V-shaped recovery gathers pace, says IC Insights News & Analysis 10/2/2009 Post a comment The 2009 IC market, measured on a quarterly basis and especially with regard to unit volume shipments, has displayed a classic "V-shaped" recovery, according to market research organization IC Insights Inc. (Scottsdale, Ariz.).
IPtronics, Avago chip in to Intel's optical interconnect News & Analysis 10/1/2009 Post a comment Through a collaborative effort with Intel and other industry partners, IPtronics A/S (Roskilde, Denmark) has developed silicon for Light Peak, a 10-Gbit/s optical interconnect system. Avago Technologies Inc. (San Jose, Calif.) has also developed an embedded "optical engine" for Light Peak.
IMEC tapes out Etna 3-D stacking chip News & Analysis 10/1/2009 Post a comment The IMEC research center (Leuven, Belgium) and its 3-D integration partners have taped-out Etna, a 3-D chip that integrates a standard DRAM chip on top of a logic IC. The 3-D stack consists of a 25-micron thick logic die on top of which a commercial DRAM is stacked using through-silicon vias (TSVs) and micro-bumps.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.