Spec a year away for 40/100G Ethernet News & Analysis 5/22/2008 Post a comment The IEEE 802.3ba group developing a spec to drive Ethernet at rates of 40 and 100 Gbits/second reports significant progress from its last meeting, but it may take at least another nine months to cook a standard that could be the basis for first-generation products.
Power efficient component selection made simple News & Analysis 5/20/2008 Post a comment Recognising that energy efficiency tends to be a trade off between performance expectations, feature sets and power consumption, National Semiconductor has launched an initiative to help customers optimise their designs for power and performance.
Three-phase 600V IC boosts motor-drive reliability Product News 5/20/2008 Post a comment These rugged 600V three-phase gate driver ICs for motor drive applications feature DC bus sensing and negative voltage spike immunity to protect systems from catastrophic evens seen during high-current switching and short-circuit conditions.
$200 million for one FPGA? Programmable Logic DesignLine Blog 5/20/2008 2 comments Thus far I haven't seen the pricing for Altera's new 40nm Stratix IV FPGAs, but if we were to extrapolate from an analog device I just saw, the result would make your eyes water!
75 dB log detector optimized for 50 Hz to 3 GHz operation News & Analysis 5/20/2008 Post a comment Hittite Microwave Corporation has introduced its fifth logarithmic detector/controller product which is ideal for RF power measurement and control in cellular/PCS/3G, WiMAX, WiBro, fixed wireless, radio link and radar applications over the 50 Hz to 3 GHz frequency range.
Sequans extends mobile WiMAX chip series Product News 5/20/2008 Post a comment French WiMAX chip supplier Sequans Communications SA (La Defense, France) has introduced a mobile single chip solution that is claimed to integrate advanced baseband functionality plus radiofrequency and SDRAM.
Thermal management in digital and RF designs Design How-To 5/19/2008 Post a comment Increased power density, higher wattage components, and the upward spiral in switching frequencies have become the primary drivers in the search for more efficient and cost effective thermal management. In this article, we shall address some of the industry issues and solutions related to thermal management in digital and RF designs.
Capital injection for ambitious SOI pioneers News & Analysis 5/19/2008 Post a comment Existing investors have participated in a second round of investment to fund expansion plans at Belgium based CISSOID, a specialist in high temperature, high reliability components with particular expertise in Silicon-on-Insulator (SOI) technology.
Jennic senses IP wireless sensor net opportunity Product News 5/19/2008 Post a comment Wireless communications chip and software developer Jennic (Sheffield, England) has started sampling a networking stack for the 6LoWPAN low-power wireless Internet Protocol specification, extending the reach of its offerings for the IEEE 802.15.4 networking standard.
De Geus: EDA has to be rethought News & Analysis 5/19/2008 Post a comment Seeing where the EDA industry is going is relatively easy. The difficult bit is laying out an EDA offering at the right time, when customers are ready to take it up, according to Aart de Geus, chairman and CEO of the Mountain View based company. And right now, everything in the EDA space has to be rethought, according to de Geus.
Battle-hardened veterans of the electronics industry have heard of the “connected car” so often that they assume it’s a done deal. But do we really know what it takes to get a car connected and what its future entails? Join EE Times editor Junko Yoshida as she moderates a panel of movers and shakers in the connected car business. Executives from Cisco, Siemens and NXP will share ideas, plans and hopes for connected cars and their future. After the first 30 minutes of the radio show, our listeners will have the opportunity to ask questions via live online chat.