How to design a low power wireless sensor network Design How-To 7/17/2009 Post a comment Driven by the demand for "green" technology and better use of power, a new generation of extreme low power wireless networks is being developed for use in machine to machine networks. With this in mind, a new approach towards truly wireless networks is needed.
Nano2012 R&D program is officially launched News & Analysis 7/17/2009 Post a comment On a visit today (July 17) at STMicroelectronics' site in Crolles, France, Christine Lagarde, French Minister of Economy, Industry and Employment, officially launched the Nano2012 R&D program aimed at strengthening Europe's electronics industry by providing competitive access to the most advanced CMOS technologies from 32-nm down to 22-nm.
Kyocera : SAW filters feature high selectivity at 2.6 GHz Product News 7/17/2009 Post a comment Kyocera has developed two types of compact Surface Acoustic Wave (SAW) filtersSF3030B2G 600T10MAL0 for reception and SF2525E2G620T10MAH0 fortransmissionthat dramatically improve the prevention of radio wave interference in next-generation high-speed wireless communication networks such as WiMAX.
When good grounds turn bad--isolate! Design How-To 7/17/2009 Post a comment
To make designers aware of these design pitfalls, this article explains where ground potential differences originate in the electrical installation, how ground loops are created unintentionally, and how isolation circumvents both conditions to yield a robust data-transmission system.
Cypress beats Q2 expectations News & Analysis 7/16/2009 Post a comment Cypress Semiconductor said second quarter revenue increased 12 percent sequentially, while President and CEO T.J. Rodgers said company management is "cautiously optimistic" on the pace of the chip industry recovery.
Real-time clocks are small and thin Product News 7/16/2009 Post a comment Claiming to be up to 73% smaller and 45% thinner than the competition, these real-time clocks simplify design of utility E-meters, multifunction printers, digital photo frames and many other portable devices.
Group harvested to demo energy harvesting platform News & Analysis 7/16/2009 Post a comment Wireless networking chip and modules group Jennic (Sheffield, England) has demonstrated a platform that harvests thermal, solar, RF and vibrational energy, to power wireless sensor networks based on the IEEE802.15.4 standard such as ZigBee PRO and 6LoWPAN.
edXact to release enhanced EDA tools at DAC Product News 7/15/2009 Post a comment At the approach of the 46th Design Automation Conference in San Francisco, Calif., edXact SA, French EDA startup specializing in parametric extraction and physical verification, announced it will launch version 3.1 of its Comanche parasitic rule checking analyzer and version 4.3 of its Jivaro simulation acceleration software.
A holistic approach to addressing the hot component issue Design How-To 7/14/2009 Post a comment As service providers strive to meet growing government demands for "green" compliance, as well as their own financial desire to reduce operating expenses, the problem of heat dissipation has developed into a hot button issue amongst the semiconductor industry in addressing these concerns. This design article from TI takes a look at some holistic solutions to this dilemma.
Using smart drivers to save energy for long transmission lines Design How-To 7/14/2009 Post a comment
The power dissipation that occurs when transmitting signals along long lines, wires or cables can be reduced using a smart driver concept. With the high signal levels of 24V used in control engineering in particular, this potential saving is an advantage in using a line driver device.
12-bit quad DAC integrates EEPROM Product News 7/14/2009 Post a comment Targeting battery powered and power-constrained applications, Microchip has debuted a 12-bit quad digital-to-analog converter (DAC) that includes non-volatile EEPROM.
Ethernet I/O units feature a 64-channel 16-bit A/D interface Product News 7/13/2009 Post a comment Acromag has released an analog input module for their EtherStax series of rugged Ethernet I/O. Designed for distributed I/O and SCADA applications, the ES2163 and ES2164 models perform 16-bit A/D conversion on up to 64 single-ended DC current or voltage inputs, respectively, and interface the signals to Ethernet devices or controllers with Modbus TCP/IP or UDP/IP protocol communication.
Actel begins shipping development kit for Fusion mixed-signal FPGAs Product News 7/13/2009 Post a comment Actel Corporation (Mountain View, California, USA) has begun shipping the Fusion Advanced Development Kit, which features Actel Fusion mixed-signal FPGAs and enables the development of system and power management applications in a single board with multiple on-board voltage regulators, an array of indicator LEDs, and an OLED display to provide direct feedback on flag status, system messages, and voltage, temperature, or current readings.
Market for thin film IPDs set to grow fatter News & Analysis 7/13/2009 Post a comment The market for thin film integrated passive devices (IPD) is set to grow from $615 million this year to be worth just over $1 billion by 2013 and $1.8 billion two years later, according to market trackers Yole Developpement (Lyon, France).
RF links come home Blog 7/11/2009 4 comments Even simple wired links in the home are succumbing to the lure and benefits of basic RF connectivity
Report: Q2 chip sales up 16% from Q1 News & Analysis 7/10/2009 Post a comment The IC market embarked on the road to recovery in the second quarter, growing 16 percent compared to the first quarter, one of the best sequential growth rates in the past 25 years, according to a market research firm.
The invention of the electric motor Industrial Control DesignLine Blog 7/10/2009 2 comments I just wanted to point people to an interesting article from Mechanical Engineering regarding the invention of the electric motor by Thomas Davenport.
Huge take-up seen for accelerometers in cellphones News & Analysis 7/10/2009 Post a comment Good news for suppliers of MEMS based accelerometers such as STMicroelectronics, Kionix Inc., Freescale and ADI. A report from market trackers iSuppli predicts that by next year, one out of three mobile phones shipped worldwide will include one, up from one out of five in 2009, and one out of 11 in 2008.
Selection and integration of MEMS-based motion processing devices Design How-To 7/8/2009 1 comment Measuring and intelligently processing the movements of devices in three dimensional spaces is the next major disruptive technology that will drive innovation in consumer electronics. This feature will examine four critical factors involved in the selection and integration of this technology.
Linear device gets designed into Mitsubishi all-electric car News & Analysis 7/7/2009 Post a comment Linear Technology's multi-cell battery monitoring IC got a design win for Mitsubishi Motors' zero-emissions i-MiEV -- Japan's first all electric car. Calling the auto industry entering "an innovation cycle," Lothar Maier, CEO of Linear Technology, expects Linear's automotive revenue to double to 20 percent in the next few years.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.