Company cranks portable wireless audio at CES News & Analysis 12/29/2009 Post a comment Eleven Engineering Inc. will jump into the pool of providers of wireless audio streaming technology at the Consumer Electronics Show with a set of dongles and speakers using its proprietary 2.4 GHz technology.
The 10 most popular stories of 2009 News & Analysis 12/29/2009 Post a comment Here are the top ten stories for 2009 as ranked by EE Times readers, up to and including Tuesday, Dec. 29. The ranking is based on the number of reader "views" or "hits" on a particular article.
Global sales were strong in November, says analyst News & Analysis 12/23/2009 Post a comment Global chip sales in November were strong according to analysts at Carnegie Group (Oslo, Norway). The average of September, October and November chip sales is expected to be reported as $22.5 billion versus $21.7 billion for the equivalent figure in October.
Tower Semiconductor raises Q4 guidance News & Analysis 12/21/2009 Post a comment Foundry IC supplier Tower Semiconductor Ltd. (Migdal Haemek, Israel) has raised its fourth-quarter revenue guidance to between $98 million and $102 million. Tower trades as TowerJazz.
CES 2010: A wireless OK Corral Blog 12/17/2009 Post a comment Pre-CES is always a heady time in the wireless home video space, but never so much as this up-coming event, what with wireless LAN, 60 GHz, ultrawideband, standard and non-standard multimedia distribution schemes vying for attendees' attention--and dollars. So I sat down Asaf Avidan, VP of marketing for 'long-time' UWB chip provider, Wisair, to see where UWB stood--or if it even could find a toehold--in the fray.
IF gain block amplifiers claims highest dynamic range Product News 12/17/2009 Post a comment Analog Devices, Inc., has launched two new intermediate frequency (IF) gain block amplifiers that claim to provide the highest dynamic range available from internally matched IF gain blocks by combining best-in-class linearity and noise figure performance.
Carbon footprint labeling: Are you ready for it? Design How-To 12/17/2009 9 comments Pending regulations in Europe for a carbon footprint label on every product means that it's not enough to inform consumers your electronics product's power consumption level. You need to tell them the quantity (in grams) of carbon-dioxide emissions associated with manufacturing, transporting and recycling of your product.
Engineer tapped to head smart grid standards work News & Analysis 12/16/2009 Post a comment The U.S. government fueled significant work on smart electric grid this year, but the hard work of making the transition to a digital power network is just beginning, according to Steve Widergren, a principal engineer at Pacific Northwest National Laboratory recently named to head a broad new smart grid standards effort.
Is NFC there to stick? A report from CARTES News & Analysis 12/16/2009 Post a comment While smart card manufacturers where showcasing their latest visual tricks and printing capabilities on the busy alleys of CARTES & Identification in Paris, Near field communications (NFC) was definitely in the spotlight, technically there, but still far away from mass deployment.
Broadcom taps 40-nm process for high-def handsets News & Analysis 12/16/2009 Post a comment Broadcom Corp. is sampling its first 40 nm chip, a cellphone media processor capable of recording full 1080-progressive high definition video, the company said at its annual meeting with Wall Street analysts where it positioned itself as poised for a return to profitable growth that will outpace its markets.
Improving performance, range, and reliability in 802.11n networks Design How-To 12/15/2009 Post a comment While the hooks to achieving high-performance, ubiquitous wireless access in the home or office are within the IEEE 802.11n standard, there are many options built in for sustaining signals to achieve higher effective throughput at greater distances. The key is to choose the correct options. This feature will help, with an eye toward balancing cost and complexity.