Europe plots three pilot wafer fabs News & Analysis 11/21/2012 7 comments A European initiative formed to coordinate research in nanoelectronics has proposed projects for the creation of three pilot fabs, including one for 450-mm diameter wafers.
IBM backs Brazilian wafer fab project News & Analysis 11/20/2012 6 comments IBM, Brazilian development bank BNDES and the EBX Group of Brazilian billionaire Eike Batista, are partnering for the construction and operation of a wafer fab in the south of Brazil, according to local reports.
Infineon cuts workers hours ahead of downturn News & Analysis 11/16/2012 6 comments Reinhard Ploss, incoming CEO at Infineon, said the German chip maker is reducing hours for some employees and postponing or cancelling projects as part of attempts to weather a forthcoming "economic storm."
Simple circuit measures RMS value of AC power line Design How-To 11/8/2012 2 comments The root-mean-square value of an AC signal compares the heating value of an unknown AC signal to that of a known DC signal across identical loads. It is equal to the amount of DC required to produce an identical amount of heat in the load.
TI integrates more functions into AFE5809 Product News 11/1/2012 Post a comment Texas Instruments has integrated digital I/Q demodulation and decimation into an analog front end to reduce FPGA processing requirements in ultrasound systems as well as ultrasonic applications, such as sonar and non-destructive testing.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.