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posted in October 2009
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V-shaped recovery gathers pace, says IC Insights
News & Analysis  
10/2/2009   Post a comment
The 2009 IC market, measured on a quarterly basis and especially with regard to unit volume shipments, has displayed a classic "V-shaped" recovery, according to market research organization IC Insights Inc. (Scottsdale, Ariz.).
IPtronics, Avago chip in to Intel's optical interconnect
News & Analysis  
10/1/2009   Post a comment
Through a collaborative effort with Intel and other industry partners, IPtronics A/S (Roskilde, Denmark) has developed silicon for Light Peak, a 10-Gbit/s optical interconnect system. Avago Technologies Inc. (San Jose, Calif.) has also developed an embedded "optical engine" for Light Peak.
IMEC tapes out Etna 3-D stacking chip
News & Analysis  
10/1/2009   Post a comment
The IMEC research center (Leuven, Belgium) and its 3-D integration partners have taped-out Etna, a 3-D chip that integrates a standard DRAM chip on top of a logic IC. The 3-D stack consists of a 25-micron thick logic die on top of which a commercial DRAM is stacked using through-silicon vias (TSVs) and micro-bumps.
National Semiconductor introduces 24-bit color SerDes for infotainment displays
Product News  
10/1/2009   Post a comment
National Semiconductor claims the industry’s first serializer and deserializer (SerDes) chipsets capable of driving high-resolution, 24-bit color flat-panel displays with a 65 MHz clock.
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As data rates begin to move beyond 25 Gbps channels, new problems arise. Getting to 50 Gbps channels might not be possible with the traditional NRZ (2-level) signaling. PAM4 lets data rates double with only a small increase in channel bandwidth by sending two bits per symbol. But, it brings new measurement and analysis problems. Signal integrity sage Ransom Stephens will explain how PAM4 differs from NRZ and what to expect in design, measurement, and signal analysis.

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