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Content tagged with Analog ICs
posted in November 2012
ST sets date for strategy announcement
News & Analysis  
11/30/2012   Post a comment
Struggling European chip manufacturer STMicroelectronics will announce details of its strategic plan on Dec. 10.
Cadence donates multi-patterned lithography technology
Blog  
11/28/2012   1 comment
Cadence Design Systems has donated extensions to the Open Access community which enable physical design tools to represent Multi-Patterned Technology.
EDA/IP weekly roundup – November 28th
Blog  
11/28/2012   Post a comment
Accellera, ASSET, Atrenta, Cadence, EDALab, eSilicon and IAR made the lineup today. See here for their news…
Silicon Valley Nation: Maxim confronts new challenges
Blog  
11/27/2012   7 comments
CEO Tunc Doluca has overhauled the analog company in the past 5 years. What's he worried about now?
Chip market to fall in 2012, rise in 2013
News & Analysis  
11/27/2012   6 comments
The WSTS industry organization has revised its previous forecasts down and now predicts a weak end to the year for the global chip market.
China fabless exec looks West as mobile slumps
News & Analysis  
11/26/2012   5 comments
Union Semiconductor, one of China's biggest fabless chip companies, is seeking new sockets in the West as China’s mobile business sags.
Europe plots three pilot wafer fabs
News & Analysis  
11/21/2012   7 comments
A European initiative formed to coordinate research in nanoelectronics has proposed projects for the creation of three pilot fabs, including one for 450-mm diameter wafers.
IBM backs Brazilian wafer fab project
News & Analysis  
11/20/2012   6 comments
IBM, Brazilian development bank BNDES and the EBX Group of Brazilian billionaire Eike Batista, are partnering for the construction and operation of a wafer fab in the south of Brazil, according to local reports.
Slideshow: Making sense of connected sensors
Design How-To  
11/19/2012   8 comments
A host of sensors demonstrated at Japan's Embedded Technology show are showing up everywhere - from shoes and cars to rice fields.
UMC replaces CEO in management shuffle
News & Analysis  
11/19/2012   2 comments
United Microelectronics Corp. has moved its former CEO up to vice chairman as it ponders the future direction of the foundry chip maker.
Infineon cuts workers hours ahead of downturn
News & Analysis  
11/16/2012   6 comments
Reinhard Ploss, incoming CEO at Infineon, said the German chip maker is reducing hours for some employees and postponing or cancelling projects as part of attempts to weather a forthcoming "economic storm."
Enhancing the efficiency of photovoltaic systems
Design How-To  
11/15/2012   3 comments
The overall design of PV systems is addressed along with new semiconductor advances that provide designers with the best tools for developing PV inverters.
Silicon Valley Nation: Sell your startup or stay?
Blog  
11/15/2012   5 comments
You're an engineer, you start a fine company and have fun doing it for many years. When do you sell?
Advanced Power Electronics offers two ICs at Electronica
Product News  
11/14/2012   Post a comment
Advanced Power Electronics Corp. has announced two power control ICs at Electronica this week.
Analog has place in increasingly digital world
News & Analysis  
11/13/2012   Post a comment
For every analog signal processing function replaced by digital, there are two new analog functions springing up, and the trend is expected to continue or perhaps even accelerate.
New magnetic position sensors forcel in safety-critical automotive applications
Product How-To  
11/13/2012   Post a comment
Includes advanced safety features for automotive applications requiring ISO26262 compliance.
Electronica: Smart grid will save us, say CEOs
News & Analysis  
11/13/2012   9 comments
The CEO panel discussion held on the day of the Electronica exhibition gave four CEOs the opportunity to see good times ahead for "essential" semiconductor technology.
Simple circuit measures RMS value of AC power line
Design How-To  
11/8/2012   2 comments
The root-mean-square value of an AC signal compares the heating value of an unknown AC signal to that of a known DC signal across identical loads. It is equal to the amount of DC required to produce an identical amount of heat in the load.
JESD204B vs. Serial LVDS I/F for wideband data converter apps
Design How-To  
11/6/2012   Post a comment
The JESD204A/B interface reduces the number of digital inputs/outputs between data converters and other devices, such as FPGAs and SoCs.
TI integrates more functions into AFE5809
Product News  
11/1/2012   Post a comment
Texas Instruments has integrated digital I/Q demodulation and decimation into an analog front end to reduce FPGA processing requirements in ultrasound systems as well as ultrasonic applications, such as sonar and non-destructive testing.


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