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Content tagged with Logic/Interface
posted in October 2009
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V-shaped recovery gathers pace, says IC Insights
News & Analysis  
10/2/2009   Post a comment
The 2009 IC market, measured on a quarterly basis and especially with regard to unit volume shipments, has displayed a classic "V-shaped" recovery, according to market research organization IC Insights Inc. (Scottsdale, Ariz.).
IPtronics, Avago chip in to Intel's optical interconnect
News & Analysis  
10/1/2009   Post a comment
Through a collaborative effort with Intel and other industry partners, IPtronics A/S (Roskilde, Denmark) has developed silicon for Light Peak, a 10-Gbit/s optical interconnect system. Avago Technologies Inc. (San Jose, Calif.) has also developed an embedded "optical engine" for Light Peak.
IMEC tapes out Etna 3-D stacking chip
News & Analysis  
10/1/2009   Post a comment
The IMEC research center (Leuven, Belgium) and its 3-D integration partners have taped-out Etna, a 3-D chip that integrates a standard DRAM chip on top of a logic IC. The 3-D stack consists of a 25-micron thick logic die on top of which a commercial DRAM is stacked using through-silicon vias (TSVs) and micro-bumps.
National Semiconductor introduces 24-bit color SerDes for infotainment displays
Product News  
10/1/2009   Post a comment
National Semiconductor claims the industry’s first serializer and deserializer (SerDes) chipsets capable of driving high-resolution, 24-bit color flat-panel displays with a 65 MHz clock.
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