45nm wireless device offers 63 percent power reduction Product News 2/11/2008 Post a comment At the International Solid-State Circuits Conference (ISSCC) last week, Texas Instruments Inc. disclosed process and design advancements enabling the first 45nm 3.5G baseband and multimedia processor addressing critical power challenges in the wireless market.
IMEC SDR targets broadband wireless News & Analysis 2/11/2008 Post a comment With a baseband platform for software defined radios (SDR), Belgian research institution IMEC will enable future broadband wireless applications such as 802.11n WiFi or Mobile WiMax according to IEEE standard 802.16e.
Xilinx, Freescale demo DPD design for efficient PA's Product News 2/11/2008 Post a comment Xilinx Inc. is demonstrating a digital pre-distortion (DPD) based reference design based on its Virtex range of FPGAs and XtremeDSPs that is optimized for Freescale Semiconductor's LDMOS power amplifiers at this week's World Mobile Congress in Barcelona, Spain.
The companies say the deisgn could significantly reduce development time and both capital and operational expenditure of wireless infrastructure.
Multimedia Handsets: Where consumers and operator ARPU needs collide Design How-To 2/10/2008 Post a comment What exactly is a multimedia handset? What defines today's multimedia functionality? What are the latest offerings that fit the bill? What are the technologies behind multimedia handsets, and the forecast for the future? Here's an article that highlights the findings of MultiMedia Intelligence's recent research report.
High-speed USB slips under $1 mark Product News 2/7/2008 Post a comment The cost of putting high-speed USB into a product drops to less than $1 with the release of an integrated product from SMSC, which is also squeezing the size and power consumption to new lows with its 332x family of transceivers.
6.5-Gbit/s signal conditioning family debuts Product News 2/7/2008 Post a comment Mindspeed Technologies announced the first four devices in a family of low-power cable and backplane equalizers that operate at speeds up to 6.5-Gbit/s in support of the latest high-speed communications protocols.
ISSCC shrinks 11n, Wimax and Bluetooth Product News 2/6/2008 1 comment The cost of the latest Wi-Fi and Bluetooth links are headed south, and WiMax may come to a cellphone near you soon based on papers from Atheros and STMicroelectronics at the International Solid State Circuits Conference.
Engineers grapple with digital radio at ISSCC News & Analysis 2/5/2008 Post a comment Lowering cellphone costs by integrating radio components was a big theme for engineers at the International Solid-State Circuits Conference where several big cellphone chip makers described their current integrated digital RF devices and others showed different techniques to eliminate external passive components.
What's in an RF Front End? Design How-To 2/4/2008 1 comment If you ever needed to explain what an RF front end is, part one of this series on RF Front End design gets the job done for you.
NEC-Intel sets sights on benchmark PMICs for mobiles News & Analysis 2/4/2008 Post a comment Touting a new era in highly integrated power management ICs (PMICs) that can be delivered in record time, NEC Electronics (Kawasaki, Japan) and its U.S. subsidiary NEC Electronics America have teamed with Intel Corporation to develop benchmark-level chips for advanced mobile Internet devices (MIDs).
Freescale to pay $100M for SigmaTel News & Analysis 2/4/2008 Post a comment Freescale Semiconductor Inc. has agreed to pay $100 million for SigmaTel Inc., to broaden its offerings in the consumer electronics market as the company looks for growth beyond the wireless IC market.
Under the Hood: Cordless phone's next phase Teardown 2/4/2008 1 comment The high-volume, low-status cordless phone is a fixture in most households, garnering little mindshare in the milieu of modern gadgetry. But the product category continues to present a picture of selective integration, design-for-cost and standards advancement that is worth examining.
AMS brings hi-def audio to mobile devices Product News 2/4/2008 Post a comment With the launch of a new high-definition audio player chip family, Austriamicrosystems (AMS) enables handset designers to set new standards for audio quality in mobile devices. With the chips, the company follows the usage trend towards lossless audio formats.
Battle-hardened veterans of the electronics industry have heard of the “connected car” so often that they assume it’s a done deal. But do we really know what it takes to get a car connected and what its future entails? Join EE Times editor Junko Yoshida as she moderates a panel of movers and shakers in the connected car business. Executives from Cisco, Siemens and NXP will share ideas, plans and hopes for connected cars and their future. After the first 30 minutes of the radio show, our listeners will have the opportunity to ask questions via live online chat.