TI says it won't rush Burr-Brown merger; Tucson fab upgrade considered News & Analysis 8/31/2000 Post a comment TUCSON, Ariz. -- Now that Texas Instruments Inc. has completed its $7.6 billion acquisition of Burr-Brown Corp., the real tricky part of M&A has begun--merger. Top TI officials promise to take a steady-but-not-hurried pace in merging the venerable analog chip supplier into Texas Instruments. In doing so, TI will put customer requirements ahead of merger activities, and it will consider upgrading Burr-Brown's 4-inch wafer fab in Tucson, while maintaining existing foundry agreements, said managers
On Semi to triple R&D and target power management, broadband ICs News & Analysis 8/31/2000 Post a comment PHOENIX -- On Semiconductor today announced plans to triple spending on research and development by 2001, compared to 1999 levels, with a long-term target of R&D expenditures set at 5-to-6% of revenues after next year. The year-old spin-off from Motorola Inc. spent about $37 million on R&D in 1999, which represented 2.3% of its revenues.
Philips aims analog frontend ICs at range of CCD camera segments News & Analysis 8/29/2000 Post a comment EINDHOVEN, the Netherlands -- Philips Semiconductors today announced a new family of analog frontend (AFE) chips that provide 10- and 12-bit resolution for digital still cameras and camcorders. The new integrated analog chips are aimed at a range of professional and consumer camera market segments, supporting charge-couple device (CCD) applications with speeds of 18-to-40 million samples per second (MSPS).
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.