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posted in March 2009
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AMS : Portable OTDR offers outstanding resolution
Product News  
3/6/2009   Post a comment
AMS Technologies offers the portable high resolution OTDR, LOR-200 manufactured by Luciol Instruments.
RFID sees continued growth
Product News  
3/6/2009   1 comment
Having reached the a high degree of maturity, the RFID technology will continue its growth over the years to come — not despite but because of the crisis, says German industry association Bitkom.
IDC sees bright spots amid chip downturn
News & Analysis  
3/6/2009   Post a comment
Embedded processors and connectivity chips are bright spots in a semiconductor market that will see double-digit dips in computer and cellular chip sales in 2009, said Mario Morales, vice president of global semiconductor research at International Data Corp.
Marvell cuts 15% of workforce as revenue plummets
News & Analysis  
3/5/2009   Post a comment
Marvell Technology Group will cut its workforce by 15 percent in an effort to reduce costs after the company swung to a loss in the quarter ended Jan. 31 as revenue declined 35 percent sequentially and 39 percent year-over-year.
'Virtual Cocoon' aims to engage all senses
News & Analysis  
3/5/2009   Post a comment
By engaging all five senses in a wrap-around headset, a team of scientists are aiming for what they call "real virtuality," a term used to describe their goal of rendering an experience so vivid that the user cannot tell it from the real thing.
WIRELESS/RF: SenSiFi WiFi sensor module promises battery life of 3+ years
Product News  
3/5/2009   Post a comment
Redpine Signal's 802.11n single stream module provides all control and wireless functionality to build and deploy wireless sensor nodes
Vishay releases new 20 V P-Channel TrenchFET Gen III Power MOSFET
Design How-To  
3/5/2009   Post a comment
Vishay Intertechnology has unveiled the first device built on its new p-channel TrenchFET Gen III technology, a 20-V device with the lowest on-resistance ever achieved for a p-channel MOSFET with the footprint area of an SO-8.
Analysis: Automotive software, hardware focuses on head unit
Design How-To  
3/5/2009   Post a comment
Several announcement of this week target to the same direction: The automotive head unit. There are reasons why this computer will be a highly competitive place. And why now is the time for future players to claim their stake.
RFMD : Front end modules target mobile Wi-Fi market
Product News  
3/5/2009   Post a comment
RF Micro Devices has expanded its Wi-Fi product portfolio with three front end modules (FEMs): the RF5325, RF5345 and RF5725.
ZMD : A-D converters suit automotive real-time applications
Product News  
3/5/2009   Post a comment
ZMD’s SARah family of successive-approximation (SAR) analog-to-digital converters now meets the rigorous requirements of the AEC-Q100 automotive industry standard.
Silicon Labs : 25 MIPS CPU has touch sensing feature
Product News  
3/5/2009   Post a comment
Silicon Laboratories has announced the C8051F7xx family of high pin-count MCUs for cost-sensitive, high I/O embedded systems.
RS-485/422 transceivers eliminate external isolated supply
Product News  
3/5/2009   Post a comment
Analog Devices' ADM2587E and ADM2582E integrated interface devices deliver signal and power isolation to 2.5 kV in small footprint for industrial-communications applications.
Avoid the crowds at ESC booth events
Product News  
3/4/2009   Post a comment
Know what's going on in the booths, and get there first
Video: How TriQuint amp'd its RF mojo
News & Analysis  
3/4/2009   Post a comment
After a record-setting 2008, numerous corporate and executive-level awards and then a drop in revenue in Q1 as the downturn hit hard, TriQuint's CEO Ralph Quinsey spent time with EETimes' TechOnline to discuss the company's success and the future of wireless and innovation.
Smartphone shipments to grow 6-11%, iSuppli says
News & Analysis  
3/4/2009   Post a comment
Global shipments of smartphone handsets are projected to increase between 6 and 11 percent in 2009, reaching as high as 193.3 million units, according to market research firm iSuppli.
Wireless 101: Peak to average power ratio (PAPR)
Design How-To  
3/4/2009   1 comment
Here's how to calculate peak to average power ratio (PAPR) for single-tone signals, multi-tone signals, and IF signals.
Atmel : System-in-package suits LIN networking
Product News  
3/4/2009   Post a comment
Atmel’s ATA6617 system-in-package (SiP) solution for LIN automotive networking applications combines the company’s LIN system basis chip (SBC) ATA6624 – including LIN transceiver, voltage regulator, watchdog – and an AVR microcontroller (ATtiny167 with 16k flash memory) in a single package.
Flyback regulator design eliminates optocoupler and external MOSFET
Design How-To  
3/4/2009   Post a comment
Flyback converters are widely used in DC/DC supplies -- not because they are simple to design, but because they can offer low-power isolated requirements.
Irwin Jacobs steps down from Qualcomm chair
News & Analysis  
3/4/2009   Post a comment
Irwin M. Jacobs, a Qualcomm co-founder who served as the company's CEO for 20 years, stepped down from his position as Qualcomm's chairman. He will remain a member of the company's board of directors.
Software stack and reference designs target next generation RF remote controls
Product News  
3/4/2009   Post a comment
GreenPeak announces software stack and reference designs that are compliant with the new RF4CE Standard developed by Panasonic, Philips, Samsung and Sony.
Software speeds RF design
Product News  
3/4/2009   Post a comment
Agilent Technologies' new System-Level Communications Design software speeds PHY development cycle
ADI expands RF chip line
Product News  
3/3/2009   Post a comment
Analog Devices Inc. (ADI) has introduced a family of five single-channel RF mixers for high-dynamic-range applications within satellite communications, wireless base stations, point-to-point radio links, instrumentation, and military equipment.
SIGNAL CHAIN BASICS (Part 27): Control EMI resulting from board-level clock distribution
Design How-To  
3/3/2009   1 comment
Use shielding, decoupling, careful layout, and changes to the clock-source characteristics to beat EMI induced by clock distribution on your PC board
MEMS micro scanner finds application in surveillance
Product News  
3/3/2009   Post a comment
Commercial application of a MEMS scanning device developed by Fraunhofer IPMS has been demonstrated at the Smart Systems Integration (SSI) 2009 show.
6W LED driver integrates DC-DC Boost Converter for large LCDs
Product News  
3/3/2009   Post a comment
Maximising efficiency is the name of the game when backlighting large LCD panel applications.
Sperry vertical gyro for Boeing 747
Teardown  
3/3/2009   4 comments
Surplus hardware reveals beauty in electromechanics.
Updated: Fabless firms move up in top 20 IC vendor ranking
News & Analysis  
3/3/2009   Post a comment
Qualcomm jumped from No. 13 to No. 8 in the world in semiconductor revenue in 2008 while rival fabless chip vendor Broadcom leapt six positions to rank 17, according to a list of the top 20 chip vendors published by market research firm IC Insights.
WIZnet expands from wired to wireless focus
Product News  
3/3/2009   Post a comment
WIZnet offers an 802.11bg WLAN Access Point module a pin-head package.
Optocoupler provides high noise immunity
Product News  
3/3/2009   Post a comment
Fairchild Semiconductor is targeting its FOD8001 optocoupler at industrial system designers engineers looking to design an industrial fieldbus network with low transmission error rates, low system failure rates and proven reliability over an extended period of time.
Flyback controller in ThinSOT operates at 150 degrees C
Product News  
3/3/2009   Post a comment
Linear is offering an H-Grade version of the LTC3803, a current mode flyback DC/DC controller in a tiny 6-pin ThinSOT package specified from -40°C to +150°C operating junction temperature.
RF Micro cuts 2% of workforce
News & Analysis  
3/3/2009   Post a comment
RF Micro Devices cut about 100 jobs, or about 2 percent of its global workforce. It is the fourth round of layoffs announced by the company in the past 11 months.
RFID Technology and Testing
Design How-To  
3/2/2009   Post a comment
Transient signals, bandwidth inefficient modulations, backscattered data and passive tags all require special measurement capabilities not commonly found in traditional test instruments. This article examines RFID and NFC technologies and their associated test and measurement requirements.
Infineon chip brings analog phones to ADSL lines
Product News  
3/2/2009   Post a comment
With two ADSL2+ chips, Infineon claims it creates a technical basis for telcos to reduce the costs for their infrastructure. The devices aim at the market for customer premises equipment.
The quiet SDR revolution
Signal Processing DesignLine Blog  
3/2/2009   5 comments
SDR is rapidly becoming a mainstream technology. So where's the fanfare?
RF chips to fare better in '09, says analyst
News & Analysis  
3/2/2009   Post a comment
Projections for the overall semiconductor industry in 2009 are dire, but favorable trends in the handset market should keep the market for RF chips from crashing this year and ready to bounce back more quickly than many industry segments, according to an analyst.
IBM researchers discover way to cool carbon transistors
News & Analysis  
3/2/2009   Post a comment
IBM researchers claim to have found a possible means of cooling carbon-based transistors by directly coupling their electric current fields with those of a silicon substrate.
AMS Technologies : Laser diode driver allows simple PC control
Product News  
3/2/2009   Post a comment
AMS Technologies presents the FL593FL, a combination of evaluation board and laser diode driver for remote control from Wavelength Electronics.
12-bit ADC provides high dynamic performance for input frequencies above 500 MHz
Product News  
3/2/2009   Post a comment
TI has introduced a monolithic 12-bit, 550-MSPS ADC, which provides more than 200 MHz of signal bandwidth in applications where high resolution, accuracy and linearity are critical.
Sin(x)/x interpolation: an important aspect of proper oscilloscope measurements
Design How-To  
3/2/2009   5 comments
Making accurate digital scope measurements requires an understanding of the interpolation process
Global 'averaged' chip sales fell 28.6% in January, says SIA
News & Analysis  
3/2/2009   Post a comment
The three-month average of worldwide sales of semiconductors declined by 28.6 percent in January 2009 to $15.33 billion, compared to sales of $21.47 billion in January 2008, averaged on the same basis, according to the Semiconductor Industry Association (SIA), which referenced World Semiconductor Trade Statistics as its source.
Dresden establishes Energy Efficiency Innovation Center
Product News  
3/2/2009   Post a comment
German research organization Fraunhofer Gesellschaft and the Technical University of Dresden have launched the Energy Efficiciency Innovation Center. The research topics cover a broad range from photovoltaics and energy-efficient lighting to fuel cell technology and surface technologies aiming at reducing friction losses for vehicles.
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