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Content tagged with Analog ICs
posted in February 2012
Serial interfaces for high-speed A/D converters
Design How-To  
2/28/2012   Post a comment
There are tradeoffs between the serial interfaces which reduce the number of pins on the ADC and FPGA
DAC reduces cable head-end footprint
Product News  
2/28/2012   Post a comment
DAC aims to improve channel density by 20 times over present cable modem implementations.
AUTOSAR timing models minimize ECU risks
Design How-To  
2/27/2012   Post a comment
Timing models are ideal development artifacts for the exchange between different development groups and along the supply chain. The presented methodology minimizes integration risks for ECU projects from the very beginning and constantly keeps real-time capabilities in focus.
LED drivers provide control, circuit-protection design options
Design How-To  
2/27/2012   1 comment
While the basic operating requirement for an LED driver is to supply a constant current for consistent lighting, automotive uses have stringent guidelines regarding temperature and humidity, voltage, ability to withstand harsh chemicals, electromagnetic interference and compatibility, as well as circuit protection.
ISO 26262 cuts electronics complexity risks: Pt. 1- Requirements and assessment flow
Design How-To  
2/23/2012   2 comments
Future development and integration of automotive safety functions will strengthen the need to have safe system development processes and to provide evidence that all reasonable safety objectives are satisfied. ISO 26262 provides guidance to reduce these risks to a tolerable level by providing feasible requirements and processes.
ADI, Avago see slight uptick in business
News & Analysis  
2/23/2012   Post a comment
The top executives at analog Analog Devices and Avago Technologies each sounded a note of cautious optimism, with both saying they see signs of improved business in the wake of the firms' most recent quarterly reports.
STMicroelectronics STM6519 and STM6524 smart reset chips
Product News  
2/23/2012   1 comment
ST recently launched a new generation of its smart reset chips, which are designed to provide an intuitive means of resetting frozen gadgets, such as mobile phones, media players, and other portable consumer devices.
Making sounds with analogue electronics - Part 6: Other methods of analogue synthesis
Design How-To  
2/22/2012   Post a comment
Part 6 of an excerpt from the book "Sound Synthesis and Sampling" considers other methods of analogue synthesis, including amplitude modulation, frequency modulation, formant synthesis, ring modulation, ringing circuits and other technologies.
Dialog on a mobile roll sees strong Q1
News & Analysis  
2/22/2012   2 comments
Fabless chip company Dialog Semiconductor plc has reported strong financial results for fourth quarter, as expected, and has forecast a strong first quarter of 2012.
Vehicle audio power amp combines 49-W output, 6-V start/stop support
Product News  
2/22/2012   Post a comment
Toshiba Electronics Europe has launched a high-efficiency quad channel power amplifier that is optimized to the requirements of high-quality audio systems in vehicles fitted with 'start/stop' technology.
Top-level Custom Signal Planning and Routing
Design How-To  
2/20/2012   2 comments
Custom ICs are outgrowing the capabilities of conventional design techniques that involve traditional point tools, schematics, SPICE-level netlists, manual layout tools, manual routing…
Huawei places $6-billion chip order with U.S.
News & Analysis  
2/20/2012   16 comments
Avago, Broadcom and Qualcomm have been awarded three-year chip deals by Huawei Technologies Co. Ltd. worth $6 billion.
Optocouplers safeguard battery systems from transients, shorts, and other faults
Design How-To  
2/16/2012   Post a comment
Optical isolators are the defacto standard to provide high electrical isolation and noise immunity, while consuming little power compared with transformer coupling isolation.
Tower turns in record sales, growth in 2011
News & Analysis  
2/16/2012   1 comment
For the full year of 2011 specialist foundry Tower Semiconductor Ltd. has reported record revenues of $611 million, up 20 percent over revenues of 2010 and well ahead of the overall semiconductor industry's annual growth of 0.4 percent.
Tower bids to build wafer fab in India
News & Analysis  
2/16/2012   21 comments
Tower Semiconductor Ltd., an Israel-based foundry chipmaker that trades under the name TowerJazz, has said it has signed a binding memorandum of understanding with an unnamed Indian infrastructure company, to build and operate a 300-mm wafer fab in India.
Maxim Integrated Products MAX31722/MAX31723 are digital thermometers and thermostats
Product News  
2/15/2012   Post a comment
Maxim's latest devices are true temperature-to-digital converters that don't require additional components.
EDA/IP Weekly Roundup – Feb 15th
2/15/2012   Post a comment
Synopsys, Magma, MunEDA, Gradspring, Analog Devices, Austriamicrosystems Synopsys and Arteris made the lineup today. See here for their news…
DDC rolls ultra low power +3.3V dual MIL-STD-1553 transceiver
Product News  
2/14/2012   Post a comment
Data Device Corporation (DDC) has released the BU-67401L, a dual MIL-STD-1553 dual transceiver that operates from a +3.3V power supply voltage.
Half-duplex RFID mini-transponders for animal and asset tracking
Product News  
2/12/2012   Post a comment
Texas Instruments has announced what it claims to be the world’s smallest half-duplex RFID mini-transponders that enable customers to embed tags into smaller objects across a broader range of applications.
TI lengthened analog IC lead in 2011
News & Analysis  
2/10/2012   10 comments
Texas Instruments expanded its lead in the analog semiconductor market over No. 2 player STMicroelectronics NV in 2011, as TI's analog sales grew 5 percent, according to a market research firm.
Compact gate drive IC simplifies hybrid, EV power train design
Product News  
2/10/2012   Post a comment
High output current drives inverter stage IGBTs and MOSFETs.
Software tools ease AUTOSAR compliance
Design How-To  
2/9/2012   Post a comment
The AUTOSAR initiative is tackling the industry-wide constraints of complexity, competition, and cost. AUTOSAR provides incentives for manufacturers to replace their proprietary software/hardware interfaces with standardized ones linked to an independent architectural layer.
Diodes ZXLD1371 LED driver controller
Product News  
2/9/2012   Post a comment
Diodes' latest LED driver features an input voltage range from 5 to 60V, enabling it to handle a broad range of applications, even those subject to the greatest variance in input voltage.
Calling all people who care about power
The Engineering Life - Around the Web  
2/7/2012   Post a comment
Reaching out to people is one of the things that editors have to do, but I have to know who to reach out to. Should I include you?
Interesting Idea: Stochastic Behavioral Modeling of Analog/Mixed-Signal Circuits
2/7/2012   1 comment
Process variation has become an increasingly challenging issue for both integrate circuit design and manufacturing, which results from the uncertainties from chemical mechanical polishing...
New H-PSOF power-electronics packaging touts high-current capability and high efficiency
Product News  
2/2/2012   Post a comment
Automotive power transistors for hybrid and electric vehicles are first available products.
ST STCF04 LED flash/torch controller
Product News  
2/2/2012   Post a comment
ST's supercapacitor LED flash/torch controller upgrades conventional camera module architecture to deliver floodlight-strength flash power.
Battery fuel gauge: factual or fallacy?
Design How-To  
2/2/2012   Post a comment
Measuring stored energy capacity is easy; doing it accurately is a whole different ballgame.
Select Schottky diodes based on avalanche performance
Design How-To  
2/2/2012   Post a comment
For reverse battery protection, peak avalanche power gauges pulse performance while having low forward voltage drop.
Aircraft industry heads upward
Military & Aerospace Blog  
2/1/2012   Post a comment
Analysts project 9.3% growth in 2012.
Wanted: 3-D IC standards within six months
News & Analysis  
2/1/2012   13 comments
Standards for 3-D chip stacks need to be in place within six months to stay ahead of chips rolling out in 2013, said a Qualcomm executive driving some of the efforts. Parts Search

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