Atmel joins German R&D center for advanced analog ICs in communications News & Analysis 9/26/2001 Post a comment ULM, Germany--Silicon Valley-based Atmel Corp. today announced it was joining Multilink Technology Corp. of New Jersey and five-year-old GaAs foundry supplier United Monolithic Semiconductors in a new R&D center at the University of Ulm to pursue ICs with analog functions for wireless and high-speed optoelectronics systems.
California Micro says orders continue to strengthen News & Analysis 9/25/2001 Post a comment MILPITAS, Calif.--California Micro Devices Corp. here said orders for products have continued to strengthen despite a brief pause following terrorist attacks in New York City and Washington on Sept. 11. The supplier of analog semiconductors and integrated thin-film passive devices estimated that revenues would be closer to the high end of its $7-to-$7.5 million forecast for the current quarter.
Canada's IceFyre aims three-engine modem IC at 5-GHz wireless LANs News & Analysis 9/24/2001 Post a comment OTTAWA, Ontario -- Seven-month-old IceFyre Semiconductor Inc. here today disclosed plans to introduce the industry's first single-chip modem solution for 5-GHz wireless local area networks using a proprietary architecture of three signal-computational engines to simplify waveform processing and lower power consumption.
LSI Logic says cable-modem tuner integrates all critical RF elements News & Analysis 9/24/2001 Post a comment MILPITAS, Calif. -- LSI Logic Corp. today claimed development of the industry's most highly integrated tuner chip for cable modems. The chip, called Hi-IQ, integrates all the critical radio-frequency elements for cable-based telephony and broadband access applications, according to the Milpitas company.
Optimizing digital video codecs in ARM cores News & Analysis 9/20/2001 Post a comment Expect multimedia applications to increase dramatically over the next few years, stimulated by the arrival of third-generation networks and explosive growth in the number of portable devices capable of displaying digital video.
Does MPEG-4 meet creator's vision? News & Analysis 9/20/2001 Post a comment It's been eight years since MPEG-4 started as a speculative gleam in the eyes of engineers across the world, the ISO/IEC standard for creating, distributing and playing back rich media is finally gaining a foothold in the marketplace.
What are streaming multimedia processors? News & Analysis 9/20/2001 Post a comment To capture and process rich forms of media content, systems and design engineers are developing and continuously improving on a special kind of processora streaming-media gateway processor (SMGP) that simultaneously captures and processes, in real-time, multiple streams of rich media content and provides an enhanced experience for any display system.
Streaming multimedia challenges DSP design News & Analysis 9/20/2001 Post a comment If an application developer sat down with a semiconductor architect to design a digital signal processor (DSP) specifically tailored to streaming multimedia and streaming video applications, what features would the developer ask for?
ISMA eyes standards, open architecture News & Analysis 9/20/2001 Post a comment The Internet Streaming Media Alliance's goal is to provide an open specification for interoperability, allowing end users freedom of choice and vendors the ability to compete in a more open market.
SiGe Semi uses ASAT's chip-carrier to reduce size of Bluetooth amplifier News & Analysis 9/18/2001 Post a comment OTTAWA -- Hong Kong-based ASAT Holdings Ltd. today announced it will supply leadless plastic chip-carrier (LPCC) packages to SiGe Semiconductor Inc. here for Class 1 Bluetooth power amplifiers. The 3-by-1.6-mm form factor is the industry's smallest size for a fully encapsulated Class 1 Bluetooth power amplifiers, said the two companies.
IBM pushes two ways for wireless News & Analysis 9/14/2001 Post a comment IBM has developed two chip production processes for wireless applications. One, which IBM has named 6RF, is based on its 0.25µm RF CMOS process. The other, called 5HPE, enhances the use of silicon germanium in RF devices.
IP models support codesign efforts News & Analysis 9/13/2001 Post a comment he mission of the CoDesign Methodology for System and Architecture (CMSA) team at STMicroelectronics is to provide system-level design support to several divisions for video, set-top-box and wireless applications.
System specs key to SoC success News & Analysis 9/13/2001 Post a comment A major cause of failure in the design of silicon systems is incorrect or ambiguous specification. It is necessary to capture system specifications in an executable, unambiguous format in order to achieve agreement early on in a concurrent hardware/software design process between customer/provider and the various design teams.
Codesign tools aren't ready yet for SoC era News & Analysis 9/13/2001 Post a comment As chip designs reach larger gate counts and time-to-market windows shrink, the need will increase for tools that let engineers determine at the system level whether functions are best-suited to be implemented in hardware or software.
Anadigics raises revenue estimates, but plans layoffs, cost cuts News & Analysis 9/10/2001 Post a comment WARREN, N.J.--Declaring it has hit a rocky bottom of the steep downturn, Anadigics Inc. today announced it will report slightly better-than-expected revenues for the third quarter, totaling about $16.0 million instead of a projected $15.5 million. The supplier of radio-frequency ICs also upped its forecast for the fourth quarter to show a sequential increase of $18.0-to-$18.5 million.
Integration key to packet voice News & Analysis 9/6/2001 Post a comment As packet voice is introduced into the local voice network, the transition from asynchronous transfer mode (ATM) to Internet Protocol (IP) requires an unprecedented number of new elements to support both new and legacy services.
Intelligent gateways move forward News & Analysis 9/6/2001 Post a comment As the communications industry moves from circuit to packet switching, the circuit switch will gradually disappear, but its intelligence will continue to exist in separate network elements.
Voice nets need evolutionary path News & Analysis 9/6/2001 Post a comment Most solutions for next-generation voice infrastructure involve both the packetization of voice and the separation of call-control intelligence from underlying switching systems.
Hosted applications key to voice News & Analysis 9/6/2001 Post a comment Next-generation voice-over-Internet Protocol (VoIP) networks will be highly intelligent, with multiple components each delivering a portion of overall functionality.
Industry ramps up voice-over-IP deployment News & Analysis 9/6/2001 Post a comment Now that voice-over-Internet Protocol signaling protocols have been defined, and silicon has integrated more functions, the larger issues are deployment and overall system architectures of VoIP infrastructure equipment.
Fairchild buys Impala Linear to expand analog power chip portfolio News & Analysis 9/6/2001 Post a comment SOUTH PORTLAND, Maine--In a move to strengthen its analog power business, Fairchild Semiconductor International Inc. today announced it has acquired San Jose-based Impala Linear Corp., a supplier of power management chips for a range of applications. The purchase was for $6 million in stock and cash.
IMP interim president steps down News & Analysis 9/5/2001 Post a comment IMP, Inc., San Jose, today announced that interim president and chief executive officer Sugiva Reddy will step down next week from a position he has held since July 2000.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.