Long design effort delivers space station power News & Analysis 3/30/2001 Post a comment The designers at Boeing Co.'s Rocketdyne Division (Canoga Park, Calif.) are riding high, thrilled that the power system they crafted for the International Space Station is working successfully in orbit after almost a decade of development on earth.
Transmitter keeps in tune with loop antennas News & Analysis 3/30/2001 Post a comment Micrel Semiconductor has developed a single-chip radio transmitter for unlicensed bands in the 280 to 460MHz range that automatically corrects for differences in a connected loop antenna so the board does not need to be tuned on the manufacturing line with a trimmer pot.
Atmel expands alliance for RF, baseband ICs in secure 3G networks News & Analysis 3/26/2001 Post a comment ROUSSET, France-- Atmel Corp. today (March 26) announced an expansion of its alliance in third-generation wireless networks with a company specializing in defense and security communications applications. Under the partnership, Atmel and EADS Defence & Security Networks (EDSN) plan to develop new platforms for all-digital "professional mobile radio" applications worldwide.
TI reshuffles analog, mixed-signal deck News & Analysis 3/23/2001 Post a comment DALLAS--Texas Instruments Inc. has reorganized its analog and mixed-signal business, retaining the group's dual management structure but realigning to better address key end-equipment markets and deepen ties with the company's DSP efforts.
GlobeSpan lowers Q1, Q2 outlook, citing customers' inventory News & Analysis 3/15/2001 Post a comment GlobeSpan Inc., a DSL chip leader, has lowered its expectations for the first and second quarters of 2001. The Red Bank, N.J., company now expects to report net revenue of $105 million to $115 million for the first quarter, representing a sequential decline from the fourth quarter of 12% to 20%.
TI to close 6-inch analog fab in California News & Analysis 3/14/2001 Post a comment DALLAS -- Texas Instruments Inc. today (March 14) announced it will close its 6-inch wafer fab in Santa Cruz, Calif., which primarily produces analog ICs for hard disk drives. Products from that fab will be transferred to other manufacturing plants in Dallas and Houston, said TI.
Logicvision plans on-chip test for mixed-signal SoCs News & Analysis 3/14/2001 Post a comment Looking to suppress rising test costs, Logicvision Inc. (San Jose, Calif.) is working to bring on-chip testing to mixed-signal IC designs that include analog-to-digital (A/D) converters. The company is now working with a group of customers to develop techniques and intellectual property to test a selection of typical converter architectures, said Rodger Sykes, vice president of marketing and business development at Logicvision.
Design classics: the function generator News & Analysis 3/13/2001 Post a comment If you ask a hundred engineers who created the commercial function generator, at least 99 will tell you it was Wavetek which was not quite the case. It's close, but there are several people who could vie for credit.
'Plenty of work' for power engineers News & Analysis 3/12/2001 Post a comment Power engineers may feel insulated from the shocks of today's economic anemia. According to Dennis Nickerson of Survival Systems Staffing, "There's more caution, but there's still plenty of work."
TSMC 'ready for production' in 0.13-micron mixed-signal processes News & Analysis 3/7/2001 Post a comment HSINCHU, Taiwan --Taiwan Semiconductor Manufacturing Co. Ltd. today (March 7) announced it is now ready to begin foundry production of 0.13-micron mixed-signal devices, and the company claimed will have as many as 40 customer chip designs ready for production in all of its 0.13-micron processes by June.
ON Semi to expand production, design in China News & Analysis 3/7/2001 Post a comment Motorola spinoff ON Semiconductor plans to invest $100 million in China to expand its manufacturing joint venture in Sichuan province and establish a design center in Shanghai. The company said the new facilities will design, manufacture and test power management ICs as well as an existing line of discrete semiconductors.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.