AMS Builds 3D Chip-Stacking Line News & Analysis 9/5/2013 2 comments Analog and sensor IC company AMS has invested more than about $33 million to create production capacity for analog 3D ICs at its wafer fab in Austria.
Chip Market Growth Strengthens in July News & Analysis 9/4/2013 8 comments Global chip sales for July were up 5 percent on the same period in 2012, with a US boom more than compensating for a declining Japanese market. However, Japan showed strong growth compared with the previous quarter.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.