Design Con 2015
Breaking News
Content tagged with Logic/Interface
posted in January 2013
Cisco packs silicon photonics on 3-D ICs
News & Analysis  
1/29/2013   16 comments
Bill Swift, manager of Cisco's transceiver group, said at DesignCon the networking giant is using 2.5-D silicon interposers for silicon photonics.
Kotura preps fab deal amid silicon photonics surge
News & Analysis  
1/25/2013   8 comments
A “large CMOS foundry” will make 100G silicon photonics chips for Kotura that will sample later this year, facing competition from Cisco, Intel and Luxtera.
Diodes expands low-voltage CMOS logic family
Product News  
1/24/2013   Post a comment
Continuing the rapid expansion of its standard logic product line, Diodes has added more package options to its four families of high-speed and advanced high-speed CMOS parts.
Slideshow: Intel Lights 100G Interconnects at Facebook Summit
News & Analysis  
1/17/2013   31 comments
Open Compute Summit saw an engineering kicker for data center servers via samples of 100 Gbit/s silicon photonics interconnect modules.
ARM backers jump on Facebook’s server bandwagon
News & Analysis  
1/16/2013   11 comments
Applied Micro and Calxeda are among ARM server SoC vendors supporting a new CPU-agnostic board spec that is as part of the Facecbook-led Open Compute Project.
ARM friends Facebook at summit
News & Analysis  
1/15/2013   2 comments
ARM SoC vendors Applied Micro and Calxeda will take part in the Facebook-led Open Compute Summit this week, a sign the social networking giant is poised to move beyond the x86.
TI unveils the first integrated analog front end for photometry applications
Product News  
1/11/2013   Post a comment
TI's AFE44xx family integrates all the front end components and associated timing control circuitry of a typical photometry solution.
DesignCon SMEs: Tough Path to 25G+ High-Speed Signals
News & Analysis  
1/11/2013   5 comments
A hornet's nest of issues -- crosstalk, loss, and noise -- are challenges on the road to 40G and beyond.
Semtech transceiver targets healthcare applications
Product News  
1/10/2013   Post a comment
Semtech’s latest device complies with the ETSI category 1 standard with a 6 dB margin.
Five More Tough DesignCon Questions
News & Analysis  
1/4/2013   2 comments
What happens when high speed meets low power design? What’s the outlook for 25G x 4 versions of 100G Ethernet?
Audio codec integrates single microphone noise/echo cancellation
Product News  
1/4/2013   Post a comment
The TC94B24WBG audio codec from Toshiba Electronics Europe is a highly integrated single microphone noise cancellation (NC) and echo cancellation (EC) solution for high-quality voice on smartphones and portable devices.
ST unveils high-speed cable modems for next-gen multimedia, Internet services
Product News  
1/4/2013   Post a comment
First 16x4 capable Cable Modem DOCSIS 3.0 chips reach market quickly after successful September technology demonstration.
Ethernet tackles automotive EMI challenge
Design How-To  
1/2/2013   3 comments
The needs of more recent Ethernet-based automotive applications distinctly from the current applications, and must meet car manufacturers’ EMI limits.


Most Recent Comments
krisi
 
anon9303122
 
Max The Magnificent
 
elizabethsimon
 
TonyTib
 
antedeluvian
 
DrFPGA
 
RichQ
 
RichQ
Most Recent Messages
11/24/2014
12:24:11 PM
Flash Poll
Top Comments of the Week
Like Us on Facebook
EE Times on Twitter
EE Times Twitter Feed

Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)
EE Life
Frankenstein's Fix, Teardowns, Sideshows, Design Contests, Reader Content & More
Max Maxfield

Want to Present a Paper at ESC Boston 2015?
Max Maxfield
9 comments
I tell you, I need more hours in each day. If I was having any more fun, there would have to be two of me to handle it all. For example, I just heard that I'm going to be both a speaker ...

Martin Rowe

No 2014 Punkin Chunkin, What Will You Do?
Martin Rowe
Post a comment
American Thanksgiving is next week, and while some people watch (American) football all day, the real competition on TV has become Punkin Chunkin. But there will be no Punkin Chunkin on TV ...

Rich Quinnell

Making the Grade in Industrial Design
Rich Quinnell
13 comments
As every developer knows, there are the paper specifications for a product design, and then there are the real requirements. The paper specs are dry, bland, and rigidly numeric, making ...

Martin Rowe

Book Review: Controlling Radiated Emissions by Design
Martin Rowe
1 Comment
Controlling Radiated Emissions by Design, Third Edition, by Michel Mardiguian. Contributions by Donald L. Sweeney and Roger Swanberg. List price: $89.99 (e-book), $119 (hardcover).