Company uses MIPS to "Ramp" toward DSL platforms News & Analysis 12/27/1999 Post a comment Ramp Networks Inc., a company with nearly five years' experience developing broadband access systems for small-office/home-office markets, will make a break with its original ISDN WebRamp routers, moving to a platform optimized for Digital Subscriber Line service.
Hitachi, UMC eye logic at 300-mm joint venture fab News & Analysis 12/27/1999 Post a comment Hitachi Ltd. and Taiwan's United Microelectronics Corp. today (12/27) announced plans for a joint venture in 300-mm wafer processing, which will be based in Japan and begin manufacturing operations in early 2001. The unnamed joint-venture company will be located in Hitachi's N3 building in Hitachinaka, and it is scheduled to begin pilot runs of 300-mm wafers in January 2001.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.