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Content tagged with Analog ICs
posted in February 2010
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6-channel system managers with nonvolatile fault memory facilitate diagnostics
Product News  
2/26/2010   Post a comment
Maxim Integrated Products' MAX16067/MAX16068 integrate nonvolatile fault registers to facilitate failure analysis and are available with an easy-to-use graphical configuration tool that simplifies diagnostics and configuration.
Adjunct SOC for power amplifier performs complex signal processing in RF domain
Product News  
2/25/2010   Post a comment
Scintera has developed a power amplifier linearization SoC that performs complex signal processing in the RF domain, resulting in low-power consumption, wide signal bandwidth, and broad frequency operation.
Dual, low noise, positive/negative ±20 VIN ±150 mA LDO offers 20 uVRMS noise
Product News  
2/25/2010   Post a comment
Linear Technology Corporation has unveiled a dual, low noise, positive/negative low dropout voltage linear regulator.
MSC Vertriebs offers lowest power SERDES capable FPGA
Product News  
2/25/2010   Post a comment
MSC Vertriebs GmbH is offering the Lattice ECP3 family which defines a new mid-range, value-based class of FPGAs, not only by further reducing costs, but also by reducing total power consumption by more than 50 percent for typical designs, compared to competitive SERDES-capable FPGAs.
Avago, TriQuint report increased sales
News & Analysis  
2/24/2010   Post a comment
Rival RF chip vendors Avago Technologies and TriQuint Semiconductor reported gains in sales and profit for their most recently concluded quarters.
Acoustic metamaterials: Solution for noisy neighbors?
Audio DesignLine Blog  
2/24/2010   5 comments
Acoustic panels consisting of latex membranes and plastic buttons might offer an economical solution to blocking annoying bass frequencies.
Mephisto adds usability to analog design platform
Product News  
2/24/2010   Post a comment
For the latest version of its M-Design platform, Mephisto Design Automation NV (Leuven, Belgium) said it has improved functional and usability. Interoperability will be the company's next point of focus.
Free seminars focus on high performance DC/DC regulators
News & Analysis  
2/24/2010   Post a comment
Linear Technology Corporation is planning to run a series of free half-day seminars on the use of its family of high performance DC/DC uModule regulators.
New EDA tool release boosts analog and mixed-signal design productivity
Product News  
2/24/2010   Post a comment
Belgian EDA tool innovator, Mephisto Design Automation (MDA) has unveiled its M-DESIGN 3.2 release which offers analog and mixed-signal designers immediate productivity gains for their front-end design tasks.
Altera transitions its 40nm Arria II GX FPGAs to production
Product News  
2/24/2010   Post a comment
Altera announced it is shipping in volume production the first members of its 40nm Arria II GX FPGA family specifically targeting 3-Gbps transceiver applications
Global shipments of short range wireless ICs to exceed 2 billion units in 2010
News & Analysis  
2/24/2010   Post a comment
Global shipments of short range wireless ICs (Bluetooth, NFC, UWB, 802.15.4, Wi-Fi) are expected to surpass two billion units this year, increasing approximately 20 percent compared to 2009. Shipments are forecast to total five billion in 2014, according to new market data from ABI Research
Kumar Sivarajan named tech visionary; Verismo's internet TV device named best product by ISA
News & Analysis  
2/24/2010   1 comment
ISA names Kumar Sivarajan tech visionary, lists electronic products award winners
APEC: Tesla Roadster, solar-panel dangers kickstart power fest
News & Analysis  
2/24/2010   Post a comment
The 25th APEC kicked off with a dynamic plenary session that discussed the past and future of power, exposed the latest improvements to the Tesla Sports Roadster, uncovered the hidden dangers and inefficiencies of solar panels and showed how close-coupling cooling can achieve a 31 percent improvement in cooling efficiency for data centers.
Comment: Sparking interest in engineering
Industrial Control DesignLine Blog  
2/23/2010   Post a comment
Intel is behind a $3.5 billion initiative to support investment in U.S.-based growth-oriented industries. The initiative also wants to increase jobs available this year for recent college graduates.
Junctionless transistor is ready for 20-nm node, says researcher
News & Analysis  
2/23/2010   3 comments
Professor Jean-Pierre Colinge of Tyndall National Institute (Cork, Ireland), co-author of the paper Nanowire transistors without junctions, has said that junctionless transistors could be implemented commercially at around the 20-nm manufacturing node.
Power management chip debuts with on-chip PMBus support
Product News  
2/23/2010   Post a comment
National has unveiled a system power management chip dubbed the LM25066 that is designed to reduce data center operating expenses and improve system reliability.
2.5-A automotive gate drive optocoupler is ideal for HEVs
Product News  
2/23/2010   Post a comment
Avago Technologies has introduced a new compact extended temperature automotive grade optocoupler for use in hybrid electronic vehicles.
Mid-year slump to limit chip market growth, says analyst
News & Analysis  
2/23/2010   Post a comment
A mid-year slump in the western economy is likely to inhibit consumer electronics spending and hold annual semiconductor revenue growth back at 11.2 percent in 2010, according to Robert Castellano of market research company The Information Network (New Tripoli, Pennsylvania).
Metamaterials antenna supports multiple bands
Product News  
2/23/2010   Post a comment
The world's first metamaterial antenna permits multiple bands--LTE, 3G, WiMax, WiFi, Bluetooth and GPS--to share the same antenna without the usually switching circuits and matching components.
TSMC, Dialog team on process for power management ICs
News & Analysis  
2/23/2010   Post a comment
Power management chip vendor Dialog Semiconductor plc (Kirchheim-unter-Teck, Germany) has announced it is working with foundry partner Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan) on a bipolar-CMOS-DMOS (BCD) manufacturing process technology tailored to power management ICs for portable devices.
X-FAB opens UK branch office
News & Analysis  
2/23/2010   Post a comment
Following the recent sale of its Plymouth silicon fabrication facility to Plessey Semiconductors, X-FAB has established a UK office supporting research and development, customer hotline support and sales
Tiny RF switch delivers +67 dBm IIP3
Product News  
2/22/2010   Post a comment
Peregrine Semiconductor recently announced an SP4T RF switch that is designed using the company's green UltraCMOS silicon-on-sapphire process technology, yielding broadband RF performance to 3-GHz.
Let's go passive: giving these components their due
Design How-To  
2/22/2010   Post a comment
Passive components are still critical in circuits, nowhere more so than in power-supply designs; here are some popular passive-centric articles which have appeared at this site
Junctionless transistor could simplify chip making, say researchers
News & Analysis  
2/22/2010   Post a comment
In a move that could revolutionize nanoelectronics manufacturing and the semiconductor industry, scientists at the Tyndall National Institute (Cork, Ireland) have designed and fabricated what they claim is the world's first junctionless transistor.
Teardown: Inside the art of pulse oximetry
Teardown  
2/19/2010   3 comments
Few areas have the ability to turn the cold science of metrology into pure art as quickly as medical diagnostics, and few systems embody the essence of this art as the Radical-7 Signal Extraction Pulse-CO Oximeter from Masimo. We go deep inside to uncover some of the secrets and design choices, that transform a box of ICs into a cutting-edge, life-saving system.
NEC Electronics extends 32-bit microcontroller line up with 78 new devices
Product News  
2/19/2010   Post a comment
NEC Electronics has introduced 78 new 32-bit All Flash V850ES/Jx3 series microcontrollers (MCUs) that claim the industry's leading low power consumption, optimized pin counts and expanded functionality.
ISSCC, Nvidia shortfall lead weekly story ranking
News & Analysis  
2/19/2010   Post a comment
Here are the top five online stories for the week beginning Sunday, Feb. 14, as ranked by EE Times readers, up to and including Friday, Feb. 19. The ranking is based on the number of reader "views" or "hits" on a particular article.
Crisis hits Elmos 2009 figures
News & Analysis  
2/19/2010   Post a comment
Automotive chip vendor Elmos AG (Dortmund, Germany) has been hit badly in FY 2009 by the automotive crisis. Despite a strong uptrend in the second half of the year, the company saw its sales decline drastically.
What made you become an EE? Join the Conversation
Blog  
2/18/2010   27 comments
In honor of National Engineers Week, we ask readers what inspired them to become engineers and what can be done to encourage more young people to join the ranks.
SMSC acquires wireless audio IC vendor
News & Analysis  
2/18/2010   Post a comment
Mixed-signal IC vendor SMSC said it acquired Kleer Semiconductor, a maker of chips for wireless audio. Financial terms of the agreement were not disclosed.
Ultra low noise amplifier targets cellular infrastructure applications
Product News  
2/18/2010   Post a comment
Avago Technologies has added the latest edition to its family of ultra low noise, high gain, high linearity Gallium Arsenide (GaAs) active bias amplifiers for use in cellular infrastructure applications.
High performance band pass filter offers custom ceramic designs
Product News  
2/18/2010   Post a comment
MSC Vertriebs GmbH is offering Comnav's 10BCR4B-f0/BW-L high performance band pass filter.
Imec collaborates with Mephisto Design Automation on mixed-signal design for reconfigurable radios
News & Analysis  
2/18/2010   Post a comment
IMEC, the independent nanoelectronics research center headquartered in Leuven, Belgium, is to collaborate with Mephisto Design Automation (MDA) to develop mixed-signal design for reconfigurable radios within IMEC's green radios program by using MDA's customer proven product M-DESIGN.
Tanner EDA, Sound Design Technologies develop PDKs
Product News  
2/18/2010   Post a comment
Tanner EDA, a division of Tanner Research Inc. (Monrovia, Calif.), announced it has combined its specialized IC design software combined with integrated passives and chip-stacking technologies from Sound Design Technologies Ltd. (Ontario, Canada).
Current sensors enable very high-current measurements
Product News  
2/18/2010   Post a comment
Developed and manufactured by Hitec Power Protection, the Zero-Flux current sensors allow the Yokogawa family of precision power meters to be used for measuring very high currents
Dual buck converter integrates a 700 mA DC-DC to power 3G PA
Product News  
2/18/2010   Post a comment
Maxim Integrated Products introduces the MAX8896, a dual step-down converter designed for powering WCDMA/NCDMA PA (power amplifier) modules and RF transceivers.
ADI beats expectations, sees further growth
News & Analysis  
2/17/2010   Post a comment
Chip vendor Analog Devices reported revenue for its most recent quarter which exceeded consensus analyst expectations and issued a sales target for the current quarter that also topped most predictions.
WIRELESS: Transcede processors serve 3G/4G/LTE mobile infrastructure
Product News  
2/17/2010   Post a comment
Transcede application-specific SoCs from Mindspeed reduce system power, complexity and cost while boosting performance for 3G/4G/LTE mobile infrastructure.
Toshiba: Speed of market top challenge for mobile ICs
Blog  
2/17/2010   Post a comment
Under pressure to provide differentiated handset offerings, OEMs nevertheless want to use the same base platform for their mobile phone products, according to Deepak Prakash, director of marketing for multimedia products at Toshiba America Electronic Components' ASSP business unit.
ZeroG chief executive joins GainSpan
News & Analysis  
2/17/2010   Post a comment
Greg Winner has been named chief executive of embedded Wi-Fi chip startup GainSpan Corp., fresh from closing a deal in January to sell its competitor startup ZeroG to Microchip Technology Inc.
Six new femtocell customers take up picoChip's picoXcell SoC
Product News  
2/16/2010   Post a comment
PicoChip has announced that Alpha Networks, Argela, Askey, C&S Micro, Contela and Zyxel are the latest customers to use picoChip's PC302 picoXcell™ SoC in HSPA+ femtocell designs.
3-axis digital gyroscope claims breakthrough in motion-control realism for mobile phones and gaming consoles
Product News  
2/16/2010   Post a comment
STMicroelectronics has introduced a 3-axis digital gyroscope that employs a single sensing structure for motion measurement along all three orthogonal axes.
High-performance driver modules target mid-sized LED-backlit displays
Product News  
2/16/2010   1 comment
Endicott Research Group (ERG) is offering a new range of Smart Force plug-and-play LED driver solutions with enhanced performance features for high-power, high-brightness mid-size LED-backlit displays.
Deserializer display bridge chip connects advanced baseband or application processors to displays with parallel interfaces
Product News  
2/16/2010   Post a comment
Toshiba Electronics Europe has unveiled a new deserializer display bridge chip that connects the baseband or application processors used in smart phones, which use Mobile Industry Processor Interface-Display Serial Interfaces (MIPI-DSI), to displays with legacy parallel interfaces.
Multi-band multi-standard transceiver with fully integrated ADC and DAC targets femtocell applications
Product News  
2/16/2010   Post a comment
Lime Microsystems has announced the LMS6002D, a multi-band multi-standard RF transceiver IC designed for small cell base stations and femtocells, featuring integrated high performance dual ADC and DAC.
Smart drivers reduce energy use and PCB clutter in portable electronic systems
Design How-To  
2/15/2010   Post a comment
Small portable electronic systems such as mobile telephones, personal media players (PMPs), digital still cameras (DSCs), digital video cameras (DVCs), portable medical equipment (PME), and global-positioning systems (GPS) continue to evolve and add features with each generation. As they do, their peripheral-circuit requirements have become more similar in part because their power sources, ports, and MMIs (man-machine interfaces) draw on similar technologies.
10-bit 3 Gsps DMUX eliminates gigahertz data rate bottleneck
Product News  
2/15/2010   Post a comment
Specialized electronic components manufacturer, e2v, has introduced a high speed 10-bit 3 Gsps demultiplexer (DMUX) featuring LVDS compatible differential data and clock inputs for easy interface into digital signal processor (DSP) or industry standard field programmable gate arrays (FPGA).
Programmable driver powers LensVector AutoFocus device for mobile phone cameras
Product News  
2/15/2010   Post a comment
Programmable mixed-signal power management IC solutions provider, Summit Microelectronics has introduced the SMB274 programmable driver for the LensVector solid-state AutoFocus device.
Extend the range of low-power RF devices without exceeding FCC regulations
Design How-To  
2/15/2010   1 comment
Understand how to calculate and improve your link's wireless range, while minimizing power dissipation
Power Trip: Dealing with kVA issues, power factor, and smaller boost vs. buck regulators
Design How-To  
2/15/2010   Post a comment
Understand the implications of "big power" and the key load-limit difference between boost- and buck-regulator topologies
Page 1 / 3   >   >>


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1 Comment
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41 comments
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