'Missing link' memristor created: Rewrite the textbooks? News & Analysis 4/30/2008 10 comments HP Labs' Stanley Williams has invented the world's first memristor, the 'missing link' in circuit theory--a fourth passive-device type after resistors, capacitors and inductors--as predicted by University of California at Berkeley professor, Leon Chua.
Broadcom switch paves road to 40G News & Analysis 4/29/2008 Post a comment Companies driving to 40 Gbit/s Ethernet could settle on a single proposal as early as their next meeting, thanks in part to a recent switch from Broadcom which unveiling a range of new 65nm Ethernet chips at Interop.
PA powers EGSM WCDMA networks Product News 4/29/2008 Post a comment Engineered specifically for use in advanced 3G handsets for EGSM (Band 8) UMTS wireless networks, Anadigics' WCDMA linear power amplifier (PA) reduces average current consumption by 75 percent compared to competing devices.
Agilent EEsof enhances ADS Product News 4/29/2008 Post a comment In this version, the company reports a 10x speedup in its 3D planar electromagnetic (EM) simulator (known as Momentum), and a 10X speedup in its non-linear harmonic balance circuit simulation with an advanced matrix preconditioner.
Ensuring low power in wireless mesh sensor networks Design How-To 4/29/2008 Post a comment Wireless sensor communications and low power go hand in hand. In fact, low power is just as important as the reliability of the communications itself. Before the advent of wireless sensor communications, low power was synonymous with low current consumption.
Cadence boosts analog verification performance News & Analysis 4/29/2008 Post a comment Against the background of ever-increasing complexity in integrated circuit design, Cadence on its house fair Cadence Live EMEA 2008 introduced a major upgrade to its Virtuoso design platform. The enhancement aim at typical European user environments, centering on performance improvement in the verification of large analog designs.
Teridian launches third generation power meter ICs Product News 4/29/2008 Post a comment Teridian Semiconductor has launched its third generation of electricity metering chips that includes residential single phase, commercial and industrial three phase ICs, offering up to 256K bytes of storage with 10 MIPS processing power, advanced power management, LCD contrast adjust, and 0.5 second/day hardware RTC which consumes only 0.5µA.
RF transceiver targets WiMAX Product News 4/29/2008 Post a comment Maxim Integrated Products reports it has the industry's first production-ready, single-chip, 2.3GHz to 2.7GHz, WiMAX MIMO RF transceiver that improves receiver SNR by 10dB
MIPS forges link with Portuguese University News & Analysis 4/29/2008 Post a comment MIPS Technologies announced that it is to partner with the Faculdade de Engenharia da Universidade do Porto (FEUP), a leading school of engineering in Portugal, to further innovation and technical advancement in microelectronics.
Under the Hood: Inside the Sony OLED TV Teardown 4/29/2008 1 comment For its XEL-1, the first commercial OLED TV, Sony made some interesting design and component choices to realize an 11-inch-diagonal screen that is only 3 mm thick. See what devices make up this ground-breaking display that is a harbinger of exciting times ahead.
Leadis rolls out standalone Class-G headphone amplifiers Product News 4/28/2008 Post a comment Leadis Technology Inc. is sampling standalone Class-G headphone amplifiers that are well suited for power sensitive applications such as mobile phones, MP3/PMPs, portable gaming, GPS/PNDs, notebook computers, and other portable audio products with a headphone output.
Software gap in NFC mobile payment vision News & Analysis 4/28/2008 Post a comment Near Field Communication is poised to take off perhaps as early as 2010 as an enabling technology for mobile payment systems using cellphone handsets, but significant pieces of the software infrastructure for this market are missing and silicon opportunities in NFC may be limited, according to an upcoming report from the EE Times Market Intelligence Unit.
Vocoder IC offers full duplex capability Product News 4/28/2008 Post a comment CML Microcircuits has added to its voice coder/encoder (vocoder) family a robust advanced low complexity waveform interpolation (RALCWI) IC dubbed the CMX638 that offers full duplex capability.
Synopsys debuts 5 GHz PCI express core Product News 4/28/2008 Post a comment Synopsys officially rolls out a silicon core for PCI Express 2.0 April 28, claiming the 5 GHz technology is beginning to get attention from designers at a time when experts say the industry is moving at a relatively slow pace down the Express road map.
Epcos acquires NXP's RF MEMS business Product News 4/28/2008 Post a comment Passive component vendor Epcos AG (Munich, Germany) has announced to take over the RF MEMS activities from NXP Semiconductors. Through the move, the company hopes to get access to a triple-million euro market volume.
TSMC wants more of IC pie News & Analysis 4/28/2008 Post a comment Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) has unveiled a new and possibly controversial strategy that involves more collaboration in the early stages of the IC design process.
Battle-hardened veterans of the electronics industry have heard of the “connected car” so often that they assume it’s a done deal. But do we really know what it takes to get a car connected and what its future entails? Join EE Times editor Junko Yoshida as she moderates a panel of movers and shakers in the connected car business. Executives from Cisco, Siemens and NXP will share ideas, plans and hopes for connected cars and their future. After the first 30 minutes of the radio show, our listeners will have the opportunity to ask questions via live online chat.