Embedded Systems Conference
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Content tagged with Logic/Interface
posted in January 2012
SGI packs 144 drives in 4U server
News & Analysis  
1/31/2012   1 comment
SGI announced Modular Infinite Storage, its most dense system to date, packing up to four Intel Sandy Bridge processors and 144 2.5-inch hard disk drives in a 4U box.
Intel samples Atom server SoC, snags Xeon win
News & Analysis  
1/31/2012   7 comments
Intel is sampling an Atom-based system-on chip for servers, a company executive said at a press conference announcing a new low-power system using one of its Xeon processors.
DesignCon: Avago, TI hit signal milestones
News & Analysis  
1/30/2012   2 comments
Claiming milestones in speed, reach and power, Avago announced a 25 Gbit/s serdes and Texas Instruments rolled a family 12.5G signal conditioners at DesignCon.
Modularity provides functional, economical tire-pressure monitoring
Design How-To  
1/27/2012   4 comments
A building block approach allows mixing and matching features in affordable tire pressure monitoring system packages.
ST Micro chip controls auto car-door electronics
News & Analysis  
1/26/2012   1 comment
STMicroelectronics has developed a digital control chip to replace the mechanical relay in car-door electronics.
Samplify Systems announces APAX application acceleration technology
Product News  
1/25/2012   Post a comment
Accelerate application performance in data centers and cloud computing, as well as FPGAs and also ASICs/SoCs and application processors used in consumer and mobile devices…
ST-Ericsson outlook bleak as large customer cuts orders
News & Analysis  
1/24/2012   1 comment
Financial results for the fourth quarter at troubled mobile chip joint venture ST-Ericsson NV were bleak with sales down, losses up and the outlook bad due to a loss of orders from a large customer.
Leverage Ethernet to improve passenger safety, comfort, and convenience
Design How-To  
1/19/2012   4 comments
As homes become more digitally sophisticated, consumers are developing higher expectations for connectivity and greater levels of safety and comfort in their home away from home—their vehicle. As a result, in-vehicle electronics are growing in number and complexity. Collision warning, comfort controls, infotainment, and advanced driver assistance are just some of today’s sophisticated and diverse applications generating an increasing need for bandwidth and connectivity within and between in-vehi
New USB-to-SPI protocol converter from Microchip
Product News  
1/16/2012   Post a comment
Provides the simplest, smallest, and most cost-effective way to add USB to existing designs
Cypress Semiconductor CY8CTMA1036 TrueTouch controller
Product News  
1/12/2012   Post a comment
Cypress has launched a single-chip TrueTouch controller based on Gen4 technology for tablets, ultrabooks and laptops.
Capacitive proximity detection spurs automotive convenience features
Design How-To  
1/12/2012   4 comments
A broad range of motion detection depends on an astute application of technology. Moisture and rapid temperature changes are challenges.
Define drain-current conditions when calculating power for multi-core SoCs
Design How-To  
1/5/2012   Post a comment
Automotive electronics for safety applications are increasingly implementing multi-CPU architectures with on-chip redundancy to ensure applications using minimal software overhead. Such redundancy is good for safety, but on the other hand has disadvantages such as higher die area, noise, and power consumption.


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As data rates begin to move beyond 25 Gbps channels, new problems arise. Getting to 50 Gbps channels might not be possible with the traditional NRZ (2-level) signaling. PAM4 lets data rates double with only a small increase in channel bandwidth by sending two bits per symbol. But, it brings new measurement and analysis problems. Signal integrity sage Ransom Stephens will explain how PAM4 differs from NRZ and what to expect in design, measurement, and signal analysis.

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