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posted in February 2008
<<   <   Page 3 / 3
Variable gain amplifier drives low impedances from one power supply
Product News  
2/11/2008   Post a comment
ADI's AD8260 digital VGA and driver delivers with greater than ±200-mA drive capability, while integrating three discrete functions for industrial and automotive cabling applications.
45nm wireless device offers 63 percent power reduction
Product News  
2/11/2008   Post a comment
At the International Solid-State Circuits Conference (ISSCC) last week, Texas Instruments Inc. disclosed process and design advancements enabling the first 45nm 3.5G baseband and multimedia processor addressing critical power challenges in the wireless market.
Audience voice processor mimics human hearing to improve mobile calls
Product News  
2/11/2008   Post a comment
Mobile handset manufacturers, faced with a dilemma of increased churn and customer dissatisfaction regarding the quality of mobile calls, now have an opportunity to do something major about it.
Under the Hood: Guitar Hero jams go wireless
Teardown  
2/11/2008   Post a comment
Activision's Guitar Hero series has been big. Really big. Reports peg total sales of the Guitar Hero lineup at about $1 billion as of the start of 2008.
IMEC SDR targets broadband wireless
News & Analysis  
2/11/2008   Post a comment
With a baseband platform for software defined radios (SDR), Belgian research institution IMEC will enable future broadband wireless applications such as 802.11n WiFi or Mobile WiMax according to IEEE standard 802.16e.
Xilinx, Freescale demo DPD design for efficient PA's
Product News  
2/11/2008   Post a comment
Xilinx Inc. is demonstrating a digital pre-distortion (DPD) based reference design based on its Virtex range of FPGAs and XtremeDSPs that is optimized for Freescale Semiconductor's LDMOS power amplifiers at this week's World Mobile Congress in Barcelona, Spain. The companies say the deisgn could significantly reduce development time and both capital and operational expenditure of wireless infrastructure.
Multimedia Handsets: Where consumers and operator ARPU needs collide
Design How-To  
2/10/2008   Post a comment
What exactly is a multimedia handset? What defines today's multimedia functionality? What are the latest offerings that fit the bill? What are the technologies behind multimedia handsets, and the forecast for the future? Here's an article that highlights the findings of MultiMedia Intelligence's recent research report.
A SLIC charge pump
Design How-To  
2/9/2008   Post a comment
Here's a novel solution for providing on- and off-hook power for two phone lines
Power management chip drives high power LEDs up to 2-A
Product News  
2/8/2008   Post a comment
Capable of driving high power LEDs up to 2-A, the SP7600 single chip switching buck LED driver from Exar integrates a 100-mohm MOSFET in a thermally enhanced SO-8 package.
National Instruments acquires MicroLEX
News & Analysis  
2/7/2008   Post a comment
National Instruments is expanding its presence in the professional and consumer video and audio testing market with the acquisition of MicroLEX Systems A/S.
National Semi to launch energy 'ecosystem' in India
News & Analysis  
2/7/2008   Post a comment
National Semiconductor plans to form an low-power IC ecosystem made up of Indian suppliers.
High-speed USB slips under $1 mark
Product News  
2/7/2008   Post a comment
The cost of putting high-speed USB into a product drops to less than $1 with the release of an integrated product from SMSC, which is also squeezing the size and power consumption to new lows with its 332x family of transceivers.
6.5-Gbit/s signal conditioning family debuts
Product News  
2/7/2008   Post a comment
Mindspeed Technologies announced the first four devices in a family of low-power cable and backplane equalizers that operate at speeds up to 6.5-Gbit/s in support of the latest high-speed communications protocols.
A code-free approach to touch and proximity sensing for embedded systems
Design How-To  
2/6/2008   Post a comment
This "How To" tutorial shows how to incorporate capacitive sensing features into a simple embedded system without having to write a single line of code.
64-bit RFID tag could replace bar codes
News & Analysis  
2/6/2008   Post a comment
Researchers from the European Holst Center said their 64-bit, inductively-coupled, passive RFID tag achieved a record 780-bit/second data readout.
High performance uModule receiver subsystem bridges the gap between RF and digital worlds
News & Analysis  
2/6/2008   Post a comment
Linear Technology has introduced the LTM9001, the first in a series of System in a Package (SiP) signal chain receiver modules, leveraging the company's breakthrough uModule packaging technology.
ISSCC shrinks 11n, Wimax and Bluetooth
Product News  
2/6/2008   1 comment
The cost of the latest Wi-Fi and Bluetooth links are headed south, and WiMax may come to a cellphone near you soon based on papers from Atheros and STMicroelectronics at the International Solid State Circuits Conference.
1.8V video amplifier automatically adjusts power consumption
Product News  
2/6/2008   Post a comment
Maxim Integrated Products has introduced the MAX9516 video amplifier, which detects and reports the presence of a video load and reduces power consumption when the load is not present.
400kHz rise time accelerator improves I²C/SMBus system reliability
Product News  
2/6/2008   Post a comment
Linear's rist time accelerator provides a wide supply voltage range, low power shutdown mode, strong pull-up current, tight bus hold-off threshold, voltage improved ESD ruggedness and reduced package size.
RF driver amplifier reduces power, size and cost in WiMAX and wireless applications
News & Analysis  
2/6/2008   Post a comment
ADL5321 driver amplifier from Analog Devices claims the industry's best combination of performance and low power, while reducing design complexity and board area in the 2.3 GHz to 4.0 GHz frequency range.
Toshiba combines CMOS ASIC and eDRAM technologies to support rapid development of SIDSA mobile TV chipset
News & Analysis  
2/6/2008   Post a comment
Toshiba Electronics Europe (TEE) has announced that the company's renowned CMOS ASIC process and Embedded DRAM (eDRAM) technology have played a key role in the development of a next generation system on chip (SoC) DVB-H IC from SIDSA, a leading supplier of mobile TV technology.
Engineers grapple with digital radio at ISSCC
News & Analysis  
2/5/2008   Post a comment
Lowering cellphone costs by integrating radio components was a big theme for engineers at the International Solid-State Circuits Conference where several big cellphone chip makers described their current integrated digital RF devices and others showed different techniques to eliminate external passive components.
Wireless front end remains an integration challenge
News & Analysis  
2/5/2008   Post a comment
A panel at the International Solid Sate Circuits Conference examined potential solutions for integrating wireless interfaces onto a chip.
At ISSCC, IMEC details ADC, 60-GHz wireless developments
Product News  
2/5/2008   Post a comment
At the International Solid State Circuit Conference, IMEC researchers detailed their latest feats in data conversion and wireless 60-GHz.
Understand feature-based, application-specific switches to improve portable designs
Design How-To  
2/5/2008   Post a comment
A "switch" is not "just a switch"; the right feature subset is needed to match the application priorities of audio performance and USB charging
What's in an RF Front End?
Design How-To  
2/4/2008   1 comment
If you ever needed to explain what an RF front end is, part one of this series on RF Front End design gets the job done for you.
NEC-Intel sets sights on benchmark PMICs for mobiles
News & Analysis  
2/4/2008   Post a comment
Touting a new era in highly integrated power management ICs (PMICs) that can be delivered in record time, NEC Electronics (Kawasaki, Japan) and its U.S. subsidiary NEC Electronics America have teamed with Intel Corporation to develop benchmark-level chips for advanced mobile Internet devices (MIDs).
Analog IC incorporates adjustable resistor technology
Product News  
2/4/2008   Post a comment
Microbridge Technologies has introduced the industry's first active analog circuit to incorporate the company's passive, polysilicon adjustable resistor technology.
Freescale to pay $100M for SigmaTel
News & Analysis  
2/4/2008   Post a comment
Freescale Semiconductor Inc. has agreed to pay $100 million for SigmaTel Inc., to broaden its offerings in the consumer electronics market as the company looks for growth beyond the wireless IC market.
Putting the system in electronic system design
Design How-To  
2/4/2008   3 comments
You've heard it before. Increasingly complex systems and technologies like multicore processors and FPGAs have rendered old design methodologies obsolete.
Under the Hood: Cordless phone's next phase
Teardown  
2/4/2008   1 comment
The high-volume, low-status cordless phone is a fixture in most households, garnering little mindshare in the milieu of modern gadgetry. But the product category continues to present a picture of selective integration, design-for-cost and standards advancement that is worth examining.
Music player IC improves audio quality, playtime on portables
Product News  
2/4/2008   Post a comment
The AS3532 audio subsystem IC from austriamicrosystems brings high-definition audio and sub-5-mW decompression/playback of MP3, WMA and AAC files to portable media players and mobile phones.
Swedish start-up details programmable WiMax baseband chip
Product News  
2/4/2008   Post a comment
At the International Solid State Circuits Conference here this week a Swedish start-up will detail a fully programmable baseband processor for mobile wireless applications.
AMS brings hi-def audio to mobile devices
Product News  
2/4/2008   Post a comment
With the launch of a new high-definition audio player chip family, Austriamicrosystems (AMS) enables handset designers to set new standards for audio quality in mobile devices. With the chips, the company follows the usage trend towards lossless audio formats.
Multi-sensor interface chip consumes 30-µW of power
Product News  
2/3/2008   Post a comment
ZMD launched the first member of its MULti-Sensor IC (MUSiC) semiconductor family—the ZMD21013, which is a low-power multi-channel device aimed at microcontroller-based mobile electronic products.
SIGNAL CHAIN BASICS (Part 7): Op Amp Performance Specifications--Bias Current
Design How-To  
2/2/2008   Post a comment
The Signal Chain Basics Series continues with a discussion of bias current, a key operational amplifier (op amp) parameter
Analysis: Phone spinoff could be beginning of the end for Motorola
News & Analysis  
2/1/2008   1 comment
Motorola Inc.'s decision to explore the possibility of spinning of its loss-making handset division might result in the break up of the entire company and the eventually demise of another American icon.
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