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Content tagged with Logic/Interface
posted in October 2001
Transmitting IP Efficiently over the Network
Design How-To  
10/31/2001   Post a comment
The increasing demand for bandwidth to carry information over the Internet is putting a strain on IP providers who offer low-cost IP transport. Michael T. Moore of Cypress Semiconductor discusses the different protocols for transmitting IP across networks and describes a technique—virtual concatenation—for increasing bandwidth-use efficiency.
National's device eases boundary-scan test in systems and reconfiguration in field
News & Analysis  
10/30/2001   Post a comment
SANTA CLARA -- National Semiconductor Corp. here announced availability of system-level testing support along with embedded flash programming and the ability to reconfigure programmable logic in a new 48-pin chip, which conforms to the industry's IEEE 1149.1 standard for boundary-scan test.
Resonext uses ARM core and bus in new 5-GHz wireless LAN chip-set series
News & Analysis  
10/29/2001   Post a comment
SAN JOSE -- Resonext Communications Inc. here today announced it has licensed the ARM922T RISC processor core from ARM Ltd. for use in a new chip-set series targeted at 5-GHz wireless local area networks.
Toshiba taps inSilicon's USB 2.0 core for system-on-chip designs
News & Analysis  
10/22/2001   Post a comment
SAN JOSE --Intellectual property design core provider inSilicon Corp. today announced it has licensed its Universal Serial Bus (USB) 2.0 host communications core to Toshiba Corp.'s semiconductor group. Toshiba plans to use the USB 2.0 technology in complex system-on-chip designs.
Ready or not, here come more powerful networking ICs for trodden market
News & Analysis  
10/22/2001   Post a comment
SAN JOSE -- More than a half dozen chip suppliers this week are expected to launch a new round of network processors and related products at the Network Processors Conference here, but it's unclear if the weakened marketplace is ripe for these next-generation products given the sharp downturn in the communications business, according to analysts.
Intel hopes to leverage processor technology into RF and SiGe
News & Analysis  
10/19/2001   Post a comment
SANTA CLARA, Calif. -- Intel Corp. here gave a rare glimpse of just how the company fans out its most advanced microprocessor fabrication technologies into new markets, including its upcoming foray into the radio-frequency (RF) and silicon-germanium (SiGe) chip sectors. During a press briefing at Intel's headquarters earlier this week, the company outlined its major push into 0.13-micron technology (see Oct. 17 story ). As part o
TI claims to offer first 1.8-volt optimized standard logic series
News & Analysis  
10/19/2001   Post a comment
DALLAS -- Just like the battery-powered toy bunny on TV commercials, standard logic devices seem to keep going and going. To prove that point--and keep its lead in the $2.4 billion logic chip market--Texas Instruments Inc. today claimed to be the first supplier to announced a next-generation standard logic family that's optimized for 1.8-volt systems, but operational at sub-volt levels.
Via plans push for faster DDR memory
News & Analysis  
10/18/2001   Post a comment
Via Technologies plans to launch a version of its double-datarate (DDR) chipset for Pentium 4 PCs that will support 333MHz DRAMs early next year, joining Acer Labs and SiS in backing the higher-speed memory.
Micrel launches 0.6-micron SiGe process for 10-Gbit communications ICs
News & Analysis  
10/17/2001   Post a comment
SAN JOSE -- Micrel Inc. today announced a new 0.6-micron silicon-germanium (SiGe) process, called Asset-2, which the company said will enable it produce ICs for 10-gigabit-per-second and above communications applications.
National's new info-appliance MPU packs enhanced x86 core, power management
News & Analysis  
10/15/2001   Post a comment
SAN JOSE -- Pushing ahead with its information appliances chip strategy, National Semiconductor Corp. this week will officially launch its new Geode GX2 series of integrated processors, based on a re-engineered x86-based core, 0.15-micron process technology, and a new modular architecture with built-in power management circuits.
STMicro's set-top box TV decoder supports hard-disk drives
News & Analysis  
10/15/2001   Post a comment
GENEVA--STMicroelectronics today announced development of a system-on-chip decoder for set-top boxes that integrates support for hard-disk drives in low-cost personal video recorders, known as PVR systems.
Intersil, startup Primarion to develop multi-GHz power management ICs
News & Analysis  
10/15/2001   Post a comment
IRVINE, Calif.--Intersil Corp. here today announced an investment in two-year-old Primarion Corp., a power and communications IC supplier in Arizona, and plans to form an alliance with the startup company in digital power management solutions for PCs, servers, and notebook computers.
Adaptive Silicon rolls out enhanced software for embedding programmable logic in ICs
News & Analysis  
10/15/2001   Post a comment
LOS GATOS, Calif. -- In a move to expand and secure its role as a supplier of embedded programmable logic technology for chip designs, Adaptive Silicon Inc. today announced an enhanced version of its development software, which includes a new graphical user interface, integrated synthesis and rule-checking analysis tools to accelerate the introduction of new ICs.
Tioga to cut 31 jobs in response to weakness in broadband IC market
News & Analysis  
10/12/2001   Post a comment
SAN JOSE--Broadband communications chip supplier Tioga Technologies Ltd. here today announced it was eliminating 31 jobs, or about 31% of its workforce in the U.S. and Israel.
IBM turns to new design, process tricks to make power-miser PowerPC
News & Analysis  
10/12/2001   Post a comment
EAST FISHKILL, NY--IBM Corp. today disclosed development of a new low-power consuming PowerPC processor that employs a mixed bag of IC-fabrication and design technologies to dramatically extend battery life in portable communications and computing products.
The Wireless LAN Rush
Design How-To  
10/12/2001   Post a comment
Everything seems to be going wireless, including the local area network (LAN). A number of approaches to the wireless LAN (WLAN) have emerged, however, creating confusion and uncertainty as to which standard to embrace. Richard A. Quinnell provides an explanation of the structure and application of the current WLAN alternatives.
Qualcomm says 3G chip set shipping, over 50 systems now in development
News & Analysis  
10/11/2001   Post a comment
SAN DIEGO -- Qualcomm Inc. today announced production shipment of its high-end chip set for third-generation (3G) handsets, including features for advanced location capabilities.
X-Fab adds options to 0.6-micron BiCMOS foundry process for high-frequency ICs
News & Analysis  
10/10/2001   Post a comment
SANTA CLARA, Calif. -- During a trade show here today, X-Fab Semiconductor Foundries AG of Germany announced an expansion to its existing 0.6-micron BiCMOS process to include isolated transistors and other new options for high-frequency applications.
Alcatel aims to expand in automotive ICs with standard products, push into U.S.
News & Analysis  
10/10/2001   Post a comment
BRUSSELS, Belgium -- Alcatel Microelectronics here, more broadly know for its telecom and networking chip products, is gearing up to drive deeper into the ever-expanding world of automotive electronics, which is still apparently growing despite the industry's severe downturn.
Implementing Bluetooth in an Embedded Environment
Design How-To  
10/10/2001   Post a comment
Most of us have heard about Bluetooth and how it will replace many cable connections in networks and between various devices. However, few people have an understanding of how Bluetooth really works. Geoff Lawday of Tektronix gets "down and dirty", describing the Bluetooth protocols, qualification procedures, and testing methods.
Samsung to use ARM core with security accelerator in 32-bit smart card chips
News & Analysis  
10/9/2001   Post a comment
CAMBRIDGE, England -- ARM Ltd. here today announced it has licensed 32-bit RISC core technology focused on secure smart card applications to Samsung Electronics Co. in South Korea.
Micronas uses UMC's 0.18-micron process for hybrid analog/digital TV decoder
News & Analysis  
10/8/2001   Post a comment
FREIBURG, Germany -- Micronas GmbH here today announced it will use 0.18-micron foundry services at United Microelectronics Corp. in Taiwan to fabricate a new hybrid analog/digital TV decoder device. The German chip supplier claimed its new MDE9500 is the industry's first hybrid analog/digital television decoder.
Xyron says 'Self-Managed Silicon' will speed any MPU, ASIC, programmable IC
News & Analysis  
10/3/2001   Post a comment
PORTLAND, Ore -- Five-year-old Xyron Corp. here today said it expects to complete a $2.4 million round in financing this month to help it license patented circuit technology for more efficient microprocessors, ASICs, and sub-$50 programmable logic ICs.
NEC licenses 32-bit RISC core to Synopsys for design library use
News & Analysis  
10/2/2001   Post a comment
TOKYO -- NEC Corp. announced it has licensed its 32-bit V850E RISC processor core to Synopsys Inc. for inclusion in a design library of intellectual property (IP) functions. Synopsys said it plans to release the V850E IP core in its DesignWare library during the fourth quarter of 2002.
Motorola prepares 0.18-micron SiGe:C for chip designs in Q1 2002
News & Analysis  
10/2/2001   Post a comment
MINNEAPOLIS -- At a technical conference here today, Motorola Inc. disclosed its next-generation 0.18-micron silicon-germanium:carbon process technology, which is aimed at radio-frequency ICs in wireless handsets and other high-speed devices in gigabit optical communications. The 0.18-micron SiGe:C process will be ready for IC designs in the first quarter of 2002, said Motorola
Chartered accelerates 0.10-micron foundry targets, plans prototyping in late 2002
News & Analysis  
10/1/2001   Post a comment
SAN JOSE -- Singapore's Chartered Semiconductor Manufacturing Pte. Ltd. this week will unveil its accelerated 0.10-micron technology roadmap during a company forum here, promising to begin silicon-foundry prototyping services for the next-generation digital CMOS copper processes in the second half of 2002.


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