Design Con 2015
Breaking News
Content tagged with Logic/Interface
posted in November 2011
PCI Express 4.0 drives to 16 GT/second
News & Analysis  
11/29/2011   3 comments
PCI Express will double its data rates to support up to 16 GTransfers/second in an upcoming version 4.0 of the spec due by the end of 2014.
Microchip MCP9808 silicon temperature sensor
Product News  
11/22/2011   1 comment
Microchip's latest sensor provides ± 0.5 degrees accuracy and 12-bit resolution from -20 to +100 degrees Celsius.
Crocus signs up smartcard maker for MLU
News & Analysis  
11/21/2011   Post a comment
Crocus Technology Inc., a vendor magnetic of RAMs, has announced that Morpho, a division of Safran Group and a supplier identification, detection and e-document technology, plans to develop smartcards based on Crocus' Magnetic-Logic-Unit technology.
Reconfigurable LIN switch slave eases communication of switch modules and I/O extensions
Product News  
11/19/2011   Post a comment
Integrated LIN slave on a single chip includes physical layer LIN transceiver, LIN controller, voltage regulator, and application controller along with supporting functions ADC, PWM generation, and high voltage capable I/Os.
austriamicrosystems released the AS8222 FlexRay transceiver
Product News  
11/18/2011   Post a comment
austriamicrosystems' latest FlexRay transceiver will be shipped in bare dice and an SSOP20 package for critical powertrain applications.
SerDes chip enables integration of multiple video streams
Design How-To  
11/18/2011   2 comments
In a parking assist system example, single twisted-pair communication and an interface chipset provide a bidirectional control channel with a minimum latency and general purpose I/O functionality, enabling seamless frame-synchronous processing of individual video data streams.
Spain, Nvidia plan ARM-based supercomputer
News & Analysis  
11/14/2011   7 comments
The Barcelona Supercomputing Center (BSC) has announced it will develop a hybrid supercomputer based on Nvidia Corp.'s Tegra ARM CPUs and the firm's CUDA-supporting Tesla GPUs, with hopes of reaching exascale performance.
TSMC reports strong October sales bounce
News & Analysis  
11/10/2011   1 comment
chipmaker Taiwan Semiconductor Manufacturing Co. Ltd. has posted a significant sequential sales increase in October, providing more evidence of an upturn in the semiconductor market.
Combine power feed and data link via cable for remote peripherals
Design How-To  
11/10/2011   6 comments
It is possible to combine power distribution and high-speed data transmission by sharing a shielded twisted pair cable. A power feed network is necessary at both ends for power injection and extraction. By properly designing this network, and managing power supply switching noise, performance degradation is minimized.
IEEE to define 25 Gbit optical interfaces
News & Analysis  
11/8/2011   1 comment
The IEEE has kicked off a study group to define 25 Gbit/second optical interfaces for next-generation 100 Gbit Ethernet networks replacing today's 10Gbit/s building blocks.
Parade Technologies PS8711, PS8722 and PS8725 redrivers
Product News  
11/3/2011   1 comment
Parade's latest additions to its USB 3.0 repeater/redriver IC product line are packaged in a tiny 3x3mm TQFN.


Flash Poll
Top Comments of the Week
Like Us on Facebook
EE Times on Twitter
EE Times Twitter Feed

Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)
EE Life
Frankenstein's Fix, Teardowns, Sideshows, Design Contests, Reader Content & More
Max Maxfield

Want to Present a Paper at ESC Boston 2015?
Max Maxfield
8 comments
I tell you, I need more hours in each day. If I was having any more fun, there would have to be two of me to handle it all. For example, I just heard that I'm going to be both a speaker ...

Martin Rowe

No 2014 Punkin Chunkin, What Will You Do?
Martin Rowe
Post a comment
American Thanksgiving is next week, and while some people watch (American) football all day, the real competition on TV has become Punkin Chunkin. But there will be no Punkin Chunkin on TV ...

Rich Quinnell

Making the Grade in Industrial Design
Rich Quinnell
12 comments
As every developer knows, there are the paper specifications for a product design, and then there are the real requirements. The paper specs are dry, bland, and rigidly numeric, making ...

Martin Rowe

Book Review: Controlling Radiated Emissions by Design
Martin Rowe
1 Comment
Controlling Radiated Emissions by Design, Third Edition, by Michel Mardiguian. Contributions by Donald L. Sweeney and Roger Swanberg. List price: $89.99 (e-book), $119 (hardcover).