Updated: Juniper challenges Cisco on the edge News & Analysis 10/29/2009 Post a comment In a splashy New York City event, Juniper Networks announced its next generation of silicon, systems, software and partnerships around a family of networking products geared to serve businesses and service providers and attack archrival Cisco Systems.
Bluetooth group drops ultrawideband, eyes 60 GHz News & Analysis 10/29/2009 6 comments The Bluetooth Special Interest Group has shelved any plans to use the ultrawideband technology it acquired from the WiMedia Alliance when that group decided in March it would fold, and in its place is conducting due diligence on 60 GHz technology as a possible transport for a future high-rate Bluetooth.
Forum split on future of chip startups News & Analysis 10/21/2009 1 comment A discussion panel organized here by Cadence Design Systems Inc. (San Jose, Calif.) revealed some of the dynamic tension between the fabless chip startup community and their key suppliers the EDA companies and the foundries. Held immediately before an evening meeting intended to put hopeful startups in front of venture capitalists, the round-table aired a number of issues facing startups but drew few conclusions.
EU project set to make chip cards more secure News & Analysis 10/21/2009 Post a comment Three of Europe's leading chip makers, Infineon Technologies AG, ST Microelectronics and NXP Semiconductors Germany GmbH, as well as its largest supplier of chip cards, Giesecke & Devrient GmbH and Gemalto, have joined forces with several other companies and research organizations to develop a high-security chip card platform.
PC maker sees slow road for USB 3.0 News & Analysis 10/21/2009 1 comment
Description: Intel's decision to wait until 2011 to support USB 3.0 in PC chip sets will put mainstream adoption of the interconnect on hold for a year, said a senior technology manager at a top tier PC maker who also called for separate 60 GHz industry groups to unite in the wake of the failure of wireless USB.
STMicro narrows loss on improved sales News & Analysis 10/20/2009 Post a comment STMicroelectronics posted a net loss of $201 million on revenue of $2.28 billion for the third quarter, as sequential gains in revenue across all markets were not enough to push the company to profitability.
Gennum samples single-chip 10G EPON transceiver Product News 10/20/2009 Post a comment Gennum Corp. has started to sample in limited quantities the GN7350, a single-chip 10G EPON transceiver for next generation PON systems that it says will help reduce power and cost while enhancing ONU (optical network unit) performance.
Low power Bluetooth set to be energized News & Analysis 10/20/2009 Post a comment Just over 2.5 billion Bluetooth Low Energy (BLE) chipsets will ship in 2014 in a market that will grow at 78 percent CAGR between 2009 and 2014; but less than a third of those shipments will be for the single mode ICs, according to market research group ABI.
The forecast comes as the low energy Bluetooth community gathers in Munich, Germany for its first international technology conference at which, for instance Texas Instruments will showcase an ultra low-power coin cell demo using the upcom
Researcher paves alternate path for hard drives News & Analysis 10/19/2009 Post a comment Carnegie Mellon University professor Jimmy Jian-Gang Zhu is developing a microwave-assisted magnetic recording technique he believes will pack three terabits of data in a square inch of a hard disk, opening a third path in an ongoing debate about the future of the hard drive.
NXP passes Chinese ePassport IC test News & Analysis 10/19/2009 Post a comment NXP Semiconductors (Eindhoven, the Netherlands), one of the leading providers of secure ICs for global e-passport providers, has won a coveted deal to supply its SmartMX security chips to power the Chinese government's first ePassport scheme.
SMIC stretches 45-nm process to 40-nm, 55-nm News & Analysis 10/16/2009 Post a comment Foundry chipmaker Semiconductor Manufacturing International Corp., which is fighting to catch up with the leading-edge semiconductor technology pace set by its rivals, has said it plans to extend its 45-nm bulk CMOS to 40-nm and 55-nm geometries.
Acer targeting Dell's No2 spot in PCs News & Analysis 10/14/2009 Post a comment There will only be four to five players in the PC business in a few years and consolidation will continue apace until there is an even bigger shakeout, Gianfranco Lanci, CEO and president of Acer Inc. said at the Taiwanese group's annual conference here.
Smart touch by Avago for touch-screens Product News 10/13/2009 Post a comment With touchscreen technology becoming a major differentiator in the competitive smartphones and PMP markets, Avago Technologies has come up with an interface that the company suggests will do away with the problematic ghost points displayed by many of the screens.
ARC, Virage Logic "a done deal" says CFO News & Analysis 10/12/2009 Post a comment Shares in ARC International plc (St Albans, England), the specialist licensor of configurable processor cores, are set to be delisted from the London Stock Exchange early next month, following Virage
Analysis: NXP's Clemmer keeps cutting News & Analysis 10/12/2009 Post a comment How much smaller can NXP go in an industry where scale and critical mass has always been significant? How much more can be chopped off the once-great company before the whole thing flies apart?
NXP to transfer CMOS IP, staff to Virage Logic News & Analysis 10/12/2009 1 comment Dutch chip company NXP BV (Eindhoven, The Netherlands) has agreed to transfer part of its advanced CMOS intellectual property (IP) rights, 160 staff and certain engineering equipment to Virage Logic Corp. (Fremont, Calif.).
Rodgers banks on PSoCs to drive growth at Cypress News & Analysis 10/9/2009 Post a comment Cypress Semiconductor's groundbreaking PSoC devices and derivatives are already driving the company's growth, according to President and CEO T.J. Rodgers. Now Cypress has upped the ante with more powerful PSoCs that can tap into a much larger total market.
Qualcomm joins 'net neutrality' debate News & Analysis 10/9/2009 Post a comment The former and current CEOs of Qualcomm Inc. (San Diego, Calif.) -- Irwin and Paul Jacobs, respectively -- took the stage at the CTIA Wireless IT & Entertainment 2009 being held on their home turf, and entered the net neutrality debate in the U.S. with Paul Jacobs calling for heavy data users to be discriminated against as wireless networks reach capacity.
VT Silicon develops 4G amp, pursues integrated 'front-end' News & Analysis 10/9/2009 Post a comment After 30 months of privately-funded development fabless VT Silicon Inc. (Atlanta, Georgia) has announced a silicon-based power amplifier capable of meeting the operating requirements of 4G wireless data transmissions. The company is planning to launch an integrated RF front-end for WiMax and LTE communications.
SiGe experts push CMOS envelope for Light Peak transceivers News & Analysis 10/8/2009 Post a comment Silicon germanium expert Ensphere Solutions Inc. (Santa Clara, Calif.) cranked up its complementary metal oxide semiconductor (CMOS) expertise to design a 10-Gbit/second, dual-channel optical-to-electrical and electrical-to-optical transceiver chip for Intel's Light Peak interconnection topology.
UMC to take Singapore fab to 40-nm manufacturing News & Analysis 10/8/2009 Post a comment Leading foundry United Microelectronics Corp. (Hsinchu, Taiwan) has said that its Fab 12i in Singapore has begun an expansion project to increase capacity and enable the 300-mm fab to use 45-nm and 40-nm manufacturing processes.
Americas region continues to lead semiconductor recovery News & Analysis 10/7/2009 Post a comment The Americas region achieved actual sales of $3.22 billion in August 2009, up 7.6 percent from the same month a year before, according to "actual" data from the World Semiconductor Trade Statistics organization. The Americas, which is dominated in terms of sales by the U.S., remains the only region able to demonstrate monthly sales growth year-on-year.
August 'actual' chip sales hint at double dip News & Analysis 10/7/2009 Post a comment Despite the optimistic commentaries heaped upon the global sales of semiconductors in August by the Semiconductor Industry Association and others, the months' sales returns show the gap between sales this year and last year increasing. The Americas is the only region bucking this trend.
Millimeter-wave startup raises $10 million in Series A News & Analysis 10/7/2009 Post a comment Peraso Technologies Inc. (Toronto, Ontario), a fabless semiconductor company focused on the development of multi-gigabit millimeter-wave transceivers, has secured CDN$10 million (about $9.5 million) in Series A funding. The investment group comprises Celtic House Venture Partners, iNovia Capital and VentureLink Funds.
SiBeam readies 2nd gen Wireless HD chip Product News 10/6/2009 Post a comment SiBeam, a pioneer in 60GHz chips for wireless video networking, is demonstrating its second generation chipsets based on the WirelessHD specification at this week's CEATEC Japan exhibition.
D2S, Advantest speed up e-beam lithography News & Analysis 10/2/2009 Post a comment The eBeam Initiative, a forum for the promotion of chip manufacturing using e-beam lithography, has said that two of its leading members Direct2Silicon Inc. (San Jose, Calif.) and Advantest Corp. (Tokyo, Japan), have collaborated to enhance throughput.
August averaged chip sales show global growth, says SIA News & Analysis 10/2/2009 Post a comment The three-month average of global sales of semiconductors rose to $19.06 billion in August, July, up 5.0 percent from $18.15 billion in July and down 16.1 percent from $22.71 billion in August 2008, according to the Semiconductor Industry Association (SIA).
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.