What's up with silicon on sapphire? Design How-To 5/31/2011 5 comments Dr. Mark L. Burgener and Dr. Ronald E. Reedy, co-founders of Peregrine Semiconductor will be presented with the Noble award at IMS2011. I thought this would be a great opportunity to check in with them on the status of their work.
Zarlink tips 5% job cuts on 'strong' results News & Analysis 5/27/2011 13 comments Canadian mixed-signal chip company Zarlink Semiconductor Inc. has said it plans to reduce its global workforce by approximately 5 percent by the end of fiscal Q2 2012, which ends in September 2011. Zarlink (Ottawa, Ontario) made the announcement within its statement of its fourth fiscal quarter and 2011 fiscal year results.
Audio subjectivist vs. objectivist debate Audio DesignLine Blog 5/25/2011 4 comments The audio subjectivist vs. objectivist debate has flared up once again, this time triggered by a critical hardcore engineering-based review of a popular DIY audiophile headhone amp.
Marvell to invest $200 million in Israel R&D News & Analysis 5/23/2011 1 comment Communications chip company Marvell Technology Group Ltd., is reportedly planning to invest $200 million in its Israel R&D operation. The company's co-founders – Sehat Sutardja, CEO, chairman, and Weili Dai, chief operating officer – who are also husband and wife, are reportedly visiting Israel.
NXP demos car-to-x communications platform News & Analysis 5/22/2011 Post a comment As part of the Automotive Week 2011 which took place this week in Eindhoven (The Netherlands), chipmaker NXP demoed a car-to-x communications platform based on the company's software-defined multi-standard digital radio platform.
CSR co-founders form M2M wireless startup News & Analysis 5/19/2011 3 comments Several co-founders of Cambridge Silicon Radio, now CSR plc, have combined with others to form Neul Ltd. with the aim of creating a global wireless network business for machine-to-machine communications.
ADI beats estimates, sees Japan quake upside News & Analysis 5/18/2011 2 comments Analog Devices reported sales and profit for the quarter ended April 30 that exceeded consensus analysts' expectations, with the company's top executive partially crediting accelerated demand related to uncertainty created by the March 11 earthquake and tsunami in Japan.
Payload efficiency: MOST and Ethernet square off Design How-To 5/16/2011 Post a comment This article discusses the payload efficiency of MOST and Ethernet and the derived influence on the network architecture of vehicles with high bandwidth needs. Furthermore, ideas for coexistence of these competing technologies are described.
Mouser launches medical applications site News & Analysis 5/15/2011 1 comment With Medical electronics now representing one of the fastest growing industries, and is projected to grow more than threefold over the next five years, Mouser’s Medical Applications microsite will be devoted to patient monitoring and diagnosis applications.
No wafer shortage for TSMC News & Analysis 5/12/2011 1 comment Leading foundry Taiwan Semiconductor Manufacturing Co. Ltd. does not expect to see any short- to medium term supply-side disruption from the aftermath of the Japan earthquake and tsunami, according to Maria Marced, president of TSMC Europe.
NXP: No-big-chip-in-the-middle strategy Blog 5/11/2011 16 comments Mike Noonen, NXP's senior vice president for global marketing and sales, describes his company's strategy as "no big chip in the middle"--a handset or media tablet without that big fat SoC hogging all the real estate.
MOST150 optimizes data bus efficiency Design How-To 5/9/2011 Post a comment The MOST150 infotainment bus system is about to take the place of earlier MOST systems. With its high bandwidth which can be utilized up to nearly 100%, MOST150 is a viable platform for advanced next-gen infotainment systems. Daimler already has gathered experience with the new bus.
NXP unveils CGVxpress high speed serial interface Product News 5/4/2011 Post a comment NXP Semiconductors N.V. has unveiled an extension to its high speed data converter technology portfolio and the next generation of the CGV high speed serial interface announced in 2009. CGVxpress will be used in future NXP ADC and DAC product families.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.