EC report discusses increased support for electronics News & Analysis 9/30/2009 Post a comment The European Commission has identified nanotechnology, electronics and photonics as key enabling technologies (KETs) that are of strategic interest to the European Union. Advanced materials and biotechnology are also listed in a report that goes on to discuss ways in which greater support should be offered to these disciplines.
TI to open 300-mm analog fab in North Texas News & Analysis 9/29/2009 2 comments Texas Instruments plans to open a 300-mm analog semiconductor fab in Richardson, Texas. The company expects to begin equipping the facility next month and ship the first chips from the fab by the end of next year.
Analysis: What's behind Taiwan's decision to ease investment rules? News & Analysis 9/29/2009 Post a comment Comments reported by local media from Taiwan's economic minister Shih Yen-shiang on the easing investment restrictions with regard to mainland China were enough to send the share prices of Taiwan Semiconductor Manufacturing Co. and United Microelectronics Corp. shooting upwards, but the devil could yet be in the detail.
TSMC, UMC boosted by lifting of Taiwan investment ban News & Analysis 9/29/2009 Post a comment The Taiwan government is set to lift a long-running ban on investment by Taiwanese companies in Chinese counterparts, according to reports. The result is likely to benefit foundry chipmakers Taiwan Semiconductor Manufacturing Co. Ltd. and United Microelectronics Corp.
Premier Farnell to offer EDA to get closer to engineers News & Analysis 9/24/2009 Post a comment Component distributor Premier Farnell plc (Leeds, England) wants to become a vendor of PCB layout software, including a free-of-charge lightweight edition. This should allow the company to get closer to engineers and to be able to sell chips direct to them from the design tool as it is in use.
Application-Specific Power Semiconductors Part 1 - Attack of the IGBT Design How-To 9/23/2009 1 comment Application-specific IGBTs are taking a major change in direction like any other power devices and adopting distinct bifurcated approaches. The first pertains to innovations improving the silicon and process technologies to overcome the limitations of the current technology and the other approach is towards packaging and the driving of these devices. Part 1 identifies the differences in vaious IGBTs.
Update: Intel debuts optical link for PCs News & Analysis 9/23/2009 2 comments Intel Corp. wants to consolidate all the wired connections on your PC to a single 10 Gbit/second optical cable it calls Light Peak that it plans to support in silicon sometime next year working with Sony Corp.'s Viao group and other unnamed partners.
Melexis keeps cutting jobs as it raises guidance News & Analysis 9/23/2009 Post a comment Melexis Microelectronic Integrated Systems NV (Ieper, Belgium), a supplier of automotive ICs and subsystems, has said it now expects 2009 sales to be towards the top of the range given in July, of between 118 million euro (about $175 million) and 123 million euro (about $182 million). Nonetheless the company has announced job cuts at a newly-opened facility in Erfurt, Germany.
40Gb Ethernet set to be major feature at ECOC Product News 9/21/2009 Post a comment 40GbE transceivers and other parts, including testers, are set to be a major talking point at both the exhibitor stands and conferences at this week's European Conference and Exhibition on Optical Communication (ECOC) in Vienna, Austria.
Long, bumpy transition seen for USB 3.0 News & Analysis 9/21/2009 1 comment The Intel Developer Forum is expected to generate buzz around SuperSpeed USB this week, but the transition to the 5 GHz interface may be slower and bumpier than many would hope due to cost, power and support issues.
The path to money in medical systems design Signal Processing DesignLine Blog 9/21/2009 Post a comment Between government stimulus packages, an aging population, exploding healthcare costs and increasing need for better remote diagnostics, it's understandable that engineers looking for the next big opportunity would look up and cry: "Thars gold in them thar [medical] hills." But not so fast.
Ixys buys LED and LCD driver IC lines News & Analysis 9/17/2009 Post a comment Power semiconductor maker Ixys Corp. has completed the acquisition of the LED driver IC and LCD display driver IC business units from Leadis Technology Inc. for about $4 million in current and deferred funds.
Companies partner for space qualified modules Product News 9/17/2009 Post a comment C-MAC MicroTechnology (Great Yarmouth, England) and Linear Technology (Milpitas, Calif.) have joined forces for a deal that will allow manufacturers outside of the U.S. to purchase space grade and rad-hard monolithic and multichip modules from a European manufacturer without the bureaucratic restrictions they have to face.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.