Zarlink to sell U.K. plant to X-Fab and receive foundry services News & Analysis 3/28/2002 Post a comment PLYMOUTH, England -- Canada's Zarlink Semiconductor Inc. today announced it has found a buyer for its wafer fab here. X-Fab Semiconductor Foundries AG of Erfurt, Germany, has agreed to buy the facility for $30 million--$12 million in cash on closing of the transaction and $18 million in secured notes payable over three years, the two companies said.
Alpha Industries cuts forecast due to weakness in wireless systems News & Analysis 3/28/2002 Post a comment WOBURN, Mass.--Alpha Industries Inc. today lowered its forecast for revenues in the current fiscal quarter to $28 million and it predicted an adjusted net loss of $0.11-to-$0.13 per share because unexpected weakness in wireless infrastructure markets and delays in orders for radio-frequency (RF) semiconductors used in handsets.
Multipoint standard boosts LVDS News & Analysis 3/25/2002 Post a comment Low-voltage differential signaling, or LVDS (TIA/EIA-644), has become extremely popular because of its high-speed and low-power characteristics for a wide range of applications.
Diverse IP cranks noise control headaches News & Analysis 3/25/2002 Post a comment If you ask designers of high-speed printed-circuit boards about signal integrity, chances are they know all about the interactions of "aggressors" and "victims" and the nasty things that can happen to logic signals clocked at near-gigahertz rates.
TI's analog business hits a bump News & Analysis 3/22/2002 Post a comment Texas Instruments Inc. has grown accustomed to sitting atop the analog IC and DSP pecking order. But now the company's No. 1 analog status is endangered, due principally to its overexposure to the electronics industry's communications sector, which fell into a well in 2001.
Dialog Semi expects to recoup some money from U.K. foundry in IR purchase News & Analysis 3/21/2002 Post a comment KIRCHHEIM, Germany -- Dialog Semiconductor Plc today said it will receive about 6 million euros ($5.3 million) from International Rectifier Corp.'s acquisition of European Semiconductor Manufacturing Ltd., a sub-micron silicon foundry company based in Wales. On Monday, U.S.-based IR announced it was buying the assets of ESM for $81 million in cash to expand its production of mixed-signal and power semiconductors (see March 13 stor
Intersil/Elantec merger to create new force in analog News & Analysis 3/20/2002 Post a comment
The new Intersil faces tough challenges in all its markets, Beyer said. In power management, there is Maxim and Linear Technology. In flat-panel drivers, there's Analog Devices and National Semiconductor. In optical storage, Intersil competes against Sony's internal development. And in WLAN, there's Agere.
Harmonic balance simulation speeds RF mixer design Design How-To 3/20/2002 Post a comment Harmonic-balance simulators and electromagnetic analysis tools are becoming essential to RF mixer design. New balun structures for RFICs are key to matching impedances at high GHz-requencies. An AWR scientist offers some pointers on mixer-design using contemporary modeling tools.*
NEC targets cell-based routable ASICs at 'mid-volume' applications News & Analysis 3/18/2002 Post a comment TOKYO -- In a move to create a new class of ASIC products for "mid-volume" applications, NEC Corp. today introduced a functional-block chip architecture, which allows customers to quickly route pre-existing cells on ICs for custom designs using two upper layers of metal--just like a gate array.
Sarnoff launches IP core strategy for ICs in TV, digital video News & Analysis 3/12/2002 Post a comment SAN FRANCISCO -- New Jersey-based Sarnoff Corp. today announced a new silicon core strategy to offer intellectual property (IP) design blocks for integrated circuits in TV and digital video applications. The IP core series includes a "smarter" MPEG function, which the company says improves pictures and reduces storage requirements.
LVDS for signal distribution in 3G basestations News & Analysis 3/12/2002 Post a comment High speed 3G mobile communications promise to deliver media-rich content for cell phones by means of W-CDMA, EDGE, and CDMA2000 protocols via the Internet. To provide the bandwidth, the cellular base-stations (which interface wireless handsets to the wireline networks) will need to process and distribute exponentially greater amounts of digital data. This feature makes the case for Low Voltage Differential Signaling (LVDS) as the means of moving data at high speeds across backplanes, through c
U.S. startup targets InP and GaAs optical front-ends, gears indium-phosphide fab News & Analysis 3/11/2002 Post a comment SUNNYVALE, Calif. -- Optoelectronics IC startup OEpic Inc. today announced it has raised more than $30 million in investments to serve high-speed optical networks with complete front-end chip-set solutions, based on compound semiconductors. In the second quarter, the 21-month-old startup plans to begin shipping samples of its first indium-phosphide (InP) IC products made in a fully equipped wafer fab here.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.