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Content tagged with Analog ICs
posted in April 2013
Avago buys Javelin Semi
Design How-To  
4/30/2013   1 comment
Firm says acquisition of 3G CMOS PA developer will form foundation of its RF CMOS design and development for its wireless semiconductor division.
Spansion buys Fujitsu's MCU, analog business
Design How-To  
4/30/2013   25 comments
Previously a memory-only company Spansion is leaping into the supply of microcontroller system-chips by acquiring Fujitsu Semiconductor's MCU and analog business.
Spansion buys Fujitsu's MCU, analog business
Design How-To  
4/30/2013   25 comments
Previously a memory-only company Spansion is leaping into the supply of microcontroller system-chips by acquiring Fujitsu Semiconductor's MCU and analog business.
How small vendors compete in analog IC market
Design How-To  
4/29/2013   13 comments
A case study of two AFE ICs confirms a significant potential for small IC vendors.
DARPA refocuses amid terror, funding shifts
Design How-To  
4/25/2013   1 comment
Finding an alternative to GPS is one of DARPA’s goals as it comes to grips with terrorism, a decline in funding and a rise in consumer technology.
Microchip brings PIC16F527 and PIC16F570 integrated op amps to 8-bit PIC MCUs
Product News  
4/25/2013   Post a comment
New MCUs feature on-chip op amps, high-speed comparators, and ADC for general-purpose, signal conditioning and sensing applications.
Exploring photometry applications and trends
Design How-To  
4/24/2013   3 comments
Pulse oximetry is a non-invasive method for monitoring a patient's oxygen saturation and heart rate. Texas Instruments engineers discuss pulse-oximeter trends and engineering advances.
EDA/IP weekly roundup – April 24th 2013
4/24/2013   Post a comment
ARM, Aspen Labs, CEVA, Corelis, Digi-Key, EDAC, IC Manage and Mouser made the lineup today. See here for their news…
Cypress Semi's PSoC shifts into 32-bit phase
Product How-To  
4/24/2013   2 comments
CEO T.J. Rodgers said Cypress is ready to shift PSoC into the 32-bit sector after eking out a chunk of the microcontroller market.
Energy harvesting pioneer named top ACE innovator
News & Analysis  
4/23/2013   1 comment
Yogesh Ramadass was named Innovator of the Year in the ACE Awards for his pioneering work in energy harvesting circuits at MIT and Texas Instruments.
DESIGN West: 'Boring' MCUs need shake up says entrepreneur
News & Analysis  
4/23/2013   1 comment
In an interview at Design West, the new CMO of Energy Micro shares his ideas for injecting innovation into microcontroller market.
FinFET challenges and solutions – custom, digital, and signoff
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4/22/2013   Post a comment
FinFETs pose some design challenges, especially for custom/analog designers. 16/14nm FinFET processes will require some changes to custom/analog and digital implementation flows, as well as parasitic extraction and signoff…
3-D interposers stack chips
News & Analysis  
4/19/2013   2 comments
A silicon interposer technology jointly developed by Silex and BroadPak may bring 3-D chip integration to mass market.
TSMC posts strong outlook
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4/18/2013   Post a comment
Foundry chip maker posts strong 1Q13 financial results, forecasts strong Q2 to follow and raised its capex estimate for 2013.
EDA/IP weekly roundup – April 17th 2013
4/17/2013   Post a comment
Accellera, Altera, ARM, Atrenta, Flexras, Forte, Gold Standard, Hardent, Jasper, Semico, Space Codesign, Symtavision, Synopsys and TSMC made the lineup today. See here for their news…
DAC – here we come – time to SKY
4/16/2013   Post a comment
There are several changes being made to the DAC program this year and I spoke with Yervant Zorian about them. Today we learn about the SKY talks…
Indian chip market set to jump 20% in 2013
News & Analysis  
4/16/2013   Post a comment
Improving consumer confidence means Indian semiconductor consumption in 2013 is set to grow even faster than it did in 2012, according to Gartner analyst.
Getting over my new integration fears
4/15/2013   Post a comment
For someone who "grew up" on integration via increased hardware functionality, it takes some time to get used to integration done by applications software tying ICs together.
Infineon, TI led industrial chip supplier ranks in 2012
Design How-To  
4/15/2013   1 comment
Infineon was the leading supplier of chips for industrial applications in a flat 2012 according to a sales ranking from market analyst Semicast.
Linear Technology Corp.’s LTC6957 is a DC to 300MHz dual output buffer/driver/logic translator
Product News  
4/11/2013   Post a comment
Linear Technology’s dual output sine wave to logic converter uses selectable input filtering for lowest additive jitter.
EDA/IP weekly roundup – April 10th2013
4/10/2013   Post a comment
Altera, ARM, Cadence, Chenming Hu, Cypress Semi, IC Insights, Imperas, Kathryn Kranen, Mentor, Si2 and TSMC made the lineup today. See here for their news…
Atmel acquires IDT’s smart metering IC product line to enhance smart energy offerings
News & Analysis  
4/6/2013   1 comment
Atmel Corporation has completed the acquisition of Integrated Device Technology's smart metering IC product lines and technologies to enhance Atmel's smart energy product portfolio.
Touchstone Semi expands NanoWatt analog IC line to include TS3003, TS3004, TS3005, TS3006
Product News  
4/5/2013   Post a comment
The company’s latest additions include four new 1.55V to 5V, 1.9µA one-resistor-tunable timer ICs.
Texas Instruments DRV2605 haptic driver
Product News  
4/3/2013   Post a comment
TI's latest haptic driver makes it easy to add realistic tactile feedback effects to consumer and industrial products.
Watching Analog Devices' Jerald Fishman up close
4/3/2013   Post a comment
ADI's CEO was a unique character, as so many in our industry are.
Reclaiming lost yield through methodical power integrity optimization
Design How-To  
4/1/2013   Post a comment
You might be meeting your yield acceptance requirements. But you may still not be getting the most from your manufacturing due to effects of dynamic power and power noise integrity in your design. However, design optimization methodologies are available to reclaim the recoverable yield loss... Parts Search

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What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.

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