V-shaped recovery gathers pace, says IC Insights News & Analysis 10/2/2009 Post a comment The 2009 IC market, measured on a quarterly basis and especially with regard to unit volume shipments, has displayed a classic "V-shaped" recovery, according to market research organization IC Insights Inc. (Scottsdale, Ariz.).
IPtronics, Avago chip in to Intel's optical interconnect News & Analysis 10/1/2009 Post a comment Through a collaborative effort with Intel and other industry partners, IPtronics A/S (Roskilde, Denmark) has developed silicon for Light Peak, a 10-Gbit/s optical interconnect system. Avago Technologies Inc. (San Jose, Calif.) has also developed an embedded "optical engine" for Light Peak.
IMEC tapes out Etna 3-D stacking chip News & Analysis 10/1/2009 Post a comment The IMEC research center (Leuven, Belgium) and its 3-D integration partners have taped-out Etna, a 3-D chip that integrates a standard DRAM chip on top of a logic IC. The 3-D stack consists of a 25-micron thick logic die on top of which a commercial DRAM is stacked using through-silicon vias (TSVs) and micro-bumps.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.