Extreme automotive environment challenges sensor design Design How-To 11/22/2006 Post a comment Regardless of the specific application, most automotive sensor modules share a common high-level architecture and a set of stringent requirements that make for a challenging design under the high temperatures, noise, and vibration found in a car. Here are some design hints to deal with these hurdles.
Special Preview: BDTI's FPGAs for DSP, Second Edition
Design How-To 11/14/2006 Post a comment Altera and Xilinx have invested heavily in developing DSP-oriented chips and development tools. BDTI has just completed an in-depth study of these DSP-oriented FPGAs, including benchmarking using an OFDM receiver benchmark representative of telecommunications infrastructure applications. In this article we present insights gained from our benchmarking and analysis, focusing on the evolving role of FPGAs targeting DSP applications.
Kit powers SDR handsets, rapid prototyping Product News 11/13/2006 Post a comment A collaboration among TI, Xilinx, Lyrtech and others has produced a Small Form Factor Software SDR Development Platform that provides a full signal chain from antenna to baseband processing. It features unique power measurement tools and a Simulink design flow.
Battle-hardened veterans of the electronics industry have heard of the “connected car” so often that they assume it’s a done deal. But do we really know what it takes to get a car connected and what its future entails? Join EE Times editor Junko Yoshida as she moderates a panel of movers and shakers in the connected car business. Executives from Cisco, Siemens and NXP will share ideas, plans and hopes for connected cars and their future. After the first 30 minutes of the radio show, our listeners will have the opportunity to ask questions via live online chat.