TSMC, Altera team on 3-D IC test vehicle News & Analysis 3/22/2012 1 comment Claiming an industry first, TSMC and Altera announced the joint development of a heterogeneous 3-D IC test vehicle using TSMC's chip-on-wafer-on-substrate integration process.
Just call me “Tracker Trucker Max” The Engineering Life - Around the Web 3/20/2012 7 comments I can't tell you exactly which flavor my new truck is, but it's a honking great big one with a large extended cab and four doors…
Battle-hardened veterans of the electronics industry have heard of the “connected car” so often that they assume it’s a done deal. But do we really know what it takes to get a car connected and what its future entails? Join EE Times editor Junko Yoshida as she moderates a panel of movers and shakers in the connected car business. Executives from Cisco, Siemens and NXP will share ideas, plans and hopes for connected cars and their future. After the first 30 minutes of the radio show, our listeners will have the opportunity to ask questions via live online chat.