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posted in May 2009
<<   <   Page 3 / 3
Get the Fundamentals
Design How-To  
5/5/2009   2 comments
When I was a junior intern in the late 1970s, I once asked a senior mentor to tell me the secret of his great success as an engineer. After a brief moment of introspection, he replied, "Get the fundamentals."
Machine vision firm Cognex cuts 85 jobs
News & Analysis  
5/5/2009   1 comment
Machine vision vendor Cognex announced additional cost-cutting measures including the elimination of about 85 jobs and reported that first quarter sales fell 30 percent compared to the same period of 2008.
TI's latest Piccolo MCUs feature new Control Law Accelerator (CLA) floating point unit
Product News  
5/4/2009   Post a comment
Texas Instruments announced TMS320F2803x Piccolo microcontrollers (MCUs) featuring the Control Law Accelerator (CLA). Unique to TI's F2803x Piccolo MCUs, the CLA is a 32-bit floating-point math accelerator that operates independently of the C28x core, allowing for direct access to on-chip peripherals and parallel execution of algorithms.
Austriamicrosysteme proposes short-time working
News & Analysis  
5/4/2009   Post a comment
Analog chip provider Austrimikrosysteme International AG (Unterpremstatten, Austria) has proposed to the authorities and its workforce that the company go on part time working from June 1 for up to six months.
A Fully Integrated, Robust Solution for Interfacing with Hall-Effect Sensors
Design How-To  
5/4/2009   Post a comment
This technical paper provides an overview of Hall-effect sensors, particularly the use of two-wire, Hall-effect digital switches in automotive and industrial applications.
LNA line features pHEMT, SiGe technologies
Product News  
5/4/2009   Post a comment
Skyworks Solutions' new product line supports high performance requirements for GPS, infrastructure, ISM band, satellite radio and WLAN applications.
SensorDynamics takes on ADI, Bosch in MEMS business
Product News  
5/4/2009   Post a comment
With multiple inertial sensors combined in one package, automotive MEMS startup SensorDynamics (Graz, Austria) plans to compete against industry heavyweights such as Analog Devices and Bosch group.
Texas Instruments : A-D converters suit temperature measurement
Product News  
5/4/2009   Post a comment
A family of 24-bit, low-noise temperature measurement analog-to-digital converters from Texas Instruments feature industry leading power consumption and integration.
AnalogicTech : Class D audio amplifier operates from 2.1 to 5.5 V
Product News  
5/4/2009   Post a comment
The AAT5101 is AnalogicTech’s first Class D audio amplifier. The 2.5-W rated IC delivers substantial power savings by combining low voltage operation with low quiescent current and standby current.
Vishay : 20-V power MOSFET has 2 x 2-mm footprint
Product News  
5/4/2009   Post a comment
Vishay has introduced a dual 20-V p-channel TrenchFET Gen III power MOSFET which claims the lowest on-resistance ever achieved for a dual p-channel device in the thermally enhanced PowerPAK SC-70 2 x 2-mm footprint area.
Automotive headphone amplifiers protect outputs from shorts
Product News  
5/4/2009   Post a comment
Maxim Integrated Products has introduced the MAX13330/MAX13331 automotive, stereo headphone amplifiers that are designed to protect outputs against shorts to battery/ground and load dump up to 45V.
Motorola's "Green Phone" renews and recycles
Design How-To  
5/4/2009   1 comment
With the W233 Renew, Motorola attempts to oblige with a carbon-neutral, mostly recyclable entry-level GSM offering.
What's the status of RFID?
RF & Microwave Designline Blog  
5/2/2009   Post a comment
Is radio-frequency identification catching on as predicted? The answer, as you might expect, is: it depends who's asking.
1394 Automotive network enables powerful, cost-efficient in-vehicle networks for infotainment, navigation, cameras
Design How-To  
5/1/2009   Post a comment
A Fujitsu engineering makes the case for the 1394 Automotive network specification, arguing that it outperforms other infortainment network technologies in terms of bandwidth, flexibility, cost effectiveness and technological features.
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