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posted in December 2013
2.5-D Stacks Pile Up at Event
Blog  
12/24/2013   6 comments
More than a dozen companies presented results of test chips or support capabilities for 2.5-D and 3-D chip stacks at a recent event.
Altera CEO Upbeat After Tough 2013
News & Analysis  
12/23/2013   7 comments
The FPGA vendor's chief executive shared his views on the outlook for semiconductors and engineering in a yearend interview with EE Times.
Top 10 Automotive Agendas for 2014 & Beyond
News & Analysis  
12/20/2013   22 comments
Carmakers today languish between a rock and a hard place. On one hand, they face a dizzying array of new technologies to adopt, while they must comply with new regulations.
The Self-Driving Car Will Watch Your Every Move
Blog  
12/20/2013   28 comments
The biggest hurdle for autonomous cars is not whether a car can drive itself from point A to B, but if we can strike a balance in extending human driving abilities into the world of AI.
3D Stacks & Security Key for IBM in Server Market
News & Analysis  
12/17/2013   4 comments
Top technologist at IBM discusses the future of server design with particular attention to security and 3D integration.
Amazing Race Toward Autonomous Car Design
News & Analysis  
12/17/2013   17 comments
Chip companies are finding 2014 a critical year to drive their technology into semi-autonomous car platforms -- currently in development by a number of different carmakers.
From Teaching Physics to Studying EE
News & Analysis  
12/12/2013   4 comments
A former physics teacher, having taught digital electronics, goes back to school for electrical engineering.
Intel Revs Up Comms Coprocessor
News & Analysis  
12/4/2013   5 comments
Coleto Creek raises the ante for Intel's bid to get its x86 processors used more broadly in a wide variety of communications systems.


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