Design Con 2015
Breaking News
Content tagged with Logic/Interface
posted in January 2010
Page 1 / 2   >   >>
DirecTV explores Wi-Fi, G.hn networks
News & Analysis  
1/29/2010   Post a comment
DirecTV said it is testing versions of Wi-Fi and aims to test wired links based on the ITU G.hn standard days after the company debuted the first satellite TV set-top boxes to use the home networking technology of the Multimedia over Coax Alliance.
Foundry rankings, Apple iPad lead weekly story ranking
News & Analysis  
1/29/2010   Post a comment
Here are the top five online stories for the week beginning Sunday, Jan. 24, as ranked by EE Times readers, up to and including Friday, Jan. 29. The ranking is based on the number of reader "views" or "hits" on a particular article.
Atmel puts smart card business up for sale
News & Analysis  
1/29/2010   1 comment
Microcontroller vendor Atmel Corp. (San Jose, Calif.) has announced it is exploring the potential sale of its smart card business located in Rousset, France and East Kilbride, Scotland but that it intends to discontinue potential sale discussions for its customer-specific products and aerospace businesses.
Haptic piezo controller helps to "feel the touch" in touch-screen applications
Product News  
1/29/2010   Post a comment
A novel haptic solution that provides customers with an enhanced, true "touch" experience with touch screens has been introduced Maxim Integrated Products which the company claims is the industry's first fully integrated, programmable HPC (haptic piezo controller) for single-layer and multilayer piezo actuators.
The worldwide mobile phone market grew 11.3% in the fourth quarter of 2009
News & Analysis  
1/29/2010   Post a comment
Ending five consecutive quarters of retrenchment, vendors shipped 325.3 million units in 4Q09 compared to 292.4 million units in the fourth quarter of 2008, says IDC.
Analyst rails against the fab-lite
News & Analysis  
1/28/2010   6 comments
The fabless chip vendors and pursuers of fab-lite manufacturing strategies are about to get a shock, according to Malcolm Penn, principal analyst with Future Horizons (Sevenoaks, England). Some companies could under-perform, others could be driven out of business in a market that should be booming for them; and all because they have lost control of manufacturing.
Analysis: Why a sustained ASP turnaround could be a mirage
News & Analysis  
1/28/2010   Post a comment
Malcolm Penn, founder and principal analyst with Future Horizons (Sevenoaks, England), has been at the bullish end of the spectrum of market researchers' opinion through most of the last decade. He remains so, but he is convinced that at long last the conditions are coming together to create manufacturing capacity shortages and a boom for chip makers and vendors.
TSMC profits in Q4 on returning demand
News & Analysis  
1/28/2010   Post a comment
Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan) to post a net income of NT$32.67 billion (about $1.02 billion) on consolidated revenue of NT$92.09 billion (about $2.88 billion) in the fourth quarter ended December 31, 2009.
Future Horizons sees 30% chip market boom
News & Analysis  
1/27/2010   Post a comment
The worldwide chip market is set for two years of more than 20 percent growth and could even hit more than 30 percent growth in a single year, according to Malcolm Penn, the principal analyst and founder of the U.K. market analysis company Future Horizons (Sevenoaks, England).
PLX Tech reports record revenue
News & Analysis  
1/27/2010   Post a comment
Chip vendor PLX Technology reported a net income of $2.6 million on revenue of $26.6 million for the fourth quarter of 2009. The company announced record revenue for the year of $82.8 million.
ST tailors 90V, 2A ultrasound pulser with four independent channels
Product News  
1/26/2010   Post a comment
STMicroelectronics' latest low-noise ultrasound pulse controller provides four independent channels, each of which generates precisely controlled high-voltage pulses to drive piezoelectric crystals or other transducers.
DirecTV adopts MoCA for home networking
News & Analysis  
1/25/2010   Post a comment
DirecTV will use home networking chips from Entropic Communications Inc. in a deal that adds support from a major satellite TV player for the technology of the Multimedia over Coax Alliance which to date has mainly been used in set-top boxes for Verizon's Fios IPTV service.
Java Essentials for Embedded Networked Devices - Part 1: Windows and Linux set up
Design How-To  
1/25/2010   Post a comment
Part 1 of an excerpt from the book "Designing Embedded Internet Devices" (2003) discusses how to obtain and set up Java for both Windows and Linux personal computers.
VC investment fell in 2009, Q4 signals change
News & Analysis  
1/25/2010   Post a comment
Venture capitalists invested $17.7 billion in 2,795 deals in 2009, marking the lowest level of dollar investment since 1997, according to the MoneyTree Report by PricewaterhouseCoopers and the National Venture Capital Association (NVCA), based on data from Thomson Reuters.
Grace, HHNEC begin building joint wafer fab, say reports
News & Analysis  
1/25/2010   Post a comment
Grace Semiconductor Manufacturing Corp and Shanghai Hua Hong NEC Electronics Co. Ltd. (HHNEC) have begun construction of a 300-mm wafer fab at Zhangjiang Hi-Tech Park, Shanghai, according to local reports.
MCUs: Oki 8 bit MCUs with embedded flash
News & Analysis  
1/24/2010   Post a comment
ROHM Semiconductor is supplying the ML610Q400 series of CMOS 8 bit microcontrollers developed by OKI Semiconductor.
Fabless ranking, Apple's iPad, Daizi Zheng lead weekly story ranking
Blog  
1/22/2010   Post a comment
Here are the top five online stories for the week beginning Sunday, Jan. 17, as ranked by EE Times readers, up to and including Friday, Jan. 22. The ranking is based on the number of reader "views" or "hits" on a particular article.
ST-Ericsson reports big loss in $2.5 billion first year
News & Analysis  
1/22/2010   Post a comment
Wireless chip joint venture ST-Ericsson (Geneva, Switzerland) reduced its operating loss in the fourth quarter but nonetheless reported a big net loss in a difficult first year in operation.
PRODUCT HOW-TO: Using the Blackfin Processor for Bus-Powered USB 2.0 Compliant Designs
Design How-To  
1/22/2010   Post a comment
How to use the low power ADSP-BF527 Blackfin processor and its built-in in USB physical layer interface (PHY) to incorporate high speed USB 2.0 capabilities, as well as USB On-The-Go (OTG) functionality into a wide range of portable consumer and embedded devices.
Global chip sales stayed firm in December, says analyst
News & Analysis  
1/21/2010   Post a comment
The three-month average of global chip sales for December was $22.4 billion compared with $22.6 billion in November and up 28.5 percent from $17.4 billion, according to Bruce Diesen, an analyst at Carnegie Group (Oslo, Norway).
Multiprotocol chipset maximizes data throughput with enhanced ESD protection
Product News  
1/21/2010   Post a comment
Maxim Integrated Products launched three ICs that form a complete multiprotocol transceiver chipset supporting V.28 (RS-232), V.10/V.11 (RS-449/V.36, EIA-530, EIA-530A, X.21), and V.35 protocols.
Icera launches 'interference-aware' HSPA modem
News & Analysis  
1/20/2010   Post a comment
Icera Inc. (Bristol, England), a developer of soft modems for mobile broadband, has announced the availability of IceClear, the company's "interference-aware" receiver technology.
Samsung to pay $900 million in Rambus license deal
News & Analysis  
1/19/2010   Post a comment
South Korea's Samsung Electronics will pay about $900 million over five years to license technology from Rambus under the terms an agreement that settles all litigation between the two companies.
U.S. cracks down on Energy Star violators
News & Analysis  
1/19/2010   Post a comment
The U.S. Department of Energy plans to start conducting its own tests soon to determine whether products are in compliance with the Energy Star program, the latest step in a broad initiative under the Obama Administration to crack down on an electronics industry that has been lax in adhering to the requirements of the energy efficiency program.
Korea recruits Abu Dhabi investor for chip initiatives
News & Analysis  
1/19/2010   Post a comment
ATIC of Abu Dhabi, the government investment vehicle behind GlobalFoundries, has agreed to explore with the Korea Semiconductor Industry Association potential collaborations and partnerships in the chip industry.
Rise of the Embedded Internet
Design How-To  
1/19/2010   Post a comment
This Intel white paper looks at how breakthroughs in computing performance per watt, along with advances in wired and wireless broadband connectivity, will enable the development of billions of new intelligent embedded devices - the embedded Internet.
AMD jumps into fabless chip company ranking
News & Analysis  
1/19/2010   Post a comment
Only seven fabless chip companies out of the top 25 managed to grow their revenue in 2009, according to market research company IC Insights Inc. (Scottsdale, Ariz.). However, Advanced Micro Devices Inc. (Sunnyvale, Calif.) jumped into the rankings at number two, courtesy of its divestment of its manufacturing to GlobalFoundries.
Memory to boost market growth, says analyst
News & Analysis  
1/19/2010   Post a comment
The flash memory, DRAM and optoelectronics (LEDs) sectors will fare best in 2010 as worldwide semiconductor revenue advances 15 percent to $257 billion, according to market research firm Databeans Inc. (Reno, Nevada).
Lime, Percello create femtocell reference design
News & Analysis  
1/18/2010   Post a comment
Lime Microsystems Ltd. (Guildford, England), a developer of multiband multistandard RF transceiver ICs, has announced that it is collaborating with Percello Ltd. (Ra'anana, Isreal) to develop a reference platform for femtocell designs.
TI works with Liquavista on OMAP e-reader support
News & Analysis  
1/18/2010   Post a comment
Display pioneer Liquavista BV (Eindhoven, The Netherlands) has announced it is working with Texas Instruments Inc. (Dallas, Texas) to provide support for electrowetting displays in mobile and consumer applications.
Nexus teardown, CES and Intel-FPGA tale, lead weekly story ranking
Blog  
1/15/2010   Post a comment
Here are the top five online stories for the week beginning Sunday, Jan. 10, as ranked by EE Times readers, up to and including Friday, Jan. 15. The ranking is based on the number of reader "views" or "hits" on a particular article.
SPI/I2C UART integrates an oscillator to offer fast data rates
Product News  
1/15/2010   Post a comment
Maxim Integrated Products has introduced what the company claims is industry's lowest power, fastest, and smallest serial UART to communicate over an SPI/I2C interface.
Teardown: Moto Droid emulates other iPhone killers
Product News  
1/15/2010   2 comments
Motorola's Droid smartphone includes hardware similar to other so-called "iPhone killers" and carries a bill of materials cost of $179.11, according to a teardown analysis conducted by market research firm iSuppli.
Nokia leads Greenpeace electronics ranking
News & Analysis  
1/14/2010   1 comment
Environmental lobby organization Greenpeace International (Amsterdam, The Netherlands) has kept Nokia at the top of its Greener Electronics Guide as it moved into its fourteenth edition.
TSMC to recruit 3,000 engineers, says report
News & Analysis  
1/14/2010   Post a comment
Foundry chipmaker Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan) said Thursday (Jan. 14) that it planned to recruit more than 3,000 employees to help it expand manufacturing capacity, according to a Reuters report.
Level One co-founder dead at 50
News & Analysis  
1/12/2010   Post a comment
Dan Ray, co-founder of communications SoC vendor Level One Communications, died after suffering a heart attack. He was 50.
Apple, Qualcomm seen as winners of CES trends
News & Analysis  
1/12/2010   2 comments
In the wake of the Consumer Electronics Show, analysts are upbeat on the outlook for consumer systems, especially those tied to emerging mobile devices and 3DTV, and singled out Apple and Qualcomm as two of the big winners from the trends at the show.
VC investment jumped in November 2009, says GSA
News & Analysis  
1/12/2010   Post a comment
Fifteen fabless chip companies and semiconductor suppliers raised $93.5 million in November 2009, according to industry organization the Global Semiconductor Alliance.
Automotive IC market expected to grow 16% in 2010
News & Analysis  
1/12/2010   Post a comment
The global market for automotive semiconductor chips will rise 16 percent in 2010 to reach $18.4 billion, according to market research company Semicast Research Ltd. (Waterlooville, England), recovering almost all of the ground lost in 2009.
Google smartphone teardown reveals few surprises
News & Analysis  
1/11/2010   Post a comment
Google's Nexus One smartphone carries an estimated bill of materials cost of $174.15 and features chips from Qualcomm, Synaptics and Samsung, among others, according to a teardown analysis conducted by market research firm iSuppli.
Evatronix IP cores to be made available in the LFoundry Process Design Kit (PDK)
News & Analysis  
1/11/2010   Post a comment
Evatronix SA, (Bielsko-Biala/Poland) the silicon intellectual property (IP) provider, and Landshut Silicon Foundry GmbH (Landshut/Germany) have reached an agreement that will see most of the popular products from the Evatronix IP portfolio being supported within LFoundry's leading analog / mixed signal technology nodes.
A dozen companies to watch in the IPO landscape
Blog  
1/11/2010   1 comment
Initial public offerings of shares (IPOs) in semiconductor companies have been rare over the last few years and that has had an inhibiting effect on venture capital investment in startups.
UMC set to increase capacity, says report
News & Analysis  
1/11/2010   Post a comment
Foundry chipmaker United Microelectronics Corp. (UMC) is expected to install equipment in Fab 12b, a 300-mm wafer fab at the Southern Taiwan Science Park soon, and take over a similar factory from ProMOS Technologies Corp., according to a local report.
CES video: Content providers pave path to 3-D
News & Analysis  
1/9/2010   Post a comment
In a panel discussion at the Consumer Electronics Show, a handful of content providers said they will deliver stereo 3-D services in 2010, but their paths to getting there are still diverse and uncertain.
CES, Gphone, quad-core ARM lead weekly story ranking
Blog  
1/8/2010   Post a comment
Here are the top five online stories for the week beginning Sunday, Jan. 3, as ranked by EE Times readers, up to and including Friday, Jan. 8. The ranking is based on the number of reader "views" or "hits" on a particular article.
TSMC's sales fell 11.2% in 2009
News & Analysis  
1/8/2010   Post a comment
December sales at foundry chip maker Taiwan Semiconductor Manufacturing Co. Ltd. were more than double what they were in the same month in 2008, but annual sales fell by 11.2 percent.
Y2K-type bug hits German cash, credit cards
News & Analysis  
1/8/2010   Post a comment
A date verification software bug, akin to the kind of bug that didn't hit in the year 2000, has caused problems for holders of millions of German credit cards and automatic teller machine cards.
Handset chip sales bounced in Q4, says analyst
News & Analysis  
1/7/2010   Post a comment
Connectivity chips showed the greatest growth within the mobile phone semiconductor market, according to ABI Research. The total revenue for handset Bluetooth, GPS, and WLAN in 2009 is forecast to grow 16 percent compared to 2008, exceeding $1.9 billion, and to show a CAGR of 11 percent between 2009 and 2014, the market researcher said.
Ambarella targets pocket-sized hybrid cameras with its A5s SoCs
Product News  
1/7/2010   1 comment
The Ambarella A5s family of SoCs combines high-speed CPU and low-power 45nm technology to support megapixel photography in pocket-sized hybrid cameras.
SoC line brings network attached storage to new markets
Product News  
1/7/2010   Post a comment
PLX Technology has rolled out its NAS 7800 SoC family, which enables new markets including routers/gateways, DVRs and set-top boxes.
Page 1 / 2   >   >>


Flash Poll
Like Us on Facebook
EE Times on Twitter
EE Times Twitter Feed

Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)
EE Life
Frankenstein's Fix, Teardowns, Sideshows, Design Contests, Reader Content & More
Max Maxfield

How Do You Scale/Score a Scoville?
Max Maxfield
21 comments
Have you ever eaten a really spicy dish that brought tears to your eyes? Well, I just watched an excruciating video on YouTube that makes my eyes water just thinking about it.

Martin Rowe

No 2014 Punkin Chunkin, What Will You Do?
Martin Rowe
Post a comment
American Thanksgiving is next week, and while some people watch (American) football all day, the real competition on TV has become Punkin Chunkin. But there will be no Punkin Chunkin on TV ...

Rich Quinnell

Making the Grade in Industrial Design
Rich Quinnell
9 comments
As every developer knows, there are the paper specifications for a product design, and then there are the real requirements. The paper specs are dry, bland, and rigidly numeric, making ...

Martin Rowe

Book Review: Controlling Radiated Emissions by Design
Martin Rowe
1 Comment
Controlling Radiated Emissions by Design, Third Edition, by Michel Mardiguian. Contributions by Donald L. Sweeney and Roger Swanberg. List price: $89.99 (e-book), $119 (hardcover).