TSMC, Altera team on 3-D IC test vehicle
News & Analysis 3/22/2012 1 comment
Claiming an industry first, TSMC and Altera announced the joint development of a heterogeneous 3-D IC test vehicle using TSMC's chip-on-wafer-on-substrate integration process.
Just call me “Tracker Trucker Max”
The Engineering Life - Around the Web 3/20/2012 7 comments
I can't tell you exactly which flavor my new truck is, but it's a honking great big one with a large extended cab and four doors…