New Wave of FPGA Prototyping for System-on-Chip Designs Design How-To 8/26/2004 Post a comment From the ubiquitous cell phone to the digital camera, embedded systems are permeating our daily lives. And, they continue to grow in complexity. Designed with a new architecture around recent generations of FPGA devices, and assisted by robust and comprehensive software, EVE's Lauro Rizzatti describes this new generation of FPGA prototyping platforms.
Netzwerkprozessoren enträtselt Special Report 8/12/2004 Post a comment Netzwerk-'Innereien' wie Router und Switches stellen enorme Ansprüche an die Prozessoren, die darin werkeln. Daher ist es sicher kein Zufall, dass spezialisierte Netzwerkprozessoren eine große Popularität erreicht haben. Aber was macht einen Prozessor eigentlich zum Netzwerkprozessor? Und welche Merkmale werden in Zukunft besonders gefragt sein?
Integrated Functionality Reaches New Heights Product News 8/10/2004 Post a comment Both advanced and simple system designers share common goals. To create a streamlined design solution that more than satisfies the requirements. Other often critical constraints include size, power, performance speed, durability, and let's not forget cost.
Clock multiplier eliminates need for external components News & Analysis 8/9/2004 Post a comment TI introduces a highly-integrated clocking IC featuring three on-chip PLL filter components and eliminates the need for external components to support the PLL structures. The very low period jitter and ability to generate multiple clock frequencies enables it to target consumer electronics.
Study finds China directing standards News & Analysis 8/7/2004 Post a comment China is no longer content with just being the world's pre-eminent manufacturer: it is increasingly active in the development of global technology standards, Deloitte & Touche LLP finds in a study released Thursday (Aug. 5).
Sharp and Tessera expand packaging agreement News & Analysis 8/2/2004 Post a comment Seeking to broaden its exposure to the consumer electronics market, Tessera Technologies Inc., San Jose, has expanded an existing agreement to license semiconductor packaging technology to Sharp Corp., Japan.
Battle-hardened veterans of the electronics industry have heard of the “connected car” so often that they assume it’s a done deal. But do we really know what it takes to get a car connected and what its future entails? Join EE Times editor Junko Yoshida as she moderates a panel of movers and shakers in the connected car business. Executives from Cisco, Siemens and NXP will share ideas, plans and hopes for connected cars and their future. After the first 30 minutes of the radio show, our listeners will have the opportunity to ask questions via live online chat.