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posted in August 2002
RF system-in-package competes with SoCs
News & Analysis  
8/26/2002   Post a comment
We regard multichip module (MCM) BGA as an enabling technology that provides high-reliability, compact size, faster time to market and reduced costs for RF circuits.
QFN packages quell noise, cost, space in handhelds
News & Analysis  
8/26/2002   Post a comment
One of the most cutting-edge packaging technologies to recently emerge in the electronics marketplace is the quad flat no leads (QFN)-type package.
IC packaging raises modeling, layout concerns in communications design
News & Analysis  
8/26/2002   Post a comment
IC packaging, typically an afterthought in the design of a new-generation SoC, is particularly troublesome for communications circuits and high-speed interface circuits.
CAD tackles package parasitics
News & Analysis  
8/26/2002   Post a comment
RF and mixed-signal (RF-AMS) IC design is already very challenging today, without designers' having to worry about the electrical, thermal and yield effects of the chip package.
BGAs jump speed/density barrier
News & Analysis  
8/26/2002   Post a comment
The combination of large, complex devices with hundreds of pins and densely packed system layouts has led to the proliferation of ball grid array packages.
Current feedback op amps save power in fast photodiode applications
News & Analysis  
8/20/2002   Post a comment
Current Feedback Amplifiers offer high bandwidth with minimal power supply current draw. However, they are rarely used as transimpedance amplifiers in photodiode applications because of the high current noise associated with their inverting inputs. A Linear Technology apps engineer shows how to get mileage from a unity gain configuration.
Dc-dc converter serves MEMS bias voltages
News & Analysis  
8/18/2002   Post a comment
MEMs bias often require up to 100V, albeit with a low current output. A Maxim engineer shows a boost dc-dc with outputs 36V from a 5V supply.
Spreadsheet explains decibels as voltage and power
News & Analysis  
8/18/2002   Post a comment
dB, or decibels -- are one of the most useful -- but misunderstood units in all of electronic design. Part of this confusion comes from the fact that some decibel units are units of power, and some are units of voltage. More confusion arises when it is necessary to convert between decibel units, or to convert from a power measurement to a voltage measurement. TI's Bruce Carter describes the decibel, and holds out a spreadsheet that will help designers with their dB measurements.
LVDS splitter simplifies high-speed signal distribution
News & Analysis  
8/8/2002   Post a comment
Multipoint operation speeds data distribution on a high-speed bus. This Maxim applications guru offers pointers for addressing multiple receivers on an LVDS line.
Merged voice and data means lower voltages for communications systems
News & Analysis  
8/8/2002   Post a comment
The transition from traditional telephony to converged voice and data with Internet Protocols has some interesting implications for power conversion in data communications systems. For one thing, the traditional --48V power bus must be converted to increasing lower voltages for new-generation logic. Fairchild's go-to guy on power issues, Reno Rossetti, discusses the trend and offers some power conversion examples - complete with applications schematics.
Proper board layout makes switchers work right the first time
News & Analysis  
8/8/2002   Post a comment
The stability of a switching power supply is the consequence of a number of factors, including the choice of regulator ICs and filter components. But as National's Sanjaya Maniktala points out, the printed circuit board layout can have a critical effect on switcher stability. The inductive effects of the PCB traces will effect buck and boost regulators very differently. Every once of copper makes a difference, says Sanjaya, in this thorough and informative analysis.


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