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Content tagged with FPGA/PLD/CPLD
posted in July 2013
Flash DIMMS Invade DDR3 Slots
News & Analysis  
7/30/2013   8 comments
Startup Diablo Technologies announced a chip that lets NAND flash ride on the DDR3 DIMM bus, enabling new memory applications.
SuVolta Process Wins ARM, UMC Support
News & Analysis  
7/23/2013   15 comments
With six deployment programs in place, SuVoltas's chip manufacturing process is looking like a viable alternative to FDSOI and FinFET processes.
TSMC Forecasts Tepid Q3
News & Analysis  
7/18/2013   4 comments
Foundry chipmaker Taiwan Semiconductor Manufacturing Co. Ltd. has said that demand for its wafers will "moderate" in the third quarter after it reported record sales and profits for 2Q13.
What's Microsemi Done With Actel's SmartFusion Product Range?
News & Analysis  
7/16/2013   8 comments
The SmartFusion2 product range is built on 65nm Flash technology and biased heavily towards security and defense applications.
First 20nm UtraScale ASIC-Class FPGA From Xilinx
News & Analysis  
7/9/2013   1 comment
20nm UltraScale devices enable 1.5-2x system-level performance and programmable systems integration a year ahead of the competition.
Xilinx Tapes Out 20nm FPGA
News & Analysis  
7/9/2013   2 comments
Xilinx says it has taped out the first merchant chip in TSMC's 20nm process, the FPGA sporting its Ultrascale architecture.
FPGA Development Boards: The Universal Prototyping Tool?
News & Analysis  
7/5/2013   13 comments
With the growing availability of expansion boards like the FPGA Mezzanine Card, it is easier than ever to create a target hardware platform on which you can begin development.
Configurable Processors as an Alternative to FPGAs
Blog  
7/3/2013   3 comments
An exploration of using configurable processors as an alternative to the traditional FPGA approach to creating a custom system.
Complex Chips Make Tangled Business
Blog  
7/3/2013   5 comments
As chip complexity has increased, design has climbed in abstraction, and it has created a Byzantine network of business models and opportunities. But are too many entities trying to take profit across the design process killing the goose that lays the golden IC?
Cloud RAN Attracts Asian, European Carriers
News & Analysis  
7/2/2013   5 comments
Interest in building cellular networks out of banks of x86 servers is spreading beyond China Mobile to Korea, Japan, and Germany.
Global Chip Sales Buoyed by Phones, Memories
News & Analysis  
7/1/2013   4 comments
An analyst predicts that industry bodies will report a sharp increase in the three-month moving average for May global chip sales.
Mobile, Cloud Define New Comms Reality
Blog  
7/1/2013   1 comment
We’ve redesigned the Communications Designline to be a news-centric, blog-heavy hotspot for what’s happening in today’s mobile/cloud era.
Can a Car Find a Parking Spot by Itself?
Blog  
7/1/2013   19 comments
Junko Yoshida is stubbornly dubious of autonomous driving, but she's strangely fascinated with the idea of autonomous parking.


Radio
NEXT UPCOMING BROADCAST
Why Connect a Car?
May 11, 1pm EDT Monday
Overview: Battle-hardened veterans of the electronics industry have heard of the “connected car” so often that they assume it’s a done deal. But do we really know what it takes to get a car connected and what its future entails? Join EE Times editor Junko Yoshida as she moderates a panel of movers and shakers in the connected car business. Executives from Cisco, Siemens and NXP will share ideas, plans and hopes for connected cars and their future. After the first 30 minutes of the radio show, our listeners will have the opportunity to ask questions via live online chat.
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