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posted in September 2006
Challenging young engineers
Automotive DesignLine Blog  
9/29/2006   Post a comment
Summer jobs and co-op assignments put student engineers in the real engineering world—but the Challenge X competition takes that experience even further.
CompactPCI boards are conduction cooled
Product News  
9/27/2006   Post a comment
Conduction cooling and no socketed devices make these CompactPCI single-board computers suitable for harsh environment applications across an extended temperature range. They pack Pentium M processors and PCI Express architectures.
Alpine lab enters rarified air of soft-error test
News & Analysis  
9/25/2006   Post a comment
Investments in time and dollars notwithstanding, semiconductor soft errors remain a tough nut to crack.
Accessory overload threatens auto power budgets: Part 2, load smoothing methods
Design How-To  
9/22/2006   Post a comment
High continuous electrical loading pushes auto charging systems into overload, so that load transients from more and higher-powered electrical accessories present higher probability of disrupting the vehicle's distributed computing network.
Accessory overload threatens auto power budgets: Part 1, burgeoning loads and transients
Design How-To  
9/20/2006   Post a comment
With the explosion in auto electronics features, is passenger safety jeopardized at the expense of greater luxury? Maxwell Technologies' John Miller explains the over-electrification problems and what design engineers can do to avoid potential hazards.
Ruggedized PMC delivers FPDP II performance
Product News  
9/20/2006   Post a comment
Operating at 400-Mbytes/s, ICS Sensor Processing's PCI mezzanine card is claimed to be the first such PMC with the performance of FPDP II. It uses a PCI 2.2 64/66 PCI bus interface.
3U CompactPCI SBCs run next-gen Freescale CPUs
Product News  
9/15/2006   Post a comment
Here's a pair of single-board CompactPCI computers that run Freescale Semi's latest PowerPC microprocessors. These boards permit power vs. speed tradeoffs, and can serve MIL and harsh environment applications.
Fault-robust microcontrollers allow automotive technology convergence: Part 2, fault detection and supervision
Design How-To  
9/14/2006   Post a comment
In automotive, semiconductor technologies and electronic systems are converging into a "car-on-a-chip." However, this convergence results in a new population of faults and failure modes, so how to make such systems more robust?
IBM unveils first Cell computer
News & Analysis  
9/12/2006   Post a comment
IBM said it offering its first systems based on the Cell processor it helped develop with Sony and Toshiba.
Fault-robust microcontrollers allow automotive technology convergence: Part 1, the nature of faults
Design How-To  
9/11/2006   Post a comment
In automotive, semiconductor technologies and electronic systems are converging into a "car-on-a-chip." However, this convergence results in a new population of faults and failure modes, so how to make such systems more robust?
Converter measurement methods spur automotive capacitive sensor use
Design How-To  
9/6/2006   Post a comment
Capacitance-to-digital converters allow taking advantage of capacitive sensors simple shape adaptation, low power consumption, and favorable manufacturing costs, while imparting ease of control and read out.
The human touch
Automotive DesignLine Blog  
9/6/2006   Post a comment
The Cadillac presentation I attended last week talked about the latest electronic and technical improvements to the car line—but there was also renewed emphasis on hand craftsmanship and quality.


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Max Maxfield

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The Circle – The Future's Imperfect in the Present Tense
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Make This Engineering Museum a Reality
Martin Rowe
Post a comment
Vincent Valentine is a man on a mission. He wants to make the first house to ever have a telephone into a telephone museum. Without help, it may not happen.

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Making the Grade in Industrial Design
Rich Quinnell
16 comments
As every developer knows, there are the paper specifications for a product design, and then there are the real requirements. The paper specs are dry, bland, and rigidly numeric, making ...

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