NXP Car Plan Teams NFC, Bluetooth News & Analysis 5/15/2014 6 comments The biggest issue for the current version of Bluetooth Low Energy may be "its security and pairing mechanism." NXP is proposing NFC for secure transactions, while BLE offers a data link.
Rambus Rejoins Jedec News & Analysis 5/14/2014 5 comments Rambus has been invited to rejoin the memory standards group Jedec after a nearly 20-year absence marked by suits with major DRAM suppliers.
Managing Vehicle Networking Blog 5/13/2014 1 comment The AUTOSAR alliance has been changing the way vehicle networks and ECUs are designed. Different domains in the car have different safety and performance requirements, and the in-vehicle networks must have predictable and secure performance.
Teardown Compares Combo Sensors Blog 5/12/2014 3 comments The latest nine-axis combo sensors from Bosch, InvenSense, and STMicro have similar costs despite different designs, according to a System Plus Consulting chip teardown.
$6 Billion Problem for Mobile Carriers Blog 5/8/2014 10 comments The real issue of the three-device (smartphone, tablet, and notebook) endgame is not the form factor but a $6 billion revenue loss for carriers -- and potentially a huge problem for device manufacturers.
Faroudja’s Bit Rate Reducer Gambit News & Analysis 4/16/2014 10 comments At the NAB show, Yves Faroudja and his new startup showed off new technology designed to provide up to 50 percent reduction in video bit rates without reduction in image quality.
ISPD-14 Focuses on FinFETs, Security, Supply Chain News & Analysis 4/9/2014 Post a comment The 2014 International Symposium on Physical Design explored many areas in the development of next-generation integrated circuits. In addition to securing the chip supply chain and the latest FinFET developments, the discussion looked at cyberphysical system design.
Internet, Apps & Now Hardware Blog 4/3/2014 8 comments Web designers, software developers, and non-engineering professionals with no prior experience in designing a system are turning their attention to hardware, Marvell's Kinoma vice president says.
Exclusive: Xiaomi Unboxed News & Analysis 3/18/2014 20 comments China's Xiaomi Inc., with no prior experience in the CE business, has picked up where Sony, Motorola, and Nokia left off and has blazed a path to survival in today's cutthroat consumer market.
Spin Waves Cut Logic Power News & Analysis 3/7/2014 7 comments In a new research paper, UCLA scientists explain how they used electron spin to slash the power consumption of logic devices.
Sonics' New IP for Low-Power SoCs Patented News & Analysis 2/18/2014 3 comments Sonics revealed the issuance of patent 8,601,288 "Intelligent Power Controller" from the US Patent Office. The hardware-based power-management IP lets SoC designers partition power domains and turn them on and off without software intervention.
Did Apple Steal DLNA's Thunder? Blog 2/13/2014 23 comments Within its closed iOS device universe, Apple has delivered an "interoperable" experience, "or at least the belief in such" among its users, says an analyst. Does that mean Apple stole DLNA's thunder?
Qualcomm Answers 'Auto-Grade Dilemma' Blog 2/10/2014 1 comment Qualcomm is ideally positioned to answer what I call the "auto-grade dilemma." It's a dilemma because moving technologies originally designed for smartphones to automotive use is a big challenge -- especially for a company like Qualcomm.
IBM’s Chip Unit on Chopping Block? News & Analysis 2/7/2014 49 comments Discussions about putting IBM’s semiconductor business on the chopping block have returned with a vengeance. IBM reportedly retained Goldman Sachs to look for possible buyers.
Power Over Ethernet Group Forms News & Analysis 1/22/2014 18 comments The Ethernet Alliance has launched a Power Over Ethernet Subcommittee as part of the alliance's work in Power over Ethernet (PoE). PoE is the delivery of power over Ethernet cables, which has has potential for less power-hungry remote devices, such as wall-mounted cameras and automotive advanced driver assistance systems
Auto UI at Digital Cusp News & Analysis 1/13/2014 8 comments As evidenced at CES last week, the automotive industry is exactly at the digital cusp that swept the mobile phone industry two decades before, with its human-machine interface still in its infancy.
CES Mobile Wrap: DSP, GPU, CPU Redefined News & Analysis 1/13/2014 4 comments Apps processor designers are prompted to rethink DSP, GPU, and CPU cores. This year’s CES saw Nvidia’s Tegra K1, MediaTek’s octa-core apps processor, and new generation of Ceva-TeakLite-4 DSP architecture.
Take a Smartphone & Wrap a Car Around It Blog 1/8/2014 22 comments Tesla's Elon Musk is no longer the only gearhead thinking of the car as a smartphone. The perception of a car turning into a smartphone (or a smartphone turning into a car) is a prophecy fulfilling itself at 90 miles an hour.
LG Revives webOS for Smart TV News & Analysis 1/7/2014 13 comments LG Electronics has breathed new life into webOS – a mobile operating system originally developed by Palm, by redesigning it as an OS for its new smart TV platform.
CES 2014 to Spark Android vs. iOS In-Car Battle News & Analysis 12/18/2013 25 comments Google will roll out its response to Apple's iOS in the Car at CES. The announcement includes the formation of an industry consortium and the adoption of communication standards, connecting Android phones with cars.
Mobile Maturity Leads to Extremes Blog 12/11/2013 7 comments The commoditization of the smartphone is driving innovation to extremes and creating a new class of wearable devices, according to market watcher Bill Boldt.
China Investigates Qualcomm News & Analysis 11/25/2013 19 comments Qualcomm Incorporated Monday disclosed that China's National Development and Reform Commission, which regulates prices, has begun investigating Qualcomm regarding compliance with the Chinese Anti-Monopoly Law.
Spansion Exec Reassures Fujitsu Customers News & Analysis 11/25/2013 9 comments The most tangible technology advances, after Spansion acquired Fujitsu Semiconductor's MCU/analog business, will come from the adoption of Spansion’s proprietary eCT technology in embedded MCUs -- to be released in 2015.