing while reducing cost and complexity of car radio systems.
Online simulation tool creates flyback power supply circuits in minutes
Product News  
11/26/2011   1 comment
Fairchild Semiconductor has launched an easy to use, powerful online simulation tool that allows designers facing the challenge of designing a flyback circuit for their applications’ power supply to throw the application note away and ‘Auto Design’, optimize or ‘Advance Design’ like a power supply expert.
Plessey EPIC sensor targets movement sensing applications
Product News  
11/26/2011   Post a comment
Plessey Semiconductors has released the latest version of the company's Electric Potential Integrated Circuit (EPIC) sensor optimised for security, switching and gaming applications.
FM background receiver chips enable cost-effective data functions in car radios
Product News  
11/26/2011   Post a comment
Two new FM receiver ICs from NXP enable designers to implement scanning and data functions in car infotainment systems as a background functionality.
High-speed transceiver offers reliable broadband powerline communications in industrial environments
Product News  
11/26/2011   Post a comment
Maxim Integrated Products has introduced the first broadband, HomePlug 1.0-compliant, powerline communications transceiver for harsh industrial environments.
Supercomputing 2011 ultimate slideshow
News & Analysis  
11/26/2011   11 comments
Supercomputing 2011 held at the Washington State Convention Center in Seattle was the 24th conference of its kind devoted to high performance computing, networking, storage and analysis.
Intel rolls new Pentium chips for microservers
News & Analysis  
11/24/2011   12 comments
While Xeon chips are taking the high-end server market by storm, Intel has found a use for its historic Pentium processor in lower-end servers.
Dialog wins sockets in Samsung smartphones
News & Analysis  
11/24/2011   6 comments
Dialog Semiconductor plc has started shipping a power management and audio IC for use by Samsung in Android smartphones, initially targeting the China TD-SCDMA market.
Opinion: AMD roadmap change benefits TSMC?
11/23/2011   13 comments
AMD’s roadmap is about to see some significant changes according to sources at the company.
Intel claims MIC beats GPUs for parallelism
News & Analysis  
11/22/2011   6 comments
While graphics processors, or GPUs, are certainly well known in the world of gaming and advanced graphics, the question of whether they can be used to accelerate computation within supercomputers is much more recent.
Microchip MCP9808 silicon temperature sensor
Product News  
11/22/2011   1 comment
Microchip's latest sensor provides ± 0.5 degrees accuracy and 12-bit resolution from -20 to +100 degrees Celsius.
Many Ivy Bridge ultrabooks expected at CES
News & Analysis  
11/21/2011   17 comments
This year’s Consumer Electronics Show in Las Vegas will be replete with new ultrabook models, with a show director predicting as many as 50 different types.
32-bit MCUs boost in-vehicle security and tamper-proof ECUs
Product News  
11/21/2011   Post a comment
Devices bring security from software to hardware level and feature secure boot and crypto module.
Prototypes: What is a prototype?
11/21/2011   1 comment
First in a series of editorials on the subject of prototyping. In this article we tackle the question – what is a prototype…
Atmel launches RFID chip for animal ID
Product News  
11/21/2011   4 comments
Device aims to deliver increased flexibility, shorter lead-time and faster time to market
Reconfigurable LIN switch slave eases communication of switch modules and I/O extensions
Product News  
11/19/2011   Post a comment
Integrated LIN slave on a single chip includes physical layer LIN transceiver, LIN controller, voltage regulator, and application controller along with supporting functions ADC, PWM generation, and high voltage capable I/Os.
Highlights from Supercomputing 2011
News & Analysis  
11/18/2011   7 comments
Supercomputing 2011 which took place over this past week, in Seattle, was the 24th conference of its kind devoted to high performance computing, networking, storage and analysis. Attendance at this year’s show was in excess of 11,300 people, more than the 10,500 people who made it to last year’s conference in New Orleans.
Singapore plans to aid fabless chip firms
News & Analysis  
11/18/2011   Post a comment
The Singapore Semiconductor Industry Association has announced that it plans to support the formation and growth of fabless semiconductor companies in the city state, joining a number of other industry groups with similar goals.
Intel Xeon E5s take 10 systems on Top500
News & Analysis  
11/18/2011   Post a comment
Though the TOP500 saw no changes in its top 10 supercomputers this week, Intel still managed to dominate the list, powering some 85 percent of all new entries with 223 systems choosing the Intel Xeon 5600 series and 10 systems running on the firm’s Xeon E5 processors.
SerDes chip enables integration of multiple video streams
Design How-To  
11/18/2011   2 comments
In a parking assist system example, single twisted-pair communication and an interface chipset provide a bidirectional control channel with a minimum latency and general purpose I/O functionality, enabling seamless frame-synchronous processing of individual video data streams.
IBM's Blue Gene/Q; petaflops on low power
News & Analysis  
11/17/2011   3 comments
Perhaps the most poorly kept secret at SC11 was IBM’s official unveiling of its next generation Blue Gene/Q (BGQ) supercomputer, the third generation in its Blue Gene family, with 16 multi-processing core technology and a scalable peak performance of up to 100 petaflops.
Startup support: two initiatives with one idea
11/17/2011   2 comments
Two initiatives, both wanting to improve the lot of the humble semiconductor startup, have been sighted. What are their chances of success? Can they turn back the ebbing tide of venture capital support?
Mentor offshoot nurtures European startups
News & Analysis  
11/16/2011   1 comment
Cre8 Ventures, a 2005 offshoot from Mentor Graphics formed in the UK to support startups with networking contacts and various forms of help, has been extended, taken independent and renamed as the European Microelectronics Academy. The EMA has similarities to an initiative in Silicon Valley that is being launched by the Global Semiconductor Alliance with participation from Intel Capital, Cadence and TSMC.
Spatial audio IC simplifies soundstage design in portables
Product News  
11/16/2011   Post a comment
The LM48901 spatial array IC from Texas Instruments is intended to simplify the design and programming of spatially-enhanced audio systems for multi-speaker portable products and other space-constrained applications.
Infineon warns of sales decline in 2012
News & Analysis  
11/16/2011   Post a comment
German chipmaker Infineon Technologies AG has reported a profitable but flat fourth fiscal quarter and warned that it expects revenue in its 2012 fiscal year to decline compared with the 2011 fiscal year. The company has also said it plans to re-organize its businesses.
GPU technology key to exascale says Nvidia
News & Analysis  
11/16/2011   2 comments
Disruptive technologies like the GPU are important steps on the path to exascale computing said Nvidia Corp.’s CEO Jen Hsun Huang in a keynote at SC11 on Tuesday.
Chevy Volt fires cause concern
11/15/2011   29 comments
After the "shock" of that headline, more facts are needed.
Precision dual sensor op amp features high voltage, low noise, near-zero drift
Product News  
11/15/2011   Post a comment
Maxim MAX44251 includes autozero technology, 20V range, minimal offset
TI's multicore DSPs sink to new power lows
News & Analysis  
11/15/2011   1 comment
Texas Instruments Inc. (TI) was showing off its highest performing, lowest power multicore digital signal processors (DSP), based on its TMS320C66x DSP generation at Supercomputing 2011 on Monday.
Anadigics COO Shields steps down
News & Analysis  
11/15/2011   Post a comment
Thomas Shields, chief operating officer and chief financial officer at RF chip maker Anadigics, resigned to pursue another opportunity outside the company.
Nvidia proposes GPU programming standard
News & Analysis  
11/14/2011   7 comments
Nvidia Corp., Cray Inc., The Portland Group, Inc. (PGI) and The Center for Analysis and Prediction of Storms (CAPS) have unveiled ‘OpenACC’, a directives-based programming initiative the firms hope will become an industry standard for parallel computing.
Building 3D-ICs: Tool Flow and Design Software Part 1
Design How-To  
11/14/2011   3 comments
The industry’s current enthusiasm for 3D-ICs is widespread and well warranted, but designing those 3D devices presents a challenge...
Theoretical Physicist Michio Kaku Predicts the Future of Healthcare
Design How-To  
11/13/2011   9 comments
The bestselling author/professor delivered the keynote address at TCT2011, a conference covering transcatheter cardiovascular therapeutics.
Quad, octal 12/14b ADCs target communication, medical needs
Product News  
11/11/2011   Post a comment
AD9257, AD9637, AD9253, AD9633 offer low power, MRI-friendly packages, 40 to 125 Msps rates
Dongbu steps up support to China customers
News & Analysis  
11/11/2011   Post a comment
Specialty foundry Dongbu HiTek said it has commenced volume production for two new customers based in mainland China.
Software techniques harden against hacking: Pt. 2—Sandbox solutions
Design How-To  
11/11/2011   7 comments
Software strategies protect externally networked infotainment systems from entry by hackers.
TI calls baseband a distraction, but is it?
News & Analysis  
11/10/2011   10 comments
While Texas Instruments pushes forward quickly and aggressively with its OMAP mobile processor, some still wonder whether the firm’s “strategic decision” to leave out baseband could come back to bite it.
Combine power feed and data link via cable for remote peripherals
Design How-To  
11/10/2011   6 comments
It is possible to combine power distribution and high-speed data transmission by sharing a shielded twisted pair cable. A power feed network is necessary at both ends for power injection and extraction. By properly designing this network, and managing power supply switching noise, performance degradation is minimized.
Apple reportedly cuts back iPhone 4S orders
News & Analysis  
11/10/2011   11 comments
Apple Inc. may be cutting back on orders of components and parts for its latest iPhone 4S, due to weaker demand and shortages in the supply chain according to Chinese media reports.
Page 1 / 2   >   >> Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)

What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.

Brought to you by:

Most Recent Comments
Max The Magnificent
Kevin Neilson
Max The Magnificent
Max The Magnificent
Like Us on Facebook
Special Video Section
Power can be a gating factor in success or failure of ...
Get to market faster and connect your next product to the ...
See how microQSFP is setting a new standard for tomorrow’s ...
The LTC3649 step-down regulator combines key features of a ...
Once the base layer of a design has been taped out, making ...
In this short video we show an LED light demo to ...
The LTC2380-24 is a versatile 24-bit SAR ADC that combines ...
In this short video we show an LED light demo to ...
Wireless Power enables applications where it is difficult ...
LEDs are being used in current luxury model automotive ...
With design sizes expected to increase by 5X through 2020, ...
Linear Technology’s LT8330 and LT8331, two Low Quiescent ...
The quality and reliability of Mill-Max's two-piece ...
LED lighting is an important feature in today’s and future ...
The LT8602 has two high voltage buck regulators with an ...
Silego Technology’s highly versatile Mixed-signal GreenPAK ...
The quality and reliability of Mill-Max's two-piece ...
Why the multicopter? It has every thing in it. 58 of ...
Security is important in all parts of the IoT chain, ...
Infineon explains their philosophy and why the multicopter ...