Trident Microsystems appoints president News & Analysis 11/30/2005 Post a comment Video IC supplier Trident Microsystems Inc. has appointed Jung-Herng Chang, currently president of Trident Technologies Inc. (TTI), its new president, effective immediately. Frank Lin will remain as the company’s chairman and chief executive
Zoran, Thomson team on digital TV reference design Product News 11/28/2005 Post a comment Zoran Corp. and the Thomson Tuner Group have developed a digital-to-analog reference design that enables CRT makers to integrate, decode, and display digital television feeds compliant with the A-74 standard set by the ATSC committee.
Commentary: Is Infineon going fabless? News & Analysis 11/17/2005 Post a comment Infineon Technologies’ decision to split its DRAM and logic businesses and seek an IPO for its memory business could foreshadow the German chip maker's move to a fabless model for CMOS manufacturing below the 90-nm node.
Chip bridges legacy PCI devices to PCI Express-based applications Product News 11/16/2005 Post a comment Texas Instruments' XIO2000 is a single-function PCIe-to-PCI translation bridge that connects two different interfaces. It allows designers to bridge legacy PCI devices to the latest PCIe applications used in PCs, docking stations, ExpressCard, split-chassis systems and test and measurement instruments.
Silterra, Essensium target European market News & Analysis 11/15/2005 Post a comment Malaysian foundry Silterra and Belgium-based design company Essensium announced a new partnership that will see the two companies jointly develop turnkey solutions for European semiconductor customers.
Spansion to extend flash range with logic IP deals News & Analysis 11/15/2005 Post a comment Spansion, the flash memory venture between AMD and Fujitsu, is planning to collaborate with ‘strategic partners’ to integrate logic blocks into its MirrorBit technology that would form the basis of a new line of products dubbed Logic on Flash.
Design tools eye nanoscale realm News & Analysis 11/14/2005 Post a comment As the CAD community grapples with emerging technologies like silicon nanowires, biofluidic microchips and DNA self-assembly, one major question emerges: How are we going to design this stuff?
SerDes chipsets communicate over single link Product News 11/9/2005 Post a comment Two low-current differential signaling (LCDS) serializer/deserializer (SerDes) chipsets from Maxim Integrated Products are designed to communicate over a single twisted pair or differential line, helping to simplify design, reduce cost, and improve EMI.
Cambridge, Novaled claim OLED advances News & Analysis 11/4/2005 Post a comment Two companies active in organic-light-emitting-diode (OLED) technology, Novaled GmbH and Cambridge Display Technology, have announced advances in OLED efficiency and manufacturing, respectively.
STATS ChipPAC opens wafer bump plant in China News & Analysis 11/3/2005 Post a comment Singapore-based semiconductor test and packaging services supplier STATS ChipPAC has announced it will open a 200-mm wafer bumping operation in China specializing in gold bump services for the liquid crystal display (LCD) driver market.
Qualcomm sales meet guidance, earnings slip News & Analysis 11/2/2005 Post a comment CDMA technology supplier Qualcomm Inc. posted earnings of $538 million, or 32 cents per share on sales of $1.56 billion in its fourth fiscal 2005 quarter ended Sept. 25, compared to earnings of $560 million, or 33 cents per share on sales of $1.36 billion in the previous quarter.
Renesas to license SMSC's IP for digital content News & Analysis 11/2/2005 Post a comment SMSC and Renesas Technology Corp. have reached a licensing agreement enabling Renesas to incorporate SMSC technology providing Digital Transmission Content Protection (DTCP) for DVD audio and video, including copy-protected DVDs.
IXYS reports higher sales, earnings News & Analysis 11/1/2005 Post a comment Power and RF Semiconductor supplier IXYS Corp. posted earnings of $5.5 million, or 16 cents per share on sales of $63.4 million in the second 2006 fiscal quarter ended Sept. 30, compared to $3.8 million, or 11 cents per share on sales of $61.4 million in the year-ago fiscal quarter.
Samsung inks codec agreement with Vimio News & Analysis 11/1/2005 Post a comment Ireland-based Vimio plc, a developer of mobile content distribution software, has signed an agreement to license its audio and video codecs to Samsung Electronics Co. Ltd. for use in mobile phones.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.