My Way or the Highway Product News 6/30/2004 Post a comment Virtual IDM Approach Provides One-Stop Shop For All Aspects Of Complex IC Design Through To Manufacturing Services and Volume Silicon Delivery
Billig-FPGAs drängen auf den Markt Product News 6/28/2004 Post a comment Der Wettbewerb derAnbieter programmierbarer Logik um den Markt für Plasma-Displays eskaliert. Die Anwender können sich die Hände reiben: Eine neue Welle von Low-cost-FPGAs rollt auf den Markt zu.
Accent Launches "Highway to Silicon" Product News 6/14/2004 Post a comment Virtual IDM Approach Provides One-Stop Shop For All Aspects Of Complex IC Design Through To Manufacturing Services and Volume Silicon Delivery Targets Fabless/Chipless Companies Through VDSM Design Expertise And Provides Low Volume Foundry Access For COT Designs.
Xilinx zeigt IBM bei 90 nm die kalte Schulter News & Analysis 6/11/2004 Post a comment Xilinx will seine 90-Nanometer-FPGAs nicht bei seinem Foundry-Partner IBM Microelectronics produzieren. Statt dessen kommt die taiwanische Halbleiterschmiede United Microelectronics Corporation (UMC) zum Zuge.
Xilinx tops ranks of FPGA and EDA vendors Survey 6/7/2004 Post a comment Xilinx Inc. rules the roost in terms of design technologies offered by FPGA vendors, Mentor had the strongest showing among commercial EDA vendors but Synplicity and Xilinx tied for top spot in customer satisfaction, according to an FPGA study.
Customizing a Standard Product News 6/3/2004 Post a comment
NIOS Processors gain steam as proprietary processor adds benefits not easily accommodated in hard embedded microcontroller macros
The "Missing Link" of SoC DesignPlatform and Structured ASICs Design How-To 6/3/2004 Post a comment Are ASIC designs too expensive? Does FPGA performance fall short of specifications? Consider a structured or platform ASIC implementation for your next mid-performance, mid-volume chip. Over the past year, a different type of chip implementation has been garnering a lot of attention from IC vendors and designers alike. Jim Lipman introduces this new chip implementation known as Structured ASICs or Platform ASICs (SA/PA).
April's global chip sales up 36.7% News & Analysis 6/2/2004 Post a comment The three-month average of global semiconductor sales rose to $16.94 billion in April, a sequential increase of 4.1 percent from the $16.275 billion reported in March and a 36.7 percent increase from April 2003. From London, Peter Clarke filed this report.
Battle-hardened veterans of the electronics industry have heard of the “connected car” so often that they assume it’s a done deal. But do we really know what it takes to get a car connected and what its future entails? Join EE Times editor Junko Yoshida as she moderates a panel of movers and shakers in the connected car business. Executives from Cisco, Siemens and NXP will share ideas, plans and hopes for connected cars and their future. After the first 30 minutes of the radio show, our listeners will have the opportunity to ask questions via live online chat.