Intel's Gargini pushes III-V-on-silicon as 2015 transistor option News & Analysis 2/12/2010 Post a comment A presentation prepared by Paolo Gargini, Intel's director of technology strategy, to give to the Industry Strategy Symposium Europe, held in Dublin, Ireland, earlier this week, stressed Intel's progress in adding compound semiconductor layers to silicon as a means of continuing scaling and reducing power consumption.
Broadcom sees feature phones getting smarter Blog 2/11/2010 Post a comment EE Times caught up with Robert Nalesnik, senior director of marketing with Broadcom's Mobile Platforms group, to ask him questions about trends in wireless handsets as part of a series of interviews with wireless chip vendors in advance of Mobile World Congress.
UMC sees January sales drop 9% sequentially News & Analysis 2/11/2010 Post a comment United Microelectronics Corp., the world's second largest foundry, had January sales of NT$8,600 million (about $268 million), a decrease of 9.25 percent from the December 2009 sales figure of NT$9,292 million (about $290 million).
Digital audio playback IC delivers up to 30 s Product News 2/10/2010 Post a comment Using flash memory to provide non-volatile audio playback of up to 30 seconds, the ChipCorder ISD2100 family of single-chip audio-grade ICs offers up to 32-kHz sampling and can operate without a microcontroller.
TSMC sees sales drop in January News & Analysis 2/10/2010 Post a comment Foundry giant Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) said its January sales on an unconsolidated basis, were approximately NT$29.16 billion (about $908 million) a decrease of 4.3 percent from December 2009 and an increase of 134.4 percent over January 2009.
Audio Myths Workshop video Audio DesignLine Blog 2/10/2010 Post a comment This video of the Audio Myths workshop held at a recent AES show covers topics like the nature of human perception, "placebo tweaks," proper testing methods and examples of artifact audibility, among many others. A list of 20 topics and when they occur in the video is included here for easy reference.
SMIC expected to announce capital injection News & Analysis 2/9/2010 Post a comment Semiconductor Manufacturing International Corp. (Shanghai, China) is expected to announce a capital injection from Datang Telecom Technology & Industry Holdings Co. Ltd., an existing investor, at a quarterly investor conference call on Wednesday (Feb. 9).
ISSCC: Bosch unveils integrated MEMS automotive sensor News & Analysis 2/8/2010 Post a comment To support his update on the state and future of microelectromechanical systems (MEMS) for automotive and consumer applications, Jiri Marek, senior vice president of Bosch's sensors division (Germany) used his opening slot at ISSCC's Monday plenary session to describe the first integrated inertial sensor modules, combining yaw rate and acceleration sensor stacked on an ASIC in a molded SOIC16w package.
ISSCC keynoter wants 100X power efficiency improvement News & Analysis 2/8/2010 Post a comment Power efficiency is the single biggest challenge facing the mobile handset industry, and collaboration and co-design are needed to enable the industry to deliver a 100X improvement in power efficiency for mobile devices, according to a keynote presentation at the International Solid State Circuits Conference.
An analyst's 10 reasons to be cheerful News & Analysis 2/8/2010 Post a comment Bill McClean, analyst with IC Insights Inc. (Scottsdale, Ariz.) has provided ten reasons that support the idea that 2010 could be between a good and a great year for the semiconductor industry.
Engineers explore life beyond 10 Gbit links News & Analysis 2/8/2010 1 comment Electronics engineers are bumping up against the limits of their tools and techniques—and perhaps even physics--to keep pace with the rapidly expanding needs of an Internet-driven society as they coalesce around a move to 25 Gbit/second chips and ponder what comes next.
Metering chips feature isolated sensing technology Product News 2/7/2010 Post a comment Teridian Semiconductor has begun sampling its fourth generation residential smart metering integrated circuits (ICs) that eliminate costly current transformers and associated copper wiring in 2-element residential meters, with up to class 0.2-accuracy.
Cognitive radio's foundation on display at ISSCC 2010 News & Analysis 2/5/2010 1 comment The ethereal concept of cognitive radio will be seeking paths to corporeal form among the many wireless breakthroughs being presented at ISSCC 2010 conference in San Francisco. From highly integrated SAW-less front ends to multistandard, multiband systems on chip to emerging 60-GHz interfaces , the foundational elements of our ubiquitous wireless future will be on display for all to see.
Monopole antennas enable multiple M2M applications for Zigbee and ISM Band Product News 2/5/2010 Post a comment Pulse, a Technitrol Company, is offering a set of monopole antennas that deliver Zigbee 2.4 GHz and ISM bands 868 MHz, 915 MHz, and 2.4GHz. These antennas are ideal alternatives to using trace antennas because they occupy very little printed circuit board space while maintaining their key properties regardless of changes to the board.
CSEM offers transceiver-with-DSP for wireless networks Product News 2/4/2010 Post a comment Centre Suisse d'Electronique et de Microtechnique (Neuchatel, Switzerland) has produced a one-volt RF transceiver with an integrated DSP tailored for portable wireless communications in such things as wireless sensor networks and body area networks.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.