Under the Hood: Flip Ultra camcorder - An ode to clean design Teardown 2/18/2008 2 comments The designers of the Flip Ultra digital camcorder turned ease of use into a fine art in this high-quality, user-friendly, low-cost digital video recorder that makes video sharing with sites such as YouTube and MySpace a snap. See how they did it in this feature and accompanying TeardownTV video.
Dialog Semi lands order from Asustek Product News 2/18/2008 Post a comment Fabless chip vendor Dialog Semiconductor plc (Kirchheim, Germany) succeeded in attracting 3C vendor Asustek as a customer. The Taiwanese company plans to equip its next-generation smartphones with two Dialog ASSPs.
IMEC tunes in to software defined radio Product News 2/15/2008 Post a comment A software-defined-radio chip design capable of speeds in excess of 100 megabits per second (Mb/s) is available for licensing from the Interuniversity Microelectronics Center (IMEC; Leuven, Belgium).
Under the Hood: When is a chip not a chip? Teardown 2/14/2008 1 comment There are many reasons why a semiconductor component might be branded with markings that differ from those of its actual manufacturer. A case in point is the Apple iPhone, which includes multiple devices from large companies (such as Broadcom, Philips, Samsung and Texas Instruments); all the devices carry Apple package markings.
With UWB uptake slow, Bluetooth hops on Wi-Fi News & Analysis 2/11/2008 Post a comment The Bluetooth Special Interest Group will provide a mechanism to let its protocol to ride on top of 802.11 networks while its longer term plan to create a version 3.0 based on ultrawideband technology moves slowly forward, a recognition of the market's rapid adoption of .11n and the relative slowness of UWB to gain traction.