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Content tagged with Logic/Interface
posted in January 2013
Cisco packs silicon photonics on 3-D ICs
News & Analysis  
1/29/2013   16 comments
Bill Swift, manager of Cisco's transceiver group, said at DesignCon the networking giant is using 2.5-D silicon interposers for silicon photonics.
Kotura preps fab deal amid silicon photonics surge
News & Analysis  
1/25/2013   8 comments
A “large CMOS foundry” will make 100G silicon photonics chips for Kotura that will sample later this year, facing competition from Cisco, Intel and Luxtera.
Diodes expands low-voltage CMOS logic family
Product News  
1/24/2013   Post a comment
Continuing the rapid expansion of its standard logic product line, Diodes has added more package options to its four families of high-speed and advanced high-speed CMOS parts.
Slideshow: Intel Lights 100G Interconnects at Facebook Summit
News & Analysis  
1/17/2013   31 comments
Open Compute Summit saw an engineering kicker for data center servers via samples of 100 Gbit/s silicon photonics interconnect modules.
ARM backers jump on Facebook’s server bandwagon
News & Analysis  
1/16/2013   12 comments
Applied Micro and Calxeda are among ARM server SoC vendors supporting a new CPU-agnostic board spec that is as part of the Facecbook-led Open Compute Project.
ARM friends Facebook at summit
News & Analysis  
1/15/2013   2 comments
ARM SoC vendors Applied Micro and Calxeda will take part in the Facebook-led Open Compute Summit this week, a sign the social networking giant is poised to move beyond the x86.
TI unveils the first integrated analog front end for photometry applications
Product News  
1/11/2013   Post a comment
TI's AFE44xx family integrates all the front end components and associated timing control circuitry of a typical photometry solution.
DesignCon SMEs: Tough Path to 25G+ High-Speed Signals
News & Analysis  
1/11/2013   5 comments
A hornet's nest of issues -- crosstalk, loss, and noise -- are challenges on the road to 40G and beyond.
Semtech transceiver targets healthcare applications
Product News  
1/10/2013   Post a comment
Semtech’s latest device complies with the ETSI category 1 standard with a 6 dB margin.
Five More Tough DesignCon Questions
News & Analysis  
1/4/2013   2 comments
What happens when high speed meets low power design? What’s the outlook for 25G x 4 versions of 100G Ethernet?
Audio codec integrates single microphone noise/echo cancellation
Product News  
1/4/2013   Post a comment
The TC94B24WBG audio codec from Toshiba Electronics Europe is a highly integrated single microphone noise cancellation (NC) and echo cancellation (EC) solution for high-quality voice on smartphones and portable devices.
ST unveils high-speed cable modems for next-gen multimedia, Internet services
Product News  
1/4/2013   Post a comment
First 16x4 capable Cable Modem DOCSIS 3.0 chips reach market quickly after successful September technology demonstration.
Ethernet tackles automotive EMI challenge
Design How-To  
1/2/2013   3 comments
The needs of more recent Ethernet-based automotive applications distinctly from the current applications, and must meet car manufacturers’ EMI limits.


EE Life
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Max Maxfield

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Max Maxfield
55 comments
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EDN Staff

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EDN Staff
11 comments
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Glen Chenier
11 comments
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Larry Desjardin

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Larry Desjardin
45 comments
I'm a big proponent of engineers learning financial basics. Why? Because engineers are making decisions all the time, in multiple ways. Having a good financial understanding guides these ...

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