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posted in December 1999
E-books turn the page on mobile requirements
News & Analysis  
12/21/1999   Post a comment
As mobile computing de-vices such as electronic books proliferate, it quickly becomes apparent that the requirements for such devices differ greatly from those of traditional portables, such as notebook computers.
E-book vendors gird for technical challenges
News & Analysis  
12/21/1999   Post a comment
Despite the ease and cost savings of electronic communications when compared with traditional publication methods, the computer revolution has failed to make a dent in the overwhelming predominance of paper document production. Indeed, as Robert Faber, senior vice president at Softbook Inc. (Menlo Park, Calif.), explains in his contribution to this week's focus section on electronic-book design, computer-generated text combined with low-cost printers has only increased the use of paper.
Encoders afford rich digital video
News & Analysis  
12/7/1999   Post a comment
Digital video recording promises consumers a rich new entertainment experience. In addition to digital alternatives to VCRs, video codecs-MPEG encoders and decoders-deliver on-demand television with instant replay and slow motion of live broadcasts.
Digital advances boost speakers
News & Analysis  
12/7/1999   Post a comment
Advanced digital technology has almost remade the audio industry, raising the expectations of consumers and computer users so that the requirements for all equipment are converging on high-quality sound.
DVD puts playback of digital streams to test
News & Analysis  
12/7/1999   Post a comment
Understanding how a DVD digital video player works can help designers implement a design and select components. Typically, a DVD player consists of three functional blocks: DVD drive, DVD decoder and system controller.
Universal player spans DVD-A, SACD
News & Analysis  
12/7/1999   Post a comment
These are exciting times in the audio business. Consumers are facing another major change in audio disk technology, now that they've survived the shift in the late 1970s to digital technology and compact disks and then the birth of the CD-ROM market for PCs.
Dolby Digital delivers 3-D sound
News & Analysis  
12/7/1999   Post a comment
Most consumers agree that "surround sound," or audio that encircles all sides, significantly enhances the listening experience.
Mixed signals light home-entertainment scene
News & Analysis  
12/7/1999   Post a comment
Improvements in codec technologies, such as data conversion combined with DSP compression, have produced dramatic new possibilities for PC and consumer audio and video.


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What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.

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9/25/2016
4:48:30 PM
michigan0 Sang Kim First, 28nm bulk is in volume manufacturing for several years by the major semiconductor companies but not 28nm FDSOI today yet. Why not? Simply because unlike 28nm bulk the LDD(Lightly Doped Drain) to minimize hot carrier generation can't be implemented in 28nm FDSOI. Furthermore, hot carrier reliability becomes worse with scaling, That is the major reason why 28nm FDSOI is not manufacturable today and will not be. Second, how can you suppress the leakage currents from such ultra short 7nm due to the short channel effects? How thin SOI thickness is required to prevent punch-through of un-dopped 7nm FDSOI? Possibly less than 4nm. Depositing such an ultra thin film less then 4nm filum uniformly and reliably over 12" wafers at the manufacturing line is extremely difficult or not even manufacturable. If not manufacturable, the 7nm FDSOI debate is over!Third, what happens when hot carriers are generated near the drain at normal operation of 7nm FDSOI? Electrons go to the positively biased drain with no harm but where the holes to go? The holes can't go to the substrate because of the thin BOX layer. Some holes may become trapped at the BOX layer causing Vt shift. However, the vast majority of holes drift through the the un-dopped SOI channel toward the N+Source,...
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