Vitesse launches InP-based ICs for 10- and 40-Gbit networks News & Analysis 11/26/2001 Post a comment CAMARILLO, Calif.--Vitesse Semiconductor Corp. today announced availability of its first indium-phosphide (InP) circuits for OC-192 and OC-768 communications systems, which operate at 10 and 40 gigabits per second, respectively. The InP process, called VIP-1, produces 0.8-micron feature sizes on 4-inch diameter wafers.
STMicro, HP roll out test chip with customizable VLIW core for multimedia ICs News & Analysis 11/19/2001 Post a comment GENEVA -- STMicroelectronics today described the first very-long instruction word (VLIW) microprocessor core resulting from an ongoing partnership with Hewlett-Packard Co. that began in 1998. The scaleable, customizable core has been designed for embedded use in multimedia system-on-chip (SoC) designs, with the ability to execute up to four instructions per clock cycle, said the company.
On Semi jumps into high-performance bus switch segment News & Analysis 11/14/2001 Post a comment PHOENIX--On Semiconductor Corp. today announced its entry into the high-performance bus switch market with the rollout of five CMOS devices aimed at serving multiple processors with shared memory systems, high-speed bus structures, notebook computer docking stations, high-speed memory, and relay replacement applications.
Sony, Infineon collaborate in contactless chip-card technology News & Analysis 11/13/2001 Post a comment MUNICH--Infineon Technologies AG here and Sony Corp. in Japan today announced plans to jointly develop secure ICs for contactless chip-card systems, which are used to authenticate and identify individuals in a range of applications, including online banking, electronic fares for public transportation, and security systems.
Cellular base station IC sales to regain momentum after 2002, says new report News & Analysis 11/5/2001 Post a comment OYSTER BAY, N.Y.-- Integrated circuit revenues for cellular-phone base stations will remain relatively flat at around $380 million in the next year or so, but IC sales are expected to gain momentum after 2003, when carriers move to next-generation wireless services and increase the volume of their networks, according to a new forecast from Allied Business Intelligence Inc. here.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.