MSC Vertriebs offers lowest power SERDES capable FPGA Product News 2/25/2010 Post a comment MSC Vertriebs GmbH is offering the Lattice ECP3 family which defines a new mid-range, value-based class of FPGAs, not only by further reducing costs, but also by reducing total power consumption by more than 50 percent for typical designs, compared to competitive SERDES-capable FPGAs.
APEC: Tesla Roadster, solar-panel dangers kickstart power fest News & Analysis 2/24/2010 Post a comment The 25th APEC kicked off with a dynamic plenary session that discussed the past and future of power, exposed the latest improvements to the Tesla Sports Roadster, uncovered the hidden dangers and inefficiencies of solar panels and showed how close-coupling cooling can achieve a 31 percent improvement in cooling efficiency for data centers.
Comment: Sparking interest in engineering Industrial Control DesignLine Blog 2/23/2010 Post a comment Intel is behind a $3.5 billion initiative to support investment in U.S.-based growth-oriented industries. The initiative also wants to increase jobs available this year for recent college graduates.
Mid-year slump to limit chip market growth, says analyst News & Analysis 2/23/2010 Post a comment A mid-year slump in the western economy is likely to inhibit consumer electronics spending and hold annual semiconductor revenue growth back at 11.2 percent in 2010, according to Robert Castellano of market research company The Information Network (New Tripoli, Pennsylvania).
TSMC, Dialog team on process for power management ICs News & Analysis 2/23/2010 Post a comment Power management chip vendor Dialog Semiconductor plc (Kirchheim-unter-Teck, Germany) has announced it is working with foundry partner Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan) on a bipolar-CMOS-DMOS (BCD) manufacturing process technology tailored to power management ICs for portable devices.
X-FAB opens UK branch office News & Analysis 2/23/2010 Post a comment Following the recent sale of its Plymouth silicon fabrication facility to Plessey Semiconductors, X-FAB has established a UK office supporting research and development, customer hotline support and sales
Tiny RF switch delivers +67 dBm IIP3 Product News 2/22/2010 Post a comment Peregrine Semiconductor recently announced an SP4T RF switch that is designed using the company's green UltraCMOS silicon-on-sapphire process technology, yielding broadband RF performance to 3-GHz.
Teardown: Inside the art of pulse oximetry Teardown 2/19/2010 3 comments Few areas have the ability to turn the cold science of metrology into pure art as quickly as medical diagnostics, and few systems embody the essence of this art as the Radical-7 Signal Extraction Pulse-CO Oximeter from Masimo. We go deep inside to uncover some of the secrets and design choices, that transform a box of ICs into a cutting-edge, life-saving system.
ISSCC, Nvidia shortfall lead weekly story ranking News & Analysis 2/19/2010 Post a comment Here are the top five online stories for the week beginning Sunday, Feb. 14, as ranked by EE Times readers, up to and including Friday, Feb. 19. The ranking is based on the number of reader "views" or "hits" on a particular article.
Crisis hits Elmos 2009 figures News & Analysis 2/19/2010 Post a comment Automotive chip vendor Elmos AG (Dortmund, Germany) has been hit badly in FY 2009 by the automotive crisis. Despite a strong uptrend in the second half of the year, the company saw its sales decline drastically.
Tanner EDA, Sound Design Technologies develop PDKs Product News 2/18/2010 Post a comment Tanner EDA, a division of Tanner Research Inc. (Monrovia, Calif.), announced it has combined its specialized IC design software combined with integrated passives and chip-stacking technologies from Sound Design Technologies Ltd. (Ontario, Canada).
ADI beats expectations, sees further growth News & Analysis 2/17/2010 Post a comment Chip vendor Analog Devices reported revenue for its most recent quarter which exceeded consensus analyst expectations and issued a sales target for the current quarter that also topped most predictions.
Toshiba: Speed of market top challenge for mobile ICs Blog 2/17/2010 Post a comment Under pressure to provide differentiated handset offerings, OEMs nevertheless want to use the same base platform for their mobile phone products, according to Deepak Prakash, director of marketing for multimedia products at Toshiba America Electronic Components' ASSP business unit.
ZeroG chief executive joins GainSpan News & Analysis 2/17/2010 Post a comment Greg Winner has been named chief executive of embedded Wi-Fi chip startup GainSpan Corp., fresh from closing a deal in January to sell its competitor startup ZeroG to Microchip Technology Inc.
Smart drivers reduce energy use and PCB clutter in portable electronic systems Design How-To 2/15/2010 Post a comment Small portable electronic systems such as mobile telephones, personal media players (PMPs), digital still cameras (DSCs), digital video cameras (DVCs), portable medical equipment (PME), and global-positioning systems (GPS) continue to evolve and add features with each generation. As they do, their peripheral-circuit requirements have become more similar in part because their power sources, ports, and MMIs (man-machine interfaces) draw on similar technologies.
10-bit 3 Gsps DMUX eliminates gigahertz data rate bottleneck Product News 2/15/2010 Post a comment Specialized electronic components manufacturer, e2v, has introduced a high speed 10-bit 3 Gsps demultiplexer (DMUX) featuring LVDS compatible differential data and clock inputs for easy interface into digital signal processor (DSP) or industry standard field programmable gate arrays (FPGA).
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.