Embedded Systems Conference
Breaking News
Content tagged with Logic/Interface
posted in November 2013
3D Stacks Need Lower Costs, Broader Backing
Blog  
11/26/2013   13 comments
A recent gathering at Georgia Tech showed the emerging technology for 3D chip stacking needs to come down in costs and get broader backing from designers and managers.
Flash Shortages Drive SSD Shifts
News & Analysis  
11/26/2013   13 comments
A tighter supply of NAND flash has spiked chip prices and is driving consolidation among dozens of independent solid-state drive makers.
China Investigates Qualcomm
News & Analysis  
11/25/2013   19 comments
Qualcomm Incorporated Monday disclosed that China's National Development and Reform Commission, which regulates prices, has begun investigating Qualcomm regarding compliance with the Chinese Anti-Monopoly Law.
Spansion Exec Reassures Fujitsu Customers
News & Analysis  
11/25/2013   9 comments
The most tangible technology advances, after Spansion acquired Fujitsu Semiconductor's MCU/analog business, will come from the adoption of Spansion’s proprietary eCT technology in embedded MCUs -- to be released in 2015.
IoT Challenge Sparks Ongoing Discussion
News & Analysis  
11/25/2013   Post a comment
Join an ongoing conversation about the Smart America Challenge and what lies ahead for the Internet of Things and cyber-physical systems.
IoT on Fingertip Appears at EE Live!
News & Analysis  
11/21/2013   13 comments
After helping pioneer the Internet of Things, Berkeley's Kris Pister wants to put an entire node (including power source) on a chip.
Qualcomm Ups the Mobile Ante
Blog  
11/21/2013   10 comments
Mobile processor leader Qualcomm used its analyst day to rev its product line, upping the ante on competitors angling for the hot smartphone market.
Embedded Vision: Who's Watching Whom & Why
Blog  
11/18/2013   24 comments
Imaging technology is no longer just about the never-ending megapixel race among CMOS image sensors. As market focus shifts to "vision" processing, the industry has drawn a new battle line.
Chat With Presidential Fellows on IoT
Blog  
11/18/2013   8 comments
This Friday EE Times is hosting a Twitter chat on the Internet of Things with two veteran entrepreneurs and US Presidential Innovation Fellows behind the Smart America Challenge.
Industrial Internet Group Debuts Soon
News & Analysis  
11/15/2013   12 comments
A 10-company US consortium to set standards for the Industrial Internet aims to debut in January, said a GE executive driving a business in the area.
iOS Oscilloscope Gets a Second Channel
News & Analysis  
11/14/2013   15 comments
Oscium's iMSO-204 adds a second analog channel with increased memory and sample rate over its predecessor.
AMD Secures PC Notebooks, Tablets With ARM
News & Analysis  
11/13/2013   8 comments
AMD announced two new mobile x86 processors using a new ARM Cortex-A5 security block, including a 2W tablet SoC.
AMD Faces Long Road to HSA Success
News & Analysis  
11/13/2013   11 comments
AMD has the right vision for creating a standard for SoCs blending GPUs, CPUs, and other cores, but there's plenty of work ahead to deliver on it.
AMD Tips Client, Server Chips for HSA
News & Analysis  
11/11/2013   8 comments
AMD announced client and server processors shipping in 2014 will be its first using technology from the HSA Foundation for mixed-core SoCs.
Digital Medicine Will Reshape Hospitals
Blog  
11/11/2013   22 comments
Semiconductors could power personal, virtual healthcare that reshape hospitals, said a keynoter at the chip industry's annual gala.
Apple, Samsung, Foundries Key to 3D ICs
News & Analysis  
11/8/2013   21 comments
The Apple A7 in the iPhone 5s is a "poor man's 3D IC" said one veteran at a panel discussion that shed light on the state and future of chip stacks.
Cisco May Spend $1B in SDN Drive
News & Analysis  
11/6/2013   12 comments
Cisco could spend nearly a billion dollars if the new software-defined networking products from Insieme, its latest spin-in startup, do well.
September Semiconductor Sales Set New Records
News & Analysis  
11/5/2013   11 comments
The SIA has released its global semiconductor sales statistics, showing a record-breaking month.


Radio
LATEST ARCHIVED BROADCAST
As data rates begin to move beyond 25 Gbps channels, new problems arise. Getting to 50 Gbps channels might not be possible with the traditional NRZ (2-level) signaling. PAM4 lets data rates double with only a small increase in channel bandwidth by sending two bits per symbol. But, it brings new measurement and analysis problems. Signal integrity sage Ransom Stephens will explain how PAM4 differs from NRZ and what to expect in design, measurement, and signal analysis.

Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)
Like Us on Facebook
Special Video Section
The LTC®6363 is a low power, low noise, fully differential ...
Vincent Ching, applications engineer at Avago Technologies, ...
The LT®6375 is a unity-gain difference amplifier which ...
The LTC®4015 is a complete synchronous buck controller/ ...
10:35
The LTC®2983 measures a wide variety of temperature sensors ...
The LTC®3886 is a dual PolyPhase DC/DC synchronous ...
The LTC®2348-18 is an 18-bit, low noise 8-channel ...
The LT®3042 is a high performance low dropout linear ...
Chwan-Jye Foo (C.J Foo), product marketing manager for ...
The LT®3752/LT3752-1 are current mode PWM controllers ...
LED lighting is an important feature in today’s and future ...
Active balancing of series connected battery stacks exists ...
After a four-year absence, Infineon returns to Mobile World ...
A laptop’s 65-watt adapter can be made 6 times smaller and ...
An industry network should have device and data security at ...
The LTC2975 is a four-channel PMBus Power System Manager ...
In this video, a new high speed CMOS output comparator ...
The LT8640 is a 42V, 5A synchronous step-down regulator ...
The LTC2000 high-speed DAC has low noise and excellent ...
How do you protect the load and ensure output continues to ...