Extreme automotive environment challenges sensor design Design How-To 11/22/2006 Post a comment Regardless of the specific application, most automotive sensor modules share a common high-level architecture and a set of stringent requirements that make for a challenging design under the high temperatures, noise, and vibration found in a car. Here are some design hints to deal with these hurdles.
Special Preview: BDTI's FPGAs for DSP, Second Edition
Design How-To 11/14/2006 Post a comment Altera and Xilinx have invested heavily in developing DSP-oriented chips and development tools. BDTI has just completed an in-depth study of these DSP-oriented FPGAs, including benchmarking using an OFDM receiver benchmark representative of telecommunications infrastructure applications. In this article we present insights gained from our benchmarking and analysis, focusing on the evolving role of FPGAs targeting DSP applications.
Kit powers SDR handsets, rapid prototyping Product News 11/13/2006 Post a comment A collaboration among TI, Xilinx, Lyrtech and others has produced a Small Form Factor Software SDR Development Platform that provides a full signal chain from antenna to baseband processing. It features unique power measurement tools and a Simulink design flow.
As data rates begin to move beyond 25 Gbps channels, new problems arise. Getting to 50 Gbps channels might not be possible with the traditional NRZ (2-level) signaling. PAM4 lets data rates double with only a small increase in channel bandwidth by sending two bits per symbol. But, it brings new measurement and analysis problems. Signal integrity sage Ransom Stephens will explain how PAM4 differs from NRZ and what to expect in design, measurement, and signal analysis.
January 2016 Cartoon Caption ContestBob's punishment for missing his deadline was to be tied to his chair tantalizingly close to a disconnected cable, with one hand superglued to his desk and another to his chin, while the pages from his wall calendar were slowly torn away.122 comments