First 3-D IC spec set for release News & Analysis 12/16/2011 13 comments JEDEC which announced a broad set of 3-D IC standards development earlier in 2011 is set to release what is touted as the first 3-D IC interface standard which will releases as early as late December.
Optimize SDR performance Design How-To 12/15/2011 2 comments Hands-on example using AWR Visual System Simulator: This article explains the attributes of SDR, the design challenges, and it includes hands-on examples of how AWR’s Visual System Simulator (VSS) software for system simulation of RF end-to-end architecture design can be used to address these challenges.
Intel announces mobile and wireless reorganization News & Analysis 12/15/2011 13 comments In a bid to tighten and hone its mobile technology focus, Intel Corp. has confirmed it has reorganized several business units to form a new mobile and communications group which will be responsible for all the firm’s smartphone, tablet and wireless communication efforts.
Processors enable global software defined radio platforms Design How-To 12/12/2011 1 comment Moving radio functions from hardware into software opens up cost benefits for global car production. Secondly, it affords producers flexibility when making decisions about future innovations in the pipeline—such as car-to-X. But what is needed is the right mix of specialized and flexible function blocks.
TI engineers elected as IEEE Fellows News & Analysis 12/7/2011 2 comments Three engineers from Texas Instruments have been elected as IEEE Fellows for “extraordinary accomplishments” in the semiconductor space and their contributions to the electrical engineering community.
Qualcomm unveils health subsidiary, cloud hub News & Analysis 12/5/2011 5 comments Qualcomm has announced the spin-off of its wireless health division into a wholly owned subsidiary called Qualcomm Life. The firm said Qualcomm Life would be in charge of a $100 million fund, managed by Qualcomm Ventures, to invest in wireless health technologies.
October global chip sales fell back, says WSTS News & Analysis 12/4/2011 4 comments Global chip sales in October were $23.41 billion down 20.5 percent from the preceding month and down 4.1 percent on the $24.40 billion recorded for October 2010, according to figures published by the World Semiconductor Trade Statistics.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.