Company uses MIPS to "Ramp" toward DSL platforms News & Analysis 12/27/1999 Post a comment Ramp Networks Inc., a company with nearly five years' experience developing broadband access systems for small-office/home-office markets, will make a break with its original ISDN WebRamp routers, moving to a platform optimized for Digital Subscriber Line service.
Hitachi, UMC eye logic at 300-mm joint venture fab News & Analysis 12/27/1999 Post a comment Hitachi Ltd. and Taiwan's United Microelectronics Corp. today (12/27) announced plans for a joint venture in 300-mm wafer processing, which will be based in Japan and begin manufacturing operations in early 2001. The unnamed joint-venture company will be located in Hitachi's N3 building in Hitachinaka, and it is scheduled to begin pilot runs of 300-mm wafers in January 2001.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.